JPH0213811A - Angle-of-rotation detector - Google Patents
Angle-of-rotation detectorInfo
- Publication number
- JPH0213811A JPH0213811A JP16255088A JP16255088A JPH0213811A JP H0213811 A JPH0213811 A JP H0213811A JP 16255088 A JP16255088 A JP 16255088A JP 16255088 A JP16255088 A JP 16255088A JP H0213811 A JPH0213811 A JP H0213811A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead
- photo
- circuit
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000003321 amplification Effects 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- WABPQHHGFIMREM-IGMARMGPSA-N lead-207 Chemical compound [207Pb] WABPQHHGFIMREM-IGMARMGPSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は内燃機関用配電器に内蔵される回転角度検出装
置に係り、とくに光電素子を使用したピックアップ方式
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a rotation angle detection device built into a power distribution device for an internal combustion engine, and particularly to a pickup method using a photoelectric element.
エンジンの電子制御システムにおいて、エンジン回転と
同期して回転する配電器に内蔵した回転角度検出装置は
、分枝８３−１２６３５に記載のようなものがある。こ
の検出装置は、発光素子と受光素子とを対向させ、その
間にスリットを有した円板が回転するように配置し、光
の明暗変化を電圧変化に変換し、所定の信号を出力する
ようにしたものである。In an electronic control system for an engine, there is a rotation angle detection device built into a power distributor that rotates in synchronization with engine rotation as described in Branch No. 83-12635. This detection device has a light-emitting element and a light-receiving element facing each other, and a disc with a slit is placed between them so as to rotate, converting changes in brightness of light into changes in voltage, and outputting a predetermined signal. This is what I did.
信号を出力する為には、受光素子の出力電圧を増幅、及
び波形整形する電子回路が必要であり、ハイブリッド集
積回路を併用し、前記回転角度検出装置を構成している
。In order to output a signal, an electronic circuit is required to amplify the output voltage of the light receiving element and shape the waveform, and a hybrid integrated circuit is also used to configure the rotation angle detection device.
前記受光素子とハイブリッド集積回路との間をリードフ
レーム等で電気的接続を行うが、配電器に内蔵した場合
には、配電部の高圧に近い為に放電ノイズによる誤動作
、素子の破壊を防止する必要があり、前記リードフレー
ムが長いとノイズを誘導し易くなる。また、ハイブリッ
ド集積回路にこれら誤動作、破壊を防止する為のコンデ
ンサ、ツェナダイオード等、素子数の増加を招く。さら
に装置全体も小形、軽量化が難しい問題があった。Electrical connection is made between the light receiving element and the hybrid integrated circuit using a lead frame, etc., but when it is built into a power distribution unit, it is close to the high voltage of the power distribution part, so malfunctions and element destruction due to discharge noise are prevented. If the lead frame is long, noise will be easily induced. Furthermore, the number of elements such as capacitors and Zener diodes for preventing these malfunctions and destructions is increased in the hybrid integrated circuit. Furthermore, it was difficult to make the entire device smaller and lighter.
本発明は、受光素子（好ましくはシリコンチップで構成
されるフォトダイオード）の光検出部分と同一のチップ
に増幅器、電圧比較器等の回路を形成し、このチップを
金属性のキャンに封止すると共に、この回路の接地ライ
ンをキャンに接続したことを特徴とするもので、耐放電
ノイズ性を向上させ、同時に小形、軽量化を図るもので
ある。In the present invention, circuits such as an amplifier and a voltage comparator are formed on the same chip as the photodetection part of a light receiving element (preferably a photodiode made of a silicon chip), and this chip is sealed in a metal can. In addition, this circuit is characterized in that the ground line is connected to the can, which improves discharge noise resistance and at the same time makes it smaller and lighter.
受光素子のチップに、光を受けると起電力が生じる効果
、もしくは内部抵抗が減少する効果を有する領域と、増
幅器及び電圧比較器を構成する領域とを形成する。この
チップを導電性のキャンに内蔵することにより、回路構
成としてのハイブリッド集積回路を不要ならしめる。ま
た、前記チップ（好ましくはシリコンチップ）の接地ラ
インをキャンに接続することにより、チップ周囲が導電
性のシールドが行われることになる。したがって配電部
の放電ノイズによる影響を受けにくくなり、誤動作を防
止できる。A region having the effect of generating an electromotive force or reducing internal resistance when receiving light and a region constituting an amplifier and a voltage comparator are formed on the chip of the light receiving element. By incorporating this chip into a conductive can, a hybrid integrated circuit is no longer required as part of the circuit configuration. Furthermore, by connecting the ground line of the chip (preferably a silicon chip) to the can, a conductive shield is created around the chip. Therefore, it is less susceptible to the influence of discharge noise in the power distribution section, and malfunctions can be prevented.
