JPH02155290A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH02155290A JPH02155290A JP63309210A JP30921088A JPH02155290A JP H02155290 A JPH02155290 A JP H02155290A JP 63309210 A JP63309210 A JP 63309210A JP 30921088 A JP30921088 A JP 30921088A JP H02155290 A JPH02155290 A JP H02155290A
- Authority
- JP
- Japan
- Prior art keywords
- low
- insulating material
- printed wiring
- circuits
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、同−検器の中で高周波と、低周波豊たは中間
周波を使用する電子機ｇ％に使用して好適々プリント配
線基板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is suitable for use in printed wiring in electronic equipment that uses high frequencies, low frequencies, or intermediate frequencies in the same detector. Regarding the board.
従来から絶縁基板に配線パターンを印刷形成すると共に
各種電子部品を搭載してなるプリント配線基板の前記絶
縁基板としては取シ扱う周波数によって誘電率（６）の
異なった絶縁材が使用される。Conventionally, insulating materials having different dielectric constants (6) have been used as the insulating substrates of printed wiring boards on which wiring patterns are printed and various electronic components are mounted.
すなわち、一般の電子機器に使用される低、中間周波用
プリント配線基板の場合は、比較的誘電率Ｃの大きい絶
縁材、例えばガラス、エポキシ樹脂（ε＝４．７）が使
用されるのに対して、高周波用プリント配線基板の場合
はガラス、エポキシ樹脂では高周波電流を通し絶縁体と
しての機絆を十分果さないため、もつと誘電率ε（＃＝
２．５程度）の程度絶縁材、例えばポリスチレン、４弗
化エチレン等を使用している。このような絶縁基板の材
質が異なる２種類のプリント配線基板は別々に設計、製
作され、一つの電子機器内に組込まれる場合は第２図に
示すように近接して収納配置され、両者間のインターフ
ェースを図っている。々お、第２図〜第４図において、
１は高周波回路用プリント配線基板、２は低、中間周波
回路用プリント配線基板、３は４弗化エチレン（ε＝２
．５）から々る低誘電率絶縁材、４はガラス・エポキシ
樹脂からなる絶縁材、５は導電箔、６はスルーホール、
７はスルーホール導体（半田メツキ層）である。In other words, in the case of low- and intermediate-frequency printed wiring boards used in general electronic equipment, insulating materials with a relatively large dielectric constant C, such as glass and epoxy resin (ε=4.7), are used. On the other hand, in the case of high-frequency printed wiring boards, glass and epoxy resin do not function well as insulators through high-frequency current, so they have a dielectric constant ε (#=
2.5), an insulating material such as polystyrene, tetrafluoroethylene, etc. is used. These two types of printed wiring boards with different insulating substrate materials are designed and manufactured separately, and when they are incorporated into a single electronic device, they are housed close together as shown in Figure 2, and there is no connection between them. I'm trying to create an interface. In Figures 2 to 4,
1 is a printed wiring board for high frequency circuits, 2 is a printed wiring board for low and intermediate frequency circuits, 3 is tetrafluoroethylene (ε=2
．． 5) Low dielectric constant insulating material, 4 is an insulating material made of glass and epoxy resin, 5 is a conductive foil, 6 is a through hole,
7 is a through-hole conductor (solder plating layer).
ところで、従来は高周波回路用プリント配線基板１と、
低、中間周波回路用プリント配線基板２を別々に設計、
製作しなければ々らないため、その製作が面倒で、また
部品の実装も別々に行う必要があシ、作業工数が多くな
るという問題があった。さらに、高周波回路部と、低、
中間周波回路部の設置スペースを確保し危ければならず
、小型化の障害になる２両回路部を近接配置しすぎると
、互いに干渉し合って誤動作するため電磁シールド対策
を講じる必要があるなどの問題もあった。By the way, conventionally, a printed wiring board 1 for a high frequency circuit,
Design printed wiring boards 2 for low and intermediate frequency circuits separately,
Since it has to be manufactured, it is troublesome to manufacture it, and it is also necessary to mount the parts separately, which increases the number of man-hours. In addition, the high frequency circuit section, low
It is necessary to secure installation space for the intermediate frequency circuit section, and it is necessary to take electromagnetic shielding measures because if the two circuit sections are placed too close together, which is an obstacle to miniaturization, they will interfere with each other and malfunction. There was also a problem.
