JP2012114342A - Optical reception sub-assembly, manufacturing method therefor and optical receiver module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical reception sub-assembly capable of reducing the internal electromagnetic radiation of noise, and an optical receiver module having the same, and a manufacturing method for the optical reception sub-assembly capable of reducing the internal electromagnetic radiation of noise.SOLUTION: In one embodiment, a ROSA 100 includes a conductive stem 1. Stems 21-24 penetrate through the stem 1 and are insulated from the stem 1. Leads 21-24 are inserted into passage holes H1-4 of a substrate 10 for internal mounting composed of a dielectric. The lead 21-24 protrude on the substrate 10 for internal mounting. On the substrate 10 for internal mounting, onboard wiring lines 12a-12d are formed. The onboard wiring lines 12a-12d are joined to the leads 21-24 by solder portions 15c-15d, respectively. A photodiode 4 receives power from the lead 24 through the onboard wiring line 12c, and through the onboard wiring lines 12a, 12b, outputs electric signals obtained by converting received optical signals, to the leads 21, 22, respectively.

Description

  The present invention relates to an optical receiver subassembly, a method of manufacturing an optical receiver subassembly, and an optical receiver module, and more particularly to an optical receiver subassembly for optical communication, a method of manufacturing an optical receiver subassembly, and an optical receiver module.

  An electro-optical element (photodiode), a transimpedance amplifier (TIA), and the like are mounted in a conventional optical communication receiving module. In addition, a filter member for blocking noise such as a capacitor and a resistor is mounted in order to prevent oscillation and noise from the outside. These filter members are connected to the light receiving element and the TIA by bonding wires. Since these bonding wires are long, the noise flowing in through the lead portion of the stem is electromagnetically radiated in the receiving module. As a result, there is a problem that noise is reabsorbed by the photodiode and TIA in the receiving module, resulting in a decrease in receiving sensitivity of the receiving module.

  A conventional optical receiving subassembly (hereinafter referred to as ROSA (Receiver Optical Sub-Assembly)) (Patent Document 1) will be described. FIG. 10 is a plan view showing the upper surface of the stem of the conventional ROSA 500. As shown in FIG. The stem 510 is a disk-shaped conductor, and lead pins 511 to 514 are attached thereto. The lead pins 511 to 514 pass through the stem 510, and their tips protrude from the upper surface of the stem 510. Since the insulating seal glass is interposed between the stem 510 and the lead pins 511 to 514, the stem 510 and the lead pins 511 to 514 are insulated.

  A metallized substrate 515 and a transimpedance amplifier (hereinafter referred to as TIA) 522 are mounted on the upper surface of the stem 510. In general, a metallized substrate has a dielectric substrate as its base, an electrode formed entirely or partially on the upper surface of the dielectric substrate, and a solid metallized electrode that covers the entire lower surface of the dielectric substrate. is doing.

  Here, the metallized substrate 515 will be described. FIG. 11A is a top view of the metallized substrate 515. FIG. 11B is a bottom view of the metallized substrate 515. The metallized substrate 515 includes a dielectric substrate 528 as its base. As shown in FIG. 11A, a first electrode 516, a second electrode 517, a pad electrode 518, and a damping resistor 519 are formed on the upper surface of the dielectric substrate 528. The first electrode 516 is connected to the pad electrode 518 through a damping resistor 519. The pad electrode 518 is connected to the lead pin 514 through the wire 540. The second electrode 517 is spaced from the first electrode 516, the pad electrode 518, and the damping resistor 519 and is therefore insulated from them. Further, the lower surface of the dielectric substrate 528 is entirely covered with a solid metalized electrode 527 as shown in FIG. 11B.

  The electrode forming method on the upper surface of the metallized substrate 515 is as follows. First, a metal thin film made of a material such as NiCr, Ti, or Mo having excellent adhesion to the dielectric substrate 528 is partially formed on the upper surface of the dielectric substrate 528. For this formation, a mask method or an etching method is used. Thereafter, the portion corresponding to the electrode on the obtained metal thin film is plated with a metal (for example, Au) that is easy to wire and has a small electric resistance. Thereby, the first electrode 516, the second electrode 517, and the pad electrode 518 are formed. A portion that has not been plated becomes a damping resistor 519 because of its high electrical resistance.

