JPH0214201Y2 - - Google Patents
Info
- Publication number
- JPH0214201Y2 JPH0214201Y2 JP1983195237U JP19523783U JPH0214201Y2 JP H0214201 Y2 JPH0214201 Y2 JP H0214201Y2 JP 1983195237 U JP1983195237 U JP 1983195237U JP 19523783 U JP19523783 U JP 19523783U JP H0214201 Y2 JPH0214201 Y2 JP H0214201Y2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum layer
- tip
- lead frame
- lead
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- -1 halogen ions Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は半導体集積回路（以下ICと称す）の
ためのリードフレームであつて、更に言えば高信
頼性のICを供給する事ができるリードフレーム
に関する。[Detailed description of the invention] [Industrial application field] The present invention is a lead frame for semiconductor integrated circuits (hereinafter referred to as IC), and more specifically, a lead frame that can supply highly reliable ICs. Regarding frames.
ICリードフレームは42合金（Ni42重量％，Fe
残部）、コバール（Ni29重量％，Co17重量％，
Fe残部）、リン青銅のような高熱伝導性、強度を
有する材料をプレス打抜きあるいは、エツチング
にて所定のパターンに形成させた後、アイランド
部（ICチツプを搭載する部分）にICチツプとの
密着性を高める事、耐食性の付与、リードフレー
ム成分のICチツプへの拡散防止、放熱性及び電
気伝導性の向上等の目的で金あるいは銀などの貴
金属を部分的にめつきを行なう。
The IC lead frame is made of 42 alloy (Ni42% by weight, Fe
balance), Kovar (Ni29% by weight, Co17% by weight,
After forming a material with high thermal conductivity and strength such as phosphor bronze into a predetermined pattern by press punching or etching, the island part (the part where the IC chip is mounted) is made into close contact with the IC chip. Noble metals such as gold or silver are partially plated for the purpose of increasing the strength of the IC chip, imparting corrosion resistance, preventing lead frame components from diffusing into the IC chip, and improving heat dissipation and electrical conductivity.
また、最近はICチツプとインナーリードを接
続するボンデイング用ワイヤーとして、アルミニ
ウム線を用いることが多いことから、インナーリ
ード上に数〜十数ミクロン程度の厚さのアルミニ
ウム層を設け、アルミニウムのボンデイング用ワ
イヤーとインナーリードとの密着性を向上させて
いる。 In addition, recently, aluminum wires are often used as bonding wires to connect IC chips and inner leads, so an aluminum layer with a thickness of several to tens of microns is provided on the inner leads. Improves the adhesion between the wire and the inner lead.
その後、ICチツプをボンデイングしたリード
フレームを、樹脂で封止しICが完成する。 After that, the lead frame with the IC chip bonded to it is sealed with resin to complete the IC.
しかし、従来例ではアルミニウム層をインナー
リード上にボンデイング用ワイヤーが接着される
箇所よりもはるかに広く、インナーリード端部を
含む部分に形成するため（第２図参照）、封止に
用いる樹脂（エポキシ樹脂、フエノール樹脂、シ
リコーン樹脂、ポリフエニレンサルフアイド樹脂
等）中に含まれるイオン性不純物（特に塩素、臭
素、フツ素等のハロゲンイオン）によるアルミニ
ウム層の腐食が、特にインナーリード端部より進
行するために、剥離が生じ、ICチツプとリード
フレーム間に断線が生じることがあつた。
However, in the conventional example, the aluminum layer is formed on the inner lead in a part that is much wider than the part where the bonding wire is bonded and includes the end of the inner lead (see Figure 2). Corrosion of the aluminum layer due to ionic impurities (especially halogen ions such as chlorine, bromine, and fluorine) contained in epoxy resins, phenolic resins, silicone resins, polyphenylene sulfide resins, etc. As the problem progressed, delamination occurred, and disconnection occurred between the IC chip and the lead frame.
しかるに、本考案のリードフレームは、インナ
ーリードの先端部の上面に、該先端部の上面の面
積より小さい領域を占めるアルミニウム層を形成
してなり、該アルミニウム層がボンデイング用ワ
イヤーを接着される箇所に相当する事により前記
課題を解決した。
However, in the lead frame of the present invention, an aluminum layer is formed on the top surface of the tip of the inner lead, and the aluminum layer occupies an area smaller than the area of the top surface of the tip. The above-mentioned problem was solved by corresponding to .
本考案のリードフレームは、インナーリードの
先端部の上面に、該先端部の上面より小さい領域
を占めるアルミニウム層を形成することにより、
インナーリード端部にはアルミニウム層が存在し
ないので腐食が発生しにくく、アルミニウム層の
剥離が起こりにくい。
The lead frame of the present invention has an aluminum layer formed on the top surface of the tip of the inner lead, which occupies a smaller area than the top surface of the tip.
