JPS5619052U - - Google Patents
Info
- Publication number
- JPS5619052U JPS5619052U JP10073979U JP10073979U JPS5619052U JP S5619052 U JPS5619052 U JP S5619052U JP 10073979 U JP10073979 U JP 10073979U JP 10073979 U JP10073979 U JP 10073979U JP S5619052 U JPS5619052 U JP S5619052U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073979U JPS5619052U (en) | 1979-07-20 | 1979-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073979U JPS5619052U (en) | 1979-07-20 | 1979-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5619052U true JPS5619052U (en) | 1981-02-19 |
Family
ID=29333450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10073979U Pending JPS5619052U (en) | 1979-07-20 | 1979-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5619052U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160137A (en) * | 1981-03-27 | 1982-10-02 | Yamagata Nippon Denki Kk | Semiconductor device |
| JPS6088021A (en) * | 1983-10-20 | 1985-05-17 | Showa Highpolymer Co Ltd | Fiber-reinforced resin composition |
| JPS60103833U (en) * | 1983-12-19 | 1985-07-15 | 凸版印刷株式会社 | lead frame |
| JPS6232623A (en) * | 1985-08-05 | 1987-02-12 | Mitsubishi Electric Corp | Semiconductor device |
| JP2019071488A (en) * | 2019-02-06 | 2019-05-09 | ローム株式会社 | Semiconductor device |
-
1979
- 1979-07-20 JP JP10073979U patent/JPS5619052U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160137A (en) * | 1981-03-27 | 1982-10-02 | Yamagata Nippon Denki Kk | Semiconductor device |
| JPS6088021A (en) * | 1983-10-20 | 1985-05-17 | Showa Highpolymer Co Ltd | Fiber-reinforced resin composition |
| JPS60103833U (en) * | 1983-12-19 | 1985-07-15 | 凸版印刷株式会社 | lead frame |
| JPS6232623A (en) * | 1985-08-05 | 1987-02-12 | Mitsubishi Electric Corp | Semiconductor device |
| JP2019071488A (en) * | 2019-02-06 | 2019-05-09 | ローム株式会社 | Semiconductor device |