  On the first electrode 516 of the metallized substrate 515, as shown in FIG. 10, a photodiode (hereinafter, “PD”) 520 is mounted as a light receiving element. The PD 520 has a chip shape, and one of an anode and a cathode is provided on the upper surface, and the entire lower surface is covered with the other of the anode and the cathode. The PD 520 converts an optical signal incident on its upper surface into an electrical signal. The lower surface of the PD 520 is die-bonded to the first electrode 516, whereby the electrode on the lower surface of the PD 520 is connected to the first electrode 516. As described above, the first electrode 516 is electrically connected to the lead pin 514, and a bias voltage necessary for driving the PD 520 is transmitted from the lead pin 514 through the pad electrode 518, the damping resistor 519, and the first electrode 516. Applied to PD520.

  Note that the metallized substrate 515 also has a role of a capacitor inserted between the electrode (that is, the bias terminal) on the lower surface of the PD 520 and the stem 510 (that is, the ground potential).

  The TIA 522 receives and amplifies the electrical signal output from the PD 520. In an optical receiver used in optical communication, a main circuit is connected to the ROSA 500, and the main circuit includes an amplifier that further amplifies the amplified electric signal. The TIA 522 is a first-stage amplifier in the series of amplifiers.

  The TIA 522 has a chip shape and has four terminal electrodes 523 to 526 on its upper surface. The terminal electrode 523 is a terminal for receiving an electrical signal from the PD 520 and is connected to the electrode on the upper surface of the PD 520 via a wire 541.

  The terminal electrode 524 is a power supply terminal for receiving a power supply voltage, and is connected to the second electrode 517 on the metallized substrate 515 through the wire 542. The second electrode 517 is also connected to the lead pin 513 through another wire 543. The lead pin 513 thus electrically connected to the terminal electrode 524 is connected to a power supply outside the ROSA 500 and supplies a power supply voltage to the TIA 522.

  The terminal electrodes 525 and 526 are differential output terminals for outputting an electrical signal amplified by the TIA 522, where the terminal electrode 525 is a positive phase output terminal and the terminal electrode 526 is a negative phase output terminal. The terminal electrodes 525 and 526 are connected to lead pins 511 and 512 by wiring, respectively. The electrical signal amplified by the TIA 522 is output from the lead pins 511 and 512.

  On the upper surface of the stem 510, a cap with a lens (not shown) that covers the tips of the lead pins 511 to 514, the metallized substrate 515, and the TIA 522 is installed. ROSA 500 further includes an optical fiber (not shown) optically connected to the light receiving portion of PD 520 and a ferrule (not shown) that holds the tip of the optical fiber. The ferrule is housed in a stem 510 or a sleeve (not shown) fixed to the cap. The PD 520 receives an optical signal transmitted through the optical fiber and converts it into an electrical signal.

JP 2007-242708 A

  However, the inventor has found that the above-described conventional ROSA has the following problems. In the conventional ROSA 500 shown in FIG. 10, the PD 520 is mounted on a capacitor. The PD 520 is connected to the lead 514 of the stem 510 via the first electrode 516, the damping resistor 519, the pad electrode 518, and the wire 540. In this case, the length of the wire 543 between the lead pin 513 and the capacitor (second electrode 517) is relatively long at 3 mm. Therefore, in the ROSA 500, noise that flows into the wire 543 from the outside of the ROSA 500 through the lead pin 513 is electromagnetically radiated from the wire 543 inside the ROSA 500.

  In general, the longer the length of a wire (bonding wire), the greater the amount of noise radiated from the wire. As a result, noise radiated from the relatively long wire 543 is superimposed on the wire 541 between the PD 520 and the TIA 522 and the wire 542 between the TIA 522 and the capacitor. As a result, the reception sensitivity of the reception module in which the ROSA 500 is incorporated is lowered.

  An optical receiving subassembly according to an aspect of the present invention includes a conductive stem, a power supply lead and an output lead that penetrate the stem and are insulated from the stem, and the power supply lead and the output lead in a passage hole. A first substrate wiring formed on the substrate and bonded to the power supply lead with a conductive material; A second substrate wiring formed on the substrate and joined to the output lead by the conductive material, and a power signal supplied from the power lead via the first substrate wiring and receiving a received optical signal. A light receiving element that outputs the converted electrical signal to the output lead via the second wiring on the substrate. The optical receiving subassembly which is one embodiment of the present invention can reduce the number of bonding wires connected to the leads and the length of the bonding wires. Thereby, the amount of noise radiated electromagnetically inside the optical receiving subassembly can be reduced.

