JPH0214195Y2 - - Google Patents
Info
- Publication number
- JPH0214195Y2 JPH0214195Y2 JP6830384U JP6830384U JPH0214195Y2 JP H0214195 Y2 JPH0214195 Y2 JP H0214195Y2 JP 6830384 U JP6830384 U JP 6830384U JP 6830384 U JP6830384 U JP 6830384U JP H0214195 Y2 JPH0214195 Y2 JP H0214195Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- chip
- resin layer
- exterior resin
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830384U JPS60181024U (ja) | 1984-05-10 | 1984-05-10 | チツプ形電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830384U JPS60181024U (ja) | 1984-05-10 | 1984-05-10 | チツプ形電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60181024U JPS60181024U (ja) | 1985-12-02 |
| JPH0214195Y2 true JPH0214195Y2 ( ) | 1990-04-18 |
Family
ID=30602930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6830384U Granted JPS60181024U (ja) | 1984-05-10 | 1984-05-10 | チツプ形電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60181024U ( ) |
-
1984
- 1984-05-10 JP JP6830384U patent/JPS60181024U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60181024U (ja) | 1985-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0214195Y2 ( ) | ||
| JPH0214193Y2 ( ) | ||
| JPH0214194Y2 ( ) | ||
| JPH037946Y2 ( ) | ||
| JPH0636571Y2 (ja) | チップ形電解コンデンサ | |
| JPH034019Y2 ( ) | ||
| JPH0632671Y2 (ja) | チップ形電解コンデンサ | |
| JPH0632669Y2 (ja) | チップ形電解コンデンサ | |
| JPH0632670Y2 (ja) | チップ形電解コンデンサ | |
| JPH0310659Y2 ( ) | ||
| JPS58111915U (ja) | 積層セラミツクコンデンサ | |
| JPH0325395Y2 ( ) | ||
| JPS6012280Y2 (ja) | チップ形電解コンデンサ | |
| JPH0314039Y2 ( ) | ||
| JPH0215392Y2 ( ) | ||
| JPH0316274Y2 ( ) | ||
| JPH02114943U ( ) | ||
| JPS607473Y2 (ja) | 固体電解コンデンサ | |
| JPH0310661Y2 ( ) | ||
| JPH0522371B2 ( ) | ||
| JPS624124U ( ) | ||
| JPS605108U (ja) | 外装型積層セラミツクコンデンサ | |
| JPS63119231U ( ) | ||
| JPS60183430U (ja) | チツプ形アルミニウム電解コンデンサ | |
| JPS61156224U ( ) |