JPH02132973U - - Google Patents
Info
- Publication number
- JPH02132973U JPH02132973U JP4185089U JP4185089U JPH02132973U JP H02132973 U JPH02132973 U JP H02132973U JP 4185089 U JP4185089 U JP 4185089U JP 4185089 U JP4185089 U JP 4185089U JP H02132973 U JPH02132973 U JP H02132973U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printing
- squeegee
- conductive adhesive
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はスクリーンマスクを示す平面図、第２
図はＡエリアにおける印刷時の断面図、第３図は
印刷後の断面図、第４図はＢエリアにおける印刷
時の断面図、第５図は印刷後の断面図、第６図は
Ｃエリアにおける印刷時の断面図、第７図は印刷
後の断面図、第８図は一般的なスクリーン印刷す
る装置の全体概略図である。
１……基板、２……スクリーンマスク、３……
はんだペーストまたは導電性接着剤、４……スキ
ージ、ａ〜ｃ……孔。
Figure 1 is a plan view showing the screen mask, Figure 2 is a plan view showing the screen mask.
The figure is a cross-sectional view of the A area when printing, Figure 3 is a cross-sectional view after printing, Figure 4 is a cross-sectional view of the B area when printing, Figure 5 is a cross-sectional view after printing, and Figure 6 is a cross-sectional view of the C area. FIG. 7 is a cross-sectional view after printing, and FIG. 8 is a general schematic diagram of a general screen printing apparatus. 1...Substrate, 2...Screen mask, 3...
Solder paste or conductive adhesive, 4... Squeegee, a to c... Holes.
Claims (1)
印刷するための多数の孔が形成されたスクリーン
マスクの孔にはんだペーストまたは導電性接着剤
をスキージで押出す装置において、 スキージの印圧をスクリーンマスクの孔の大き
さに応じて小さいほど高くするように構成したは
んだペーストまたは導電性接着剤を基板にスクリ
ーン印刷する装置。[Claims for Utility Model Registration] In a device that uses a squeegee to extrude solder paste or conductive adhesive into the holes of a screen mask that is positioned on a substrate and has a number of holes formed for printing a pattern on the substrate. , An apparatus for screen printing solder paste or conductive adhesive onto a substrate, which is configured to increase the printing pressure of a squeegee as the hole size of the screen mask decreases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4185089U JPH02132973U (en) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4185089U JPH02132973U (en) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132973U true JPH02132973U (en) | 1990-11-05 |
Family
ID=31552871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4185089U Pending JPH02132973U (en) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132973U (en) |
-
1989
- 1989-04-10 JP JP4185089U patent/JPH02132973U/ja active Pending
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