  According to another aspect of the present invention, there is provided a method of manufacturing an optical receiving subassembly, wherein first and second wirings on a substrate are formed on a substrate made of a dielectric material, penetrate a conductive stem, The insulated power supply lead and the output lead are passed through a passage hole provided on the substrate to place the substrate on the stem, and the power supply lead is made of the conductive material and the first on-substrate wiring. And the output lead is joined to the second on-substrate wiring by the conductive material, and the power supply terminal of the light receiving element that outputs the electric signal converted from the received optical signal is connected to the first on-substrate wiring. And the output terminal of the light receiving element is connected to the second wiring on the substrate. The manufacturing method of the optical receiving subassembly which is one aspect of the present invention can reduce the number of bonding wires connected to the leads and the length of the bonding wires. Thereby, the amount of noise radiated electromagnetically inside the optical receiving subassembly can be reduced.

  According to the present invention, it is possible to provide an optical receiving subassembly capable of reducing electromagnetic radiation of noise inside, an optical receiving module having the same, and a method of manufacturing an optical receiving subassembly capable of reducing electromagnetic radiation of noise inside. it can.

1 is a top view showing a configuration of a ROSA 100 according to a first embodiment. It is sectional drawing of ROSA100 in the IB-IB line | wire of FIG. 1A. It is sectional drawing of ROSA100 in the IC-IC line of FIG. 1A. 1 is a top view showing a structure of a stem 1 according to a first embodiment. It is sectional drawing of the stem 1 in the IIB-IIB line | wire of FIG. 2A. FIG. 6 is a top view showing a manufacturing process of the internal mounting substrate 10 according to the first exemplary embodiment; FIG. 6 is a top view showing a manufacturing process of the internal mounting substrate 10 according to the first exemplary embodiment; 3A and 3B are a top view and a cross-sectional view showing a manufacturing process of the ROSA 100 according to the first embodiment. 3A and 3B are a top view and a cross-sectional view showing a manufacturing process of the ROSA 100 according to the first embodiment. 3A and 3B are a top view and a cross-sectional view showing a manufacturing process of the ROSA 100 according to the first embodiment. It is a graph which shows the relationship between the noise amount radiated | emitted electromagnetically, and the length of a bonding wire. It is a graph which shows the relationship between the power supply noise amount of an optical receiver module, and a receiving sensitivity fall amount. FIG. 6 is a top view showing a configuration of a ROSA 200 according to a second embodiment. It is sectional drawing of ROSA200 in the VIIB-VIIB line | wire of FIG. 7A. FIG. 6 is a top view showing a configuration of a ROSA 300 according to a third embodiment. It is sectional drawing of ROSA300 in the VIIIB-VIIIB line | wire of FIG. 8A. FIG. 6 is a cross-sectional view illustrating a configuration of an optical reception module 400 according to a fourth embodiment. FIG. 6 is a cross-sectional view illustrating a configuration of an optical reception module 400 according to a fourth embodiment. It is a top view which shows the stem upper surface of the conventional ROSA500. It is a top view of the metallized substrate 515 of ROSA500. It is a bottom view of the metallized substrate 515 of ROSA500.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted as necessary.

Embodiment 1
First, an optical reception subassembly (hereinafter referred to as ROSA (Receiver Optical Sub-Assembly)) according to the first embodiment of the present invention will be described. FIG. 1A is a plan view illustrating a configuration of the ROSA 100 according to the first embodiment. 1B is a cross-sectional view of ROSA 100 taken along the line IB-IB in FIG. 1A. 1C is a cross-sectional view of ROSA 100 taken along the line IC-IC in FIG. 1A.

  The stem 1 of the ROSA 100 is made of a conductive material. Stem 1 is connected to ground potential GND. As shown in FIG. 1B, the leads 21 to 24 penetrate the stem 1 and are fixed to the stem 1 through the lead sealing portion 3. The lead sealing portion 3 is provided to insulate the leads 21 to 24 and the stem 1 and to ensure airtightness with respect to the outside. The lead sealing portion 3 is made of, for example, a glass material.

