JPH0214751U - - Google Patents
Info
- Publication number
- JPH0214751U JPH0214751U JP9308688U JP9308688U JPH0214751U JP H0214751 U JPH0214751 U JP H0214751U JP 9308688 U JP9308688 U JP 9308688U JP 9308688 U JP9308688 U JP 9308688U JP H0214751 U JPH0214751 U JP H0214751U
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- semiconductor device
- lead
- temperature
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Emergency Protection Circuit Devices (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093086U JPH0433631Y2 (enExample) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093086U JPH0433631Y2 (enExample) | 1988-07-15 | 1988-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0214751U true JPH0214751U (enExample) | 1990-01-30 |
| JPH0433631Y2 JPH0433631Y2 (enExample) | 1992-08-12 |
Family
ID=31317536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988093086U Expired JPH0433631Y2 (enExample) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433631Y2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01257533A (ja) * | 1988-04-05 | 1989-10-13 | Honda Motor Co Ltd | 組付装置 |
| JPH04192237A (ja) * | 1990-11-26 | 1992-07-10 | Rohm Co Ltd | チップ型ヒューズ |
| JP2014212098A (ja) * | 2013-04-17 | 2014-11-13 | 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． | 二次電池 |
| JP2018503235A (ja) * | 2015-01-22 | 2018-02-01 | リテルヒューズ・インク | 内蔵式アーク・クエンチャーを備えたエア・スプリット・ヒューズにおけるワイヤ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981828A (ja) * | 1982-11-01 | 1984-05-11 | 松下電器産業株式会社 | 角型チツプ状ヒユ−ズ部品 |
| JPS59119546U (ja) * | 1983-02-02 | 1984-08-11 | 日本電信電話株式会社 | チツプ状ヒユ−ズ |
-
1988
- 1988-07-15 JP JP1988093086U patent/JPH0433631Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5981828A (ja) * | 1982-11-01 | 1984-05-11 | 松下電器産業株式会社 | 角型チツプ状ヒユ−ズ部品 |
| JPS59119546U (ja) * | 1983-02-02 | 1984-08-11 | 日本電信電話株式会社 | チツプ状ヒユ−ズ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01257533A (ja) * | 1988-04-05 | 1989-10-13 | Honda Motor Co Ltd | 組付装置 |
| JPH04192237A (ja) * | 1990-11-26 | 1992-07-10 | Rohm Co Ltd | チップ型ヒューズ |
| JP2014212098A (ja) * | 2013-04-17 | 2014-11-13 | 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． | 二次電池 |
| JP2018503235A (ja) * | 2015-01-22 | 2018-02-01 | リテルヒューズ・インク | 内蔵式アーク・クエンチャーを備えたエア・スプリット・ヒューズにおけるワイヤ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0433631Y2 (enExample) | 1992-08-12 |