そこで、本発明は上述したような問題点を解決し、誘電
率の異なった２種類の絶縁材を積層して絶縁基板を形成
することにより高周波回路部と低、中間周波回路部とを
一つの基板にまとめることができるプリント配線基板を
提供することを目的とするものである。Therefore, the present invention solves the above-mentioned problems by laminating two types of insulating materials with different dielectric constants to form an insulating substrate, thereby combining a high frequency circuit section and a low and intermediate frequency circuit section into one. The object is to provide a printed wiring board that can be assembled into a board.
本発明は上記目的を達成するために、絶縁基板を、シー
ルド層を介して積層配置された誘電率の異なる高周波回
路用絶縁材と、低、中間周波回路用絶縁材とで形成した
ものである。In order to achieve the above object, the present invention has an insulating substrate formed of insulating materials for high frequency circuits and insulating materials for low and intermediate frequency circuits having different dielectric constants, which are laminated with a shield layer interposed therebetween. .
本発明において絶縁基板は誘電率の異なる２種類の絶縁
材で形成され、低誘電率絶縁材が高周波回路用絶縁基板
として、高誘電率絶縁材が低、中間周波回路用絶縁基板
としてそれぞれ使用される。In the present invention, the insulating substrate is formed of two types of insulating materials with different dielectric constants, and the low-permittivity insulating material is used as an insulating substrate for high-frequency circuits, and the high-permittivity insulating material is used as an insulating substrate for low and intermediate frequency circuits. Ru.
両絶縁材間に介在されたシールド層は、高周波回路と、
低、中間周波回路とが互いに干渉するのを防止する。The shield layer interposed between both insulating materials is a high-frequency circuit and
Prevent low and intermediate frequency circuits from interfering with each other.
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第１図は本発明に係るプリント配線基板の一実施例を示
す要部断面図である。同図において、プリント配線基板
１０は、４弗化エチレン等の低誘電率（ε＝２．５程度
）絶程度３と、ガラス・エポキシ樹脂等の高誘電率（ε
＝４．７程度）絶程度４とをアルミニワム等からなるシ
ールド層１１を介して積層配置し、かつこれらを接着剤
により一体的に接合して形成した絶縁基板１２を備え、
低誘電率絶縁材３に高周波回路を、高置１率絶縁材４に
低周波もしくは中間周波回路をそれぞれ形成し、さらに
これら両回踏部以外の絶縁基板１２０表面をシールド層
１３によって被覆したものである。FIG. 1 is a sectional view of essential parts showing an embodiment of a printed wiring board according to the present invention. In the same figure, the printed wiring board 10 is made of a material with a low dielectric constant (ε = about 2.5) of about 3, such as tetrafluoroethylene, and a material with a high dielectric constant (ε
= about 4.7) Absolute grade 4 is laminated via a shield layer 11 made of aluminum wafer or the like, and an insulating substrate 12 is formed by integrally bonding these with an adhesive,
A high frequency circuit is formed on the low dielectric constant insulating material 3 and a low frequency or intermediate frequency circuit is formed on the elevated 1-rate insulating material 4, and further, the surface of the insulating substrate 120 other than the turning portions of both of these is covered with a shield layer 13. It is.
両回路の接続はスルーホール導体（メツキ層）１によっ
て行なうことによシ、回路接続の信頼性向上を図ってい
る。また、必要に応じてシールド層１１および１３は、
小径のスルーホール、即ちパイヤホール（図示せず）で
接続される。The reliability of the circuit connection is improved by connecting both circuits through a through-hole conductor (plated layer) 1. In addition, the shield layers 11 and 13 may be formed as necessary.