  On the stem 1, an internal mounting substrate 10 is mounted. The internal mounting substrate 10 is made of a dielectric material such as alumina, which is a ceramic material. The internal mounting substrate 10 is provided with through holes for passing the leads 21 to 24. As a result, the leads 21 to 24 protrude on the internal mounting substrate 10.

  As shown in FIG. 1A, the leads 21 to 24 are connected to the on-board wirings 12a to 12d via the solder portions 15a to 15d, respectively. The solder portions 15a to 15d are made of a conductive material such as solder or conductive paste, and join the leads 21 to 24 and the on-board wirings 12a to 12d, respectively. Therefore, the internal mounting substrate 10 is fixed on the stem 1 by providing the solder portions 15a to 15d.

  The leads 21 and 22 are output leads and are differential output terminals for outputting an electric signal amplified by a TIA 3 described later. The lead 23 is a power supply lead and is a power supply terminal of the TIA 3. The lead 24 is a power supply lead and is a power supply terminal of the photodiode 4 described later. A TIA 3, a photodiode 4, and capacitors 5 and 6 are mounted on the internal mounting substrate 10.

  As shown in FIG. 1C, the TIA 3 is mounted on the stem 1 through a TIA mounting hole 31 provided in the internal mounting substrate 10 (FIG. 1C). As shown in FIG. 1A, the TIA 3 is connected to the substrate wirings 12a and 12b via the bonding wires 30a and 30b, respectively. As a result, the TIA 3 outputs a differential signal to the leads 21 and 22. Further, the TIA 3 is connected to the substrate wiring 12c via the bonding wire 30c. As a result, the TIA 3 receives power supply from the lead 23.

  As shown in FIG. 1C, the photodiode 4 is mounted on the stem 1 through a photodiode mounting hole 32 provided in the internal mounting substrate 10. As shown in FIG. 1A, the photodiode 4 is connected to the on-substrate wiring 12d through the bonding wire 30d. As a result, the photodiode 4 receives power supply from the lead 24. That is, the power supply terminal of the photodiode 4 is connected to the power supply lead 24 through the bonding wire 30d and the substrate wiring 12d.

  The photodiode 4 is connected to the TIA 3 via the bonding wire 30e. As a result, the photodiode 4 outputs an electrical signal obtained by photoelectrically converting the received optical signal to the TIA 3. That is, the output terminal of the photodiode 4 is connected to the TIA 3 via the bonding wire 30e.

  One end of the capacitor 5 is connected to the on-board wiring 12c. The other end of the capacitor 5 is connected to the on-board wiring 12f. The on-substrate wiring 12 f is connected to the through wiring 13 that communicates with the back surface of the internal mounting substrate 10. The on-substrate wiring 12f is electrically connected to the stem 1 through the through wiring 13. As a result, the end of the capacitor 5 on the substrate wiring 12f side is at the ground potential GND.

  One end of the capacitor 6 is connected to the on-board wiring 12d. The other end of the capacitor 5 is connected to the on-board wiring 12g. The on-substrate wiring 12g is connected to the through wiring 13 that leads to the back surface of the internal mounting substrate 10. The on-substrate wiring 12g is electrically connected to the stem 1 through the through wiring 14. As a result, the end of the capacitor 6 on the substrate wiring 12g side is at the ground potential GND.

  As shown in FIG. 1C, the through wiring 14 is formed so as to penetrate the internal mounting substrate 10. The inside of the through wiring 14 is filled with, for example, metal. The through wiring 14 may be formed on the internal mounting substrate 10 in advance. The through wiring 14 may be formed by soldering so as to fill the through hole for forming the through wiring 14 from the upper surface side of the internal mounting substrate 10. The same applies to the through wiring 13.

  Therefore, since the through wirings 13 and 14 are electrically connected to the stem 1, the through wirings 13 and 14 function as ground wirings.

  Then, the manufacturing method of ROSA100 is demonstrated. First, the stem 1 is prepared. FIG. 2A is a top view showing the structure of the stem 1. 2B is a cross-sectional view of the stem 1 taken along the line IIB-IIB in FIG. 2A. As shown in FIGS. 2A and 2B, leads 21 to 24 are formed in the stem 1 through the stem 1 via the lead sealing portion 3.

