JPH0214189B2 - - Google Patents

Info

Publication number
JPH0214189B2
JPH0214189B2 JP59163894A JP16389484A JPH0214189B2 JP H0214189 B2 JPH0214189 B2 JP H0214189B2 JP 59163894 A JP59163894 A JP 59163894A JP 16389484 A JP16389484 A JP 16389484A JP H0214189 B2 JPH0214189 B2 JP H0214189B2
Authority
JP
Japan
Prior art keywords
composite material
copper
ceramic substrate
carbon fiber
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59163894A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6141538A (ja
Inventor
Shigeo Tsuruoka
Keiichi Kunya
Hideo Arakawa
Akio Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59163894A priority Critical patent/JPS6141538A/ja
Publication of JPS6141538A publication Critical patent/JPS6141538A/ja
Publication of JPH0214189B2 publication Critical patent/JPH0214189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Die Bonding (AREA)
JP59163894A 1984-08-06 1984-08-06 セラミツク基板及びその製造方法 Granted JPS6141538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59163894A JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59163894A JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6141538A JPS6141538A (ja) 1986-02-27
JPH0214189B2 true JPH0214189B2 (enrdf_load_stackoverflow) 1990-04-06

Family

ID=15782826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59163894A Granted JPS6141538A (ja) 1984-08-06 1984-08-06 セラミツク基板及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6141538A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2667313B2 (ja) * 1991-07-15 1997-10-27 三菱電機株式会社 混成集積回路装置
DE10320838B4 (de) * 2003-05-08 2014-11-06 Rogers Germany Gmbh Faserverstärktes Metall-Keramik/Glas-Verbundmaterial als Substrat für elektrische Anwendungen, Verfahren zum Herstellen eines derartigen Verbundmaterials sowie Verwendung dieses Verbundmaterials

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113683A (en) * 1979-02-21 1980-09-02 Kyoto Ceramic Method and composition of metallizing carbide type ceramic body
JPS55127044A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Electric circuit substrate and its manufacture
JPS5745248A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6141538A (ja) 1986-02-27

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