本発明の一実施例を図により説明する。 An embodiment of the present invention will be described with reference to the drawings.
第１図は本発明が適用される配電器の断面図である。FIG. 1 is a sectional view of a power distributor to which the present invention is applied.
シャフト１の一端には第１のカラー４が装着され、この
カラー４のフランジ部４ａにピン５が圧入されている。A first collar 4 is attached to one end of the shaft 1, and a pin 5 is press-fitted into a flange portion 4a of the collar 4.
ピン５は第２のカラー６のフランジ部６ａに設けた穴７
に嵌合している。The pin 5 is inserted into the hole 7 provided in the flange portion 6a of the second collar 6.
is fitted.
フランジ部４ａと６ａとの間には回転板８が装着され、
ねじ９で第２のカラー６と第１のカラー４とをシャフト
１の段部１ａに圧接するようにし、回転板８を両フラン
ジ部４ａ、６ａで挟持している。A rotary plate 8 is installed between the flange parts 4a and 6a,
The second collar 6 and the first collar 4 are brought into pressure contact with the stepped portion 1a of the shaft 1 by screws 9, and the rotary plate 8 is held between both flanges 4a and 6a.
１０は合成樹脂で作られたケースで、外部への信号取出
し用コネクタ１１と一体成形されている。Reference numeral 10 denotes a case made of synthetic resin, which is integrally molded with a connector 11 for outputting signals to the outside.
ま、た、信号検出回路の電源回路及びサージ保護回路を
構成するハイブリッド集積回路１２がケース１０に設置
されている。Further, a hybrid integrated circuit 12 that constitutes a power supply circuit and a surge protection circuit of the signal detection circuit is installed in the case 10.
光電式ピックアップ１３はホルダ部２２とケース１０と
で一体成形された形状をなし、ケース１ｏはハウジング
２の底面にねじ（図示せず）で固定されている。以下、
ケース１０に設置されたハイブリッド集積回路１２、光
電式ピックアップ１３の集合体を電子回路ユニットＩＳ
と呼ぶ。The photoelectric pickup 13 is integrally formed with a holder portion 22 and a case 10, and the case 1o is fixed to the bottom surface of the housing 2 with screws (not shown). below,
An assembly of a hybrid integrated circuit 12 and a photoelectric pickup 13 installed in a case 10 is an electronic circuit unit IS.
It is called.
第２図は電子回路ユニット１５の詳細を示す平面図、第
３図は断面図である。FIG. 2 is a plan view showing details of the electronic circuit unit 15, and FIG. 3 is a sectional view.
ケース１０には穴２１を有した金属ブツシュ２８が２個
埋設してあり、第１図の配置になるように取り付ける為
のねじが貫通する。Two metal bushings 28 having holes 21 are buried in the case 10, through which screws for mounting the bushings 28 in the arrangement shown in FIG. 1 pass through.
光電式ピックアップ１３は、発光素子２３とフォトＩＣ
２４とからなり、それぞれホルダ部２２゜ケース１０の
一部１００に固定されている。The photoelectric pickup 13 includes a light emitting element 23 and a photo IC.
24, and each holder portion 22° is fixed to a part 100 of the case 10.
発光素子２３のリード２３ａはリードフレーム２６に、
フォトＩＣ２４のリード２４ａはリードフレーム２７に
それぞれ溶接されている。The leads 23a of the light emitting element 23 are attached to the lead frame 26,
The leads 24a of the photo IC 24 are welded to the lead frame 27, respectively.
コネクタ１１の端子１１ａはリードフレーム２９に溶接
され、ハイブリッド集積回路１２と電気的に接続されて
いる。Terminals 11a of connector 11 are welded to lead frame 29 and electrically connected to hybrid integrated circuit 12.
前記リードフレーム２６．２７．２９は例えば黄銅、リ
ン青銅、ニッケル、鉄ニツケル合金等の材料からなり、
比較的可撓性に富み、がっはんだ付は性のよいものが選
定される。The lead frame 26, 27, 29 is made of a material such as brass, phosphor bronze, nickel, iron-nickel alloy, etc.
A material that is relatively flexible and has good soldering properties is selected.