  Next, the internal mounting substrate 10 is produced. 3A and 3B are top views showing the manufacturing process of the internal mounting substrate 10. As shown in FIG. 3A, lead mounting holes H1 to H4 for passing the leads 21 to 24 are formed in the internal mounting substrate 10, respectively. Further, a TIA mounting hole 31 and a photodiode mounting hole 32 are formed in the internal mounting substrate 10. Furthermore, through wirings 13 and 14 are formed in the internal mounting substrate 10. First, on-substrate wirings 12 a to 12 g are formed on the internal mounting substrate 10. A part of the substrate wirings 12a to 12g is formed so as to surround the lead passage holes H1 to H4. Next, as shown in FIG. 3B, capacitors 5 and 6 are mounted (FIG. 3B).

  Next, the internal mounting substrate 10 is mounted on the stem 1. 4A to 4C are a top view showing a manufacturing process of the ROSA 100 and cross-sectional views taken along lines IVA-IVA to IVC-IVC in the respective top views. First, as shown in FIG. 4A, an internal mounting substrate 10 is disposed on the stem 1.

  Next, as shown in FIG. 4B, solder portions 15 a to 15 d are formed using a conductive material such as solder or conductive paste so as to be in contact with the leads 21 to 24 and the on-board wirings 12 a to 12 d. Thus, the internal mounting substrate 10 is fixed on the stem 1. Then, as shown in FIG. 4C, each of the photodiode 4 and the TIA 3 is mounted on the stem 1 via the TIA mounting hole 31 and the photodiode mounting hole 32 of the internal mounting substrate 10. Finally, the bonding wires 30a to 30e are wired to manufacture the ROSA 100 shown in FIGS.

  Next, functions of the ROSA 100 will be described. According to this configuration, the capacitor 5 and the lead 23 are connected by the on-substrate wiring 12c without using a bonding wire. Further, the capacitor 6 and the lead 24 are connected by the on-substrate wiring 12d without using a bonding wire.

  That is, according to this configuration, the number of bonding wires can be reduced by substituting the bonding wires with the substrate on the wiring. Specifically, the bonding wires between the lead 23 and the capacitor 5 and between the lead 24 and the capacitor 6 can be removed. Further, in the ROSA 100, the length of the bonding wire can be shortened. Thereby, the electromagnetic radiation of the noise inside ROSA100 can be reduced.

  In general, power supply noise flowing from the power supply of the optical receiving module on which the ROSA is mounted through the power supply lead of the ROSA is electromagnetically radiated from the bonding wire. FIG. 5 is a graph showing the relationship between the amount of electromagnetic radiation and the length of the bonding wire. Here, the case where the length of the bonding wire in the conventional ROSA is set to, for example, 3.5 mm will be considered. In this case, as shown in FIG. 5, the amount of electromagnetically radiated noise can be reduced to 1/10 or less by removing the bonding wire. As a result, it is possible to prevent a decrease in reception sensitivity due to power supply noise crosstalk of the optical reception module.

  FIG. 6 is a graph showing the relationship between the amount of power supply noise of the optical receiver module and the amount of decrease in reception sensitivity. As shown in FIG. 6, the ROSA 100 according to the present embodiment can reduce the amount of decrease in reception sensitivity as compared with the conventional ROSA.

Embodiment 2
Next, the ROSA 200 according to the second embodiment of the present invention will be described. FIG. 7A is a plan view illustrating a configuration of the ROSA 200 according to the second embodiment. FIG. 7B is a cross-sectional view of ROSA 200 taken along the line VIIB-VIIB in FIG. 7A. As shown in FIGS. 7A and 7B, the ROSA 200 has a configuration in which the internal mounting substrate 10 and the photodiode 4 of the ROSA 100 according to the first embodiment are replaced with the internal mounting substrate 40 and the photodiode 41, respectively.

  The internal mounting substrate 40 is not provided with a photodiode mounting hole, and the photodiode 41 is flip-chip mounted on the internal mounting substrate 40. As shown in FIG. 7B, an on-substrate wiring 12 h is formed on the internal mounting substrate 40 between the TIA 3 and the photodiode 41. The on-substrate wiring 12h is connected to the TIA 3 through the bonding wire 30e.

  One of the anode and the cathode of the photodiode 41 is connected to the substrate wiring 12h by flip chip mounting. The other of the anode and the cathode of the photodiode 41 is connected to the substrate wiring 12c extending from the capacitor 6 by flip chip mounting.

