JPH0214194Y2 - - Google Patents

Info

Publication number

JPH0214194Y2

JPH0214194Y2 JP6830284U JP6830284U JPH0214194Y2 JP H0214194 Y2 JPH0214194 Y2 JP H0214194Y2 JP 6830284 U JP6830284 U JP 6830284U JP 6830284 U JP6830284 U JP 6830284U JP H0214194 Y2 JPH0214194 Y2 JP H0214194Y2

Authority

JP

Japan

Prior art keywords

electrolytic capacitor

lead wires

circumferential

chip

bend

Prior art date

1984-05-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000003990 capacitor Substances 0.000 claims description 26
• 239000011347 resin Substances 0.000 claims description 9
• 229920005989 resin Polymers 0.000 claims description 9
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
• 229910052782 aluminium Inorganic materials 0.000 claims description 7
• 238000007789 sealing Methods 0.000 claims description 6
• 238000005452 bending Methods 0.000 claims description 4
• 238000000034 method Methods 0.000 description 3
• 238000007598 dipping method Methods 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• 230000015572 biosynthetic process Effects 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 238000005243 fluidization Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1

Cited By (1)