They are connected through a small diameter through hole, ie, a pie hole (not shown).
かくして、このような構成からなるプリント配線基板１
０によれば、１つの絶縁基板１２に高周波回路と、低も
しくは中間周波回路を形成できるため、両回路を別々に
設計、製作する必要がなくなシ、回路基板数および基板
実装スペースを半減させ得る。Thus, the printed wiring board 1 having such a configuration
According to 0, since a high frequency circuit and a low or intermediate frequency circuit can be formed on one insulating substrate 12, there is no need to design and manufacture both circuits separately, and the number of circuit boards and board mounting space can be halved. obtain.
なお、上記実施例は高誘電率絶縁材４を一層としたが、
多層構造にすることも可能である。In addition, in the above embodiment, the high dielectric constant insulating material 4 is made of one layer, but
A multilayer structure is also possible.
以上説明したように本発明に係るプリント回路基板は、
誘電率の異なる２種類の絶縁材からなる積層板で絶縁基
板を形成したので、該絶縁基板に高周波回路と、低、中
間周波回路を形成するととが可能となり、回路設計、製
作の容易化と、回路基板数の削減、実装スペースの縮少
化、さらには電子機器の小型化を実現することができる
。As explained above, the printed circuit board according to the present invention is
Since the insulating substrate is formed of a laminate made of two types of insulating materials with different dielectric constants, it is possible to form a high frequency circuit and a low and intermediate frequency circuit on the insulating substrate, which simplifies circuit design and manufacturing. , it is possible to reduce the number of circuit boards, reduce the mounting space, and further downsize electronic devices.
第１図は本発明の一実施例を示す要部断面図、第２図は
従来の高周波回路用プリント配線基板と、低、中間周波
回路用プリント配線基板の平面図、第３図は第２図■−
■線拡大断面図、第４図は第２図ｆ’ｉ’−ｆＶ線拡大
断面図である。
１・・−・高周波回路用プリント配線基板、２・拳・・
低、中間周波回路用プリント配線基板、３．４・・番・
絶Ｒ材、６−−・・スルー水−ル、７・・・・スルーホ
ール導体、１１・・・・シールド層、１２・・・・絶縁
基板、１３・ψ・・シールド層。FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the present invention, FIG. 2 is a plan view of a conventional printed wiring board for high frequency circuits and a printed wiring board for low and intermediate frequency circuits, and FIG. Figure ■-
4 is an enlarged sectional view taken along the line f'i'-fV in FIG. 2. 1.--Printed wiring board for high frequency circuit, 2. Fist...
Printed wiring board for low and intermediate frequency circuits, number 3.4...
Absolute R material, 6...Through water hole, 7...Through hole conductor, 11...Shield layer, 12...Insulating substrate, 13.ψ...Shield layer.
Claims (1)
積層配置された誘電率の異なる高周波回路用絶縁材と、
低，中間周波回路用絶縁材とで形成したことを特徴とす
るプリント配線基板。An insulating substrate of a printed wiring board is laminated with insulating materials for high frequency circuits having different dielectric constants through a shield layer,
A printed wiring board characterized by being formed of an insulating material for low and intermediate frequency circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309210A JPH02155290A (en) | 1988-12-07 | 1988-12-07 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309210A JPH02155290A (en) | 1988-12-07 | 1988-12-07 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02155290A true JPH02155290A (en) | 1990-06-14 |
Family
ID=17990252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309210A Pending JPH02155290A (en) | 1988-12-07 | 1988-12-07 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02155290A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6358988A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Manufacture of radio frequency circuit board |
-
1988
- 1988-12-07 JP JP63309210A patent/JPH02155290A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6358988A (en) * | 1986-08-29 | 1988-03-14 | 日立化成工業株式会社 | Manufacture of radio frequency circuit board |
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