  Therefore, according to this configuration, the bonding wire between the photodiode 41 and the capacitor 6 can be further removed. That is, in the ROSA 200, the bonding wire 30d in the ROSA 100 can be removed. Therefore, according to the present configuration, it is possible to further reduce the amount of noise radiated electromagnetically as compared with the first embodiment.

Embodiment 3
Next, the ROSA 300 according to the third embodiment of the present invention will be described. FIG. 8A is a plan view illustrating a configuration of the ROSA 300 according to the third embodiment. 8B is a cross-sectional view of ROSA 300 taken along line VIIIB-VIIIB in FIG. 8A. As shown in FIGS. 8A and 8B, the ROSA 200 has a configuration in which the internal mounting board 40 and the TIA 3 of the ROSA 200 according to the second embodiment are replaced with the internal mounting board 50 and the TIA 51, respectively.

  The internal mounting board 50 is not provided with a TIA mounting hole, and the TIA 51 is flip-chip mounted on the internal mounting board 50. As shown in FIG. 8B, on-substrate wiring 12 h is formed on the internal mounting substrate 50 so as to extend from the photodiode 41 to the lower part of the TIA 51. Thereby, the photodiode 41 and the TIA 51 are connected.

  The on-substrate wirings 12a to 12c are also formed extending to the lower part of the TIA 51. Thereby, the wirings 12a to 12c on the substrate and the TIA 51 are connected.

  Therefore, according to this configuration, it is possible to further remove the bonding wires between the photodiode 41 and the on-substrate wirings 12a to 12c and the TIA 51. That is, in the ROSA 300, the bonding wires 30a to 30c and 30d in the ROSA 200 can be removed. Therefore, according to this configuration, it is possible to further reduce the amount of noise that is radiated electromagnetically, as compared with the first and second embodiments.

Embodiment 4
Next, an optical receiver module according to Embodiment 4 of the present invention will be described. 9A and 9B are cross-sectional views illustrating the configuration of the optical receiver module 400 according to the fourth embodiment. As shown in FIG. 9A, the optical receiving module 400 includes a ROSA 100. The ROSA 10 is hermetically sealed by covering the lens cap 401 to form a CAN 402. Thereafter, as shown in FIG. 9B, the CAN 402 and the receptacle 403 are disposed at a position where they are optically coupled, and are fixed using an adhesive resin 404. As described above, the optical reception module 400 having the ROSA 100 can be configured.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. For example, the internal mounting substrate is not limited to alumina, and other insulating ceramic materials can be used. For example, the internal mounting substrate can be made of silicon nitride (SiN). Further, the internal mounting substrate may be made of, for example, a plastic resin.

  In the second or third embodiment, when the photodiode and the TIA are flip-chip mounted, the photodiode and the TIA may be mounted on the internal mounting substrate in advance.

  In the fourth embodiment, the ROSA 100 or the ROSA 200 or 300 can be incorporated into the optical receiving module.

1 Stem 3 Lead Sealing Portion 4, 41 Photodiode 5, 6 Capacitor 10, 40, 50 Internal Mounting Substrates 12a-12h
13, 14 Through wirings 15a to 15d Solder portions 21 to 24 Leads 30a to 30e Bonding wire 31 TIA mounting hole 32 Photodiode mounting hole 100, 200, 300, 500 ROSA
400 Optical receiving module 401 Lens cap 402 CAN
403 Receptacle 510 Stem 511 to 514 Lead pin 515 Metallized substrate 516 First electrode 517 Second electrode 518 Pad electrode 519 Damping resistor 520 PD (light receiving element)
523-526 Terminal electrode 527 Metallized electrode 528 Dielectric substrate 540-543 Wire H1-H4 Lead passage hole

Claims (27)