ハイブリッド集積回路１２はセラミック基板１２ａに載
置された素子１２ｂと、リードフレーム２６．２７．２
９とからなり、周知のようにこれらの部品ははんだで接
合される。The hybrid integrated circuit 12 includes an element 12b mounted on a ceramic substrate 12a and a lead frame 26.27.2.
9, and these parts are joined by soldering as is well known.
ハイブリッド集積回路１２はケース１ｏに載置され、接
着される。載置されたとき、リードフレーム２６，２７
．２９は発光素子２３のリード２３ａ、フォトＩＣ２４
のリード２４ａ、端子１１ａに接近するよう配置される
。そして次の工程で、溶接によってそれぞれ接続される
。Hybrid integrated circuit 12 is placed on case 1o and bonded. When placed, the lead frames 26, 27
．． 29 is the lead 23a of the light emitting element 23, and the photo IC 24
The lead 24a and the terminal 11a are arranged close to each other. In the next step, they are connected by welding.
第４図はフォトＩＣ２４の平面図で、第５図に示す断面
図のＡ−Ａ方向から見たものである。FIG. 4 is a plan view of the photo IC 24, viewed from the direction AA of the cross-sectional view shown in FIG.
チップ２０５は、好ましくはシリコンで構成される。周
知の如く、フォトダイオードは一般にシリコンで構成さ
れ、光を受けるとカソードとアノードとの間に起電力を
生じる効果と、内部抵抗が小さくなる効果を有する素子
である。また、モノリシックＩＣでは、シリコンを用い
て増幅器または電圧比較器を構成できるのも周知である
。Chip 205 is preferably constructed of silicon. As is well known, a photodiode is generally made of silicon, and has the effect of generating an electromotive force between a cathode and an anode when exposed to light, and reducing internal resistance. It is also well known that silicon can be used to construct amplifiers or voltage comparators in monolithic ICs.
チップ２０５の中央部には光を受けると起電力を生じる
効果、または内部抵抗が小さくなる効果を有する領域２
０５ａを設け、その周囲には増幅器または（および）電
圧比較器を構成する領域２０５ｂを設けている。In the center of the chip 205, there is a region 2 which has the effect of generating an electromotive force or reducing internal resistance when exposed to light.
05a, and a region 205b constituting an amplifier or/and a voltage comparator is provided around it.
チップ２０５は例えば導電性接着剤２０６を用い、ステ
ム２０３に接合される。ステム２０３及びキャップ２０
２は金属性部材（例えば鉄・ニッケル・コバルト合金）
で構成されるが、これら２個を合せたものをキャンと称
することにする。Chip 205 is bonded to stem 203 using, for example, a conductive adhesive 206. Stem 203 and cap 20
2 is a metallic member (e.g. iron, nickel, cobalt alloy)
However, the combination of these two will be referred to as a can.
接地電極リード２０７ａはステム２０３にＢ部で溶接さ
れ、電源電極リード２０７ｂ及び出力電極２０７ｃはス
テム２０３に対して絶縁ガラス２０４で保持されている
。The ground electrode lead 207a is welded to the stem 203 at part B, and the power electrode lead 207b and the output electrode 207c are held to the stem 203 by an insulating glass 204.
チップ２０５の領域２０５ｂと各電極リード２０７ａ、
２０７ｂ、２０７ｃとの間は、金線２０８で電気的接続
されている。A region 205b of the chip 205 and each electrode lead 207a,
207b and 207c are electrically connected by a gold wire 208.
２０１は、レンズで、例えば硬質鉛ガラス等で構成され
、チップ２０５の受光領域２０５ａに対して光を当てる
為の集光レンズとして作用する。Reference numeral 201 denotes a lens, which is made of, for example, hard lead glass, and functions as a condensing lens for shining light onto the light receiving area 205a of the chip 205.
以上の構成によれば、次のような効果を有する。 According to the above configuration, the following effects are achieved.
フォトＩＣチップを受光領域と増幅器とを同一素子内に
形成した為、外部回路の構成を最少限で構成できる。Since the photo IC chip has the light receiving area and the amplifier formed in the same element, the configuration of the external circuit can be minimized.
フォトＩＣチップの接地ラインを導電性のキャンに接続
している為、チップ周囲に空間を介して飛び込むノイズ
をシール、ドできる効果がある。Since the ground line of the photo IC chip is connected to a conductive can, it has the effect of shielding noise from entering the space around the chip.
したがって第１図に示した配電器に内蔵した際に、高圧
配電部の放電ノイズによる影響を受けにくくなり、回転
角度検出装置としての誤動作を防止できる。Therefore, when built into the power distributor shown in FIG. 1, it is less susceptible to discharge noise from the high-voltage power distribution section, and malfunctions as a rotation angle detection device can be prevented.
