JPH0213931B2 - - Google Patents
Info
- Publication number
- JPH0213931B2 JPH0213931B2 JP10821384A JP10821384A JPH0213931B2 JP H0213931 B2 JPH0213931 B2 JP H0213931B2 JP 10821384 A JP10821384 A JP 10821384A JP 10821384 A JP10821384 A JP 10821384A JP H0213931 B2 JPH0213931 B2 JP H0213931B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plunger
- pressurizing
- pot
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 84
- 229920005989 resin Polymers 0.000 claims description 84
- 239000012530 fluid Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 239000012809 cooling fluid Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000010309 melting process Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251633A JPS60251633A (ja) | 1985-12-12 |
| JPH0213931B2 true JPH0213931B2 (ru) | 1990-04-05 |
Family
ID=14478891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10821384A Granted JPS60251633A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251633A (ru) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0186241U (ru) * | 1987-11-30 | 1989-06-07 | ||
| US5200125A (en) * | 1988-12-24 | 1993-04-06 | T&K International Laboratory, Ltd. | Method for seal molding electronic components with resin |
| GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| MY109641A (en) * | 1991-03-20 | 1997-03-31 | Nitto Denko Corp | Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same |
| EP0594863B1 (en) * | 1992-04-13 | 1998-07-08 | Apic Yamada Corporation | Method of transfer mold and apparatus for transfer mold |
| JP2524955B2 (ja) * | 1993-04-22 | 1996-08-14 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP3566426B2 (ja) * | 1995-10-30 | 2004-09-15 | Ｔｏｗａ株式会社 | 電子部品の樹脂成形装置 |
| US7291304B2 (en) * | 2004-07-01 | 2007-11-06 | Husky Injection Molding Systems Ltd. | Coinjection molding cooled shooting pot cylinder |
-
1984
- 1984-05-28 JP JP10821384A patent/JPS60251633A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60251633A (ja) | 1985-12-12 |
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