A conductive stem;
A power supply lead and an output lead penetrating the stem and insulated from the stem;
A substrate made of a dielectric, in which the power supply lead and the output lead protrude from the upper surface by passing the power supply lead and the output lead through a passage hole;
A first on-substrate wiring formed on the substrate and bonded to the power supply lead with a conductive material;
A second on-substrate wiring formed on the substrate and bonded to the output lead with the conductive material;
A light receiving element that is supplied with power from the power supply lead through the first wiring on the substrate and outputs an electric signal converted from the received optical signal to the output lead through the second wiring on the substrate. ,
Optical receiver subassembly. The light receiving element is flip-chip mounted on the first wiring on the substrate,
The optical receiver subassembly of claim 1. It further comprises an amplifier that amplifies the electrical signal from the light receiving element and outputs the amplified electrical signal to the output lead via the second wiring on the substrate.
The optical receiving subassembly according to claim 1 or 2. The amplifier is a transimpedance amplifier,
The optical receiver subassembly according to claim 3. The amplifier is flip-chip mounted on the second wiring on the substrate,
The optical receiving subassembly according to claim 3 or 4. A third on-substrate wiring formed on the substrate;
The electrical signal from the light receiving element is output to the amplifier by flip chip mounting the light receiving element and the amplifier on the third substrate,
The optical receiving subassembly according to any one of claims 3 to 5. It further comprises a capacitor having one end connected to the first wiring on the substrate and the other end grounded.
The optical receiving subassembly according to any one of claims 1 to 6. Further comprising a through-wiring penetrating the substrate and electrically connecting the stem and the capacitor;
The capacitor is grounded by grounding the stem,
8. The optical receiving subassembly of claim 7. It further comprises a fourth on-substrate wiring that is formed on the substrate and connects the through wiring and the capacitor.
9. The optical receiver subassembly of claim 8. The conductive material is made of a conductive paste or solder,
The optical receiving subassembly according to any one of claims 1 to 9. The substrate is made of insulating ceramics,
The optical receiving subassembly according to any one of claims 1 to 10. The substrate is made of alumina or silicon nitride,
The optical receiver subassembly of claim 11. The substrate is made of a plastic resin,
The optical receiving subassembly according to any one of claims 1 to 10. Comprising the optical receiver subassembly according to claim 1.
Optical receiver module. Forming first and second on-substrate wirings on a substrate made of a dielectric;
The substrate is disposed on the stem by passing a power supply lead and an output lead that penetrate the conductive stem and are insulated from the stem through a passage hole provided on the substrate.
The power supply lead is joined to the first wiring on the substrate by a conductive material,
Bonding the output lead to the second wiring on the substrate by the conductive material;
Connecting a power supply terminal of a light receiving element that outputs an electric signal obtained by converting a received optical signal to the first substrate wiring, and connecting an output terminal of the light receiving element to the second substrate wiring;
A method of manufacturing an optical receiver subassembly. The light receiving element is flip-chip mounted on the first wiring on the substrate,
The method of manufacturing an optical receiver subassembly according to claim 15. An amplifier for amplifying the electrical signal from the light receiving element and outputting the amplified electrical signal via the second substrate wiring, between the output terminal of the light receiving device and the second substrate wiring Characterized by connecting to the
The method for manufacturing an optical receiving subassembly according to claim 15 or 16. The amplifier is a transimpedance amplifier,
The method of manufacturing an optical receiving subassembly according to claim 17. The amplifier is flip-chip mounted on the second wiring on the substrate,
The method for manufacturing an optical receiver subassembly according to claim 17 or 18. Forming a third wiring on the substrate together with the first and second wirings;
The electrical signal from the light receiving element is output to the amplifier by flip chip mounting the light receiving element and the amplifier on the third substrate.
The method of manufacturing an optical receiver subassembly according to claim 19. One end of the capacitor is connected to the first wiring on the substrate,
The other end of the capacitor is grounded,
21. A method of manufacturing an optical receiver subassembly according to any one of claims 15 to 20. A through wiring that electrically connects the stem and the capacitor is formed through the substrate,
The method of manufacturing an optical receiver subassembly according to claim 21. A fourth on-substrate wiring connecting the through wiring and the capacitor is formed on the substrate;
23. A method of manufacturing an optical receiver subassembly according to claim 22. The conductive material is made of a conductive paste or solder,
24. A method of manufacturing an optical receiver subassembly according to any one of claims 15 to 23. The substrate is made of insulating ceramics,
The method for manufacturing an optical receiving subassembly according to any one of claims 15 to 24. The substrate is made of alumina or silicon nitride,
26. A method of manufacturing an optical receiver subassembly according to claim 25. The substrate is made of a plastic resin,
The method for manufacturing an optical receiving subassembly according to any one of claims 15 to 24.

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