第１図は本発明が適用される配電器の断面図、第２図は
回転角度検出装置の実施例を示す平面図、第３図はその
断面図、第４図はフォトエＣのチップを示す平面図、第
５図はその断面図である。
１・・・シャフト、２・・・ハウジング、８・・・回転
板、１５・・・電子回路ユニット、２３・・・発光素子
、２４・・・フォトＩＣ，２０５・・・チップ。
＄ １ 図
′２−Fig. 1 is a cross-sectional view of a power distributor to which the present invention is applied, Fig. 2 is a plan view showing an embodiment of the rotation angle detection device, Fig. 3 is a cross-sectional view thereof, and Fig. 4 shows a photoe C chip. The plan view and FIG. 5 are the cross-sectional views. DESCRIPTION OF SYMBOLS 1... Shaft, 2... Housing, 8... Rotating plate, 15... Electronic circuit unit, 23... Light emitting element, 24... Photo IC, 205... Chip. $ 1 Figure'2-
Claims (1)
、このシャフトと一体に回転し、所定のスリットを有し
た回転板、この回転板の回転により信号を検出する光電
式ピックアップ、このピックアップの信号を増幅する電
子回路を備えた回転角度検出装置において、前記光電式
ピックアップの受光素子として、光検出部分とこの検出
信号を増幅する部分及び電圧比較器とを同一チップで構
成し、このチップを金属性のキヤン内に封止すると共に
、前記チップで構成される回路の接地ラインを前記キヤ
ンに電気的に接続したことを特徴とする回転角度検出装
置。1. A shaft that rotates in synchronization with the engine crankshaft, a rotary plate that rotates together with this shaft and has a predetermined slit, a photoelectric pickup that detects signals by the rotation of this rotary plate, and a signal from this pickup. In a rotation angle detection device equipped with an electronic circuit for amplification, a photodetection part, a part for amplifying this detection signal, and a voltage comparator are constructed on the same chip as the light receiving element of the photoelectric pickup, and this chip is made of metal. 1. A rotation angle detection device, characterized in that the rotation angle detection device is sealed in a can, and a ground line of a circuit constituted by the chip is electrically connected to the can.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162550A JP2590212B2 (en) | 1988-07-01 | 1988-07-01 | Rotation angle detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162550A JP2590212B2 (en) | 1988-07-01 | 1988-07-01 | Rotation angle detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0213811A true JPH0213811A (en) | 1990-01-18 |
| JP2590212B2 JP2590212B2 (en) | 1997-03-12 |
Family
ID=15756721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63162550A Expired - Lifetime JP2590212B2 (en) | 1988-07-01 | 1988-07-01 | Rotation angle detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2590212B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005048422A1 (en) * | 2003-11-12 | 2005-05-26 | Hamamatsu Photonics K.K. | High-frequency signal transmitting optical module and method of fabricating the same |
| US7226219B2 (en) | 2003-11-12 | 2007-06-05 | Hamamatsu Photonics K.K. | High-frequency signal transmitting optical module and method of fabricating the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57191506A (en) * | 1981-05-22 | 1982-11-25 | Hitachi Ltd | Detector for rotational angle |
| JPS59172325U (en) * | 1983-05-02 | 1984-11-17 | オムロン株式会社 | Photoelectric encoder |
| JPS6088318A (en) * | 1983-10-19 | 1985-05-18 | Nippon Denso Co Ltd | Steering operation detector for vehicle |
| JPS6170720U (en) * | 1984-10-15 | 1986-05-14 |
-
1988
- 1988-07-01 JP JP63162550A patent/JP2590212B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57191506A (en) * | 1981-05-22 | 1982-11-25 | Hitachi Ltd | Detector for rotational angle |
| JPS59172325U (en) * | 1983-05-02 | 1984-11-17 | オムロン株式会社 | Photoelectric encoder |
| JPS6088318A (en) * | 1983-10-19 | 1985-05-18 | Nippon Denso Co Ltd | Steering operation detector for vehicle |
| JPS6170720U (en) * | 1984-10-15 | 1986-05-14 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005048422A1 (en) * | 2003-11-12 | 2005-05-26 | Hamamatsu Photonics K.K. | High-frequency signal transmitting optical module and method of fabricating the same |
| US7226219B2 (en) | 2003-11-12 | 2007-06-05 | Hamamatsu Photonics K.K. | High-frequency signal transmitting optical module and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2590212B2 (en) | 1997-03-12 |
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