JPH0215320Y2 - - Google Patents
Info
- Publication number
- JPH0215320Y2 JPH0215320Y2 JP1981004443U JP444381U JPH0215320Y2 JP H0215320 Y2 JPH0215320 Y2 JP H0215320Y2 JP 1981004443 U JP1981004443 U JP 1981004443U JP 444381 U JP444381 U JP 444381U JP H0215320 Y2 JPH0215320 Y2 JP H0215320Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature compensating
- thickness
- compensating plate
- semiconductor substrate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005219 brazing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 239000008188 pellet Substances 0.000 description 14
- 238000003825 pressing Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981004443U JPH0215320Y2 (tr) | 1981-01-19 | 1981-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981004443U JPH0215320Y2 (tr) | 1981-01-19 | 1981-01-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57119533U JPS57119533U (tr) | 1982-07-24 |
| JPH0215320Y2 true JPH0215320Y2 (tr) | 1990-04-25 |
Family
ID=29802870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981004443U Expired JPH0215320Y2 (tr) | 1981-01-19 | 1981-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215320Y2 (tr) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51139260A (en) * | 1975-05-27 | 1976-12-01 | Mitsubishi Electric Corp | Method of manufacturing semi_conductor device |
| JPS5395575A (en) * | 1977-02-01 | 1978-08-21 | Hitachi Ltd | Pressing contact type semiconductor device and its manufacture |
-
1981
- 1981-01-19 JP JP1981004443U patent/JPH0215320Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51139260A (en) * | 1975-05-27 | 1976-12-01 | Mitsubishi Electric Corp | Method of manufacturing semi_conductor device |
| JPS5395575A (en) * | 1977-02-01 | 1978-08-21 | Hitachi Ltd | Pressing contact type semiconductor device and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57119533U (tr) | 1982-07-24 |
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