Since there is no aluminum layer at the end of the inner lead, corrosion is less likely to occur and the aluminum layer is less likely to peel off.
本考案のリードフレームの一実施例を第１図を
用いて説明する。すなわち、エツチングやプレス
打抜きにより所定のパターンが形成されたリード
フレーム１において、アイランド部２には従来ど
おり、貴金属めつき３を施し、インナーリード先
端部４の上面に、該先端部４の上面の面積より小
さい領域を占めるアルミニウム層５を形成して、
該アルミニウム層５にボンデイング用ワイヤーを
接着する。
An embodiment of the lead frame of the present invention will be described with reference to FIG. That is, in a lead frame 1 in which a predetermined pattern has been formed by etching or press punching, the island portion 2 is plated with precious metal 3 as before, and the upper surface of the inner lead tip 4 is coated with a metal plating 3. forming an aluminum layer 5 occupying an area smaller than the area;
A bonding wire is bonded to the aluminum layer 5.
なお、本考案でアルミニウム層を設ける箇所
は、自由形状で良く、円形が一番良いが、インナ
ーリード先部６から0.5mmのところを中心にして
半径0.3mm以内の領域に形成されておればワイヤ
ーボンデイングの接合箇所になりうるのであり、
楕円、長方形、三角形など形状は特に選ばない。
また、リードフレームの吊りリード部７にアルミ
ニウム層が必要な場合は、他のインナーリードと
ほぼ同じ箇所に行なえば良い。 In addition, in the present invention, the aluminum layer may be provided in any free shape, and the best shape is circular, but if it is formed in an area within a radius of 0.3 mm centered at 0.5 mm from the inner lead tip 6. It can be used as a joint for wire bonding.
The shape is not particularly selected, such as an oval, rectangle, or triangle.
Furthermore, if an aluminum layer is required for the hanging lead portion 7 of the lead frame, it may be formed at approximately the same location as the other inner leads.
本考案のリードフレームは、インナーリードの
先端部の上面に、該先端部の上面より小さい領域
を占めるアルミニウム層を形成することにより、
インナーリード端部にはアルミニウム層が存在し
ないので腐食が発生しにくく、剥離が起こりにく
いために、従来より信頼性の高いICが得られた。
The lead frame of the present invention has an aluminum layer formed on the top surface of the tip of the inner lead, which occupies a smaller area than the top surface of the tip.
Since there is no aluminum layer at the end of the inner lead, corrosion is less likely to occur and peeling is less likely to occur, resulting in an IC that is more reliable than before.
第１図は、本考案のリードフレームの一実施例
を示す部分拡大斜視図である。第２図は、従来の
リードフレームの一実施例を示す部分拡大斜視図
である。
１……リードフレーム、２……アイランド部、
３……貴金属めつき層、４……インナーリード先
端部、５……アルミニウム層、６……インナーリ
ード先部、７……吊りリード、８……インナーリ
ード端部。
FIG. 1 is a partially enlarged perspective view showing an embodiment of the lead frame of the present invention. FIG. 2 is a partially enlarged perspective view showing an example of a conventional lead frame. 1...Lead frame, 2...Island part,
3...Precious metal plating layer, 4...Inner lead tip, 5...Aluminum layer, 6...Inner lead tip, 7...Hanging lead, 8...Inner lead end.
Claims (1)
上面の面積より小さい領域を占めるアルミニウム
層を形成してなり、該アルミニウム層がボンデイ
ング用ワイヤーを接着される箇所に相当する事を
特徴とするリードフレーム。 A lead characterized in that an aluminum layer is formed on the top surface of the tip of the inner lead, occupying an area smaller than the area of the top surface of the tip, and the aluminum layer corresponds to a location to which a bonding wire is bonded. flame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19523783U JPS60103833U (en) | 1983-12-19 | 1983-12-19 | lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19523783U JPS60103833U (en) | 1983-12-19 | 1983-12-19 | lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60103833U JPS60103833U (en) | 1985-07-15 |
| JPH0214201Y2 true JPH0214201Y2 (en) | 1990-04-18 |
Family
ID=30419392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19523783U Granted JPS60103833U (en) | 1983-12-19 | 1983-12-19 | lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103833U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940487A (en) * | 1972-08-22 | 1974-04-16 | ||
| JPS5619052B2 (en) * | 1973-10-01 | 1981-05-02 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619052U (en) * | 1979-07-20 | 1981-02-19 |
-
1983
- 1983-12-19 JP JP19523783U patent/JPS60103833U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940487A (en) * | 1972-08-22 | 1974-04-16 | ||
| JPS5619052B2 (en) * | 1973-10-01 | 1981-05-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60103833U (en) | 1985-07-15 |
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