JPH02145737A - 高強度高導電性銅基合金 - Google Patents
高強度高導電性銅基合金Info
- Publication number
- JPH02145737A JPH02145737A JP29741688A JP29741688A JPH02145737A JP H02145737 A JPH02145737 A JP H02145737A JP 29741688 A JP29741688 A JP 29741688A JP 29741688 A JP29741688 A JP 29741688A JP H02145737 A JPH02145737 A JP H02145737A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- strength
- alloy
- electrical conductivity
- based alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 41
- 239000000956 alloy Substances 0.000 title claims abstract description 41
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 12
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910052796 boron Inorganic materials 0.000 claims abstract description 8
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 6
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- -1 /lj Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910018505 Ni—Mg Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29741688A JPH02145737A (ja) | 1988-11-24 | 1988-11-24 | 高強度高導電性銅基合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29741688A JPH02145737A (ja) | 1988-11-24 | 1988-11-24 | 高強度高導電性銅基合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02145737A true JPH02145737A (ja) | 1990-06-05 |
| JPH0478704B2 JPH0478704B2 (enrdf_load_stackoverflow) | 1992-12-11 |
Family
ID=17846225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29741688A Granted JPH02145737A (ja) | 1988-11-24 | 1988-11-24 | 高強度高導電性銅基合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02145737A (enrdf_load_stackoverflow) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995009252A1 (fr) * | 1993-09-30 | 1995-04-06 | Kabushiki Kaisha Kobe Seiko Sho | Alliage de cuivre pour composants electriques et electroniques |
| US5424030A (en) * | 1992-12-03 | 1995-06-13 | Yamaha Metanix Corporation | Copper alloy for fine pattern lead frame |
| US7163753B2 (en) * | 2002-04-15 | 2007-01-16 | Sumitomo Wiring Systems, Ltd. | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
| US7461770B2 (en) * | 2003-08-04 | 2008-12-09 | Vacuumschmelze Gmbh & Co. Kg | Copper-based brazing alloy and brazing process |
| WO2011142450A1 (ja) * | 2010-05-14 | 2011-11-17 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材 |
| CN102810341A (zh) * | 2012-07-31 | 2012-12-05 | 江苏银盛电缆科技有限公司 | 电缆用铜包铝镁合金 |
| CN103773989A (zh) * | 2014-03-04 | 2014-05-07 | 南京信息工程大学 | 一种铁磁元素钆改性的导电铜材料及制备方法 |
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| EP3243917A4 (en) * | 2015-01-07 | 2018-05-23 | Mitsubishi Materials Corporation | Superconduction stabilizer material, superconducting wire, and superconducting coil |
| EP3243916A4 (en) * | 2015-01-07 | 2018-05-30 | Mitsubishi Materials Corporation | Superconducting wire and superconducting coil |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
| US10971278B2 (en) | 2016-04-06 | 2021-04-06 | Mitsubishi Materials Corporation | Superconducting wire and superconducting coil |
| US11149329B2 (en) | 2016-04-06 | 2021-10-19 | Mitsubishi Materials Corporation | Stabilizer material for superconductor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
| JPS6362834A (ja) * | 1986-09-04 | 1988-03-19 | Nippon Mining Co Ltd | 直流配線材料用銅合金 |
| JPS63109132A (ja) * | 1986-10-28 | 1988-05-13 | Furukawa Electric Co Ltd:The | 高力導電性銅合金及びその製造方法 |
| JPS63125648A (ja) * | 1986-11-13 | 1988-05-28 | Ngk Insulators Ltd | ベリリウム銅合金の製造法 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPH01168831A (ja) * | 1987-12-25 | 1989-07-04 | Nippon Mining Co Ltd | 通電材料 |
-
1988
- 1988-11-24 JP JP29741688A patent/JPH02145737A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
| JPS6362834A (ja) * | 1986-09-04 | 1988-03-19 | Nippon Mining Co Ltd | 直流配線材料用銅合金 |
| JPS63109132A (ja) * | 1986-10-28 | 1988-05-13 | Furukawa Electric Co Ltd:The | 高力導電性銅合金及びその製造方法 |
| JPS63125648A (ja) * | 1986-11-13 | 1988-05-28 | Ngk Insulators Ltd | ベリリウム銅合金の製造法 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPH01168831A (ja) * | 1987-12-25 | 1989-07-04 | Nippon Mining Co Ltd | 通電材料 |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424030A (en) * | 1992-12-03 | 1995-06-13 | Yamaha Metanix Corporation | Copper alloy for fine pattern lead frame |
| US5624506A (en) * | 1993-09-30 | 1997-04-29 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy for use in electrical and electronic parts |
| WO1995009252A1 (fr) * | 1993-09-30 | 1995-04-06 | Kabushiki Kaisha Kobe Seiko Sho | Alliage de cuivre pour composants electriques et electroniques |
| US7163753B2 (en) * | 2002-04-15 | 2007-01-16 | Sumitomo Wiring Systems, Ltd. | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
| US7461770B2 (en) * | 2003-08-04 | 2008-12-09 | Vacuumschmelze Gmbh & Co. Kg | Copper-based brazing alloy and brazing process |
| US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| WO2011142450A1 (ja) * | 2010-05-14 | 2011-11-17 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材 |
| CN102822363A (zh) * | 2010-05-14 | 2012-12-12 | 三菱综合材料株式会社 | 电子器件用铜合金、电子器件用铜合金的制造方法及电子器件用铜合金轧材 |
| US10056165B2 (en) | 2010-05-14 | 2018-08-21 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
| CN102810341A (zh) * | 2012-07-31 | 2012-12-05 | 江苏银盛电缆科技有限公司 | 电缆用铜包铝镁合金 |
| CN103773989A (zh) * | 2014-03-04 | 2014-05-07 | 南京信息工程大学 | 一种铁磁元素钆改性的导电铜材料及制备方法 |
| EP3243916A4 (en) * | 2015-01-07 | 2018-05-30 | Mitsubishi Materials Corporation | Superconducting wire and superconducting coil |
| EP3243917A4 (en) * | 2015-01-07 | 2018-05-23 | Mitsubishi Materials Corporation | Superconduction stabilizer material, superconducting wire, and superconducting coil |
| US10964454B2 (en) | 2015-01-07 | 2021-03-30 | Mitsubishi Materials Corporation | Superconducting wire and superconducting coil |
| US10964453B2 (en) | 2015-01-07 | 2021-03-30 | Mitsubishi Materials Corporation | Superconducting stabilization material, superconducting wire, and superconducting coil |
| US10971278B2 (en) | 2016-04-06 | 2021-04-06 | Mitsubishi Materials Corporation | Superconducting wire and superconducting coil |
| US11149329B2 (en) | 2016-04-06 | 2021-10-19 | Mitsubishi Materials Corporation | Stabilizer material for superconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0478704B2 (enrdf_load_stackoverflow) | 1992-12-11 |
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