JPH01115272U - - Google Patents

Info

Publication number
JPH01115272U
JPH01115272U JP931288U JP931288U JPH01115272U JP H01115272 U JPH01115272 U JP H01115272U JP 931288 U JP931288 U JP 931288U JP 931288 U JP931288 U JP 931288U JP H01115272 U JPH01115272 U JP H01115272U
Authority
JP
Japan
Prior art keywords
stage
screen printing
printing device
film
suction holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP931288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP931288U priority Critical patent/JPH01115272U/ja
Publication of JPH01115272U publication Critical patent/JPH01115272U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の断面構造を示す図、第
２図は本考案実施例の平面構造を示す図、第３図
は従来例の平面構造を示す図、第４図は従来例の
断面構造を示す図である。 １……フイルム、２……ステージ、３……真空
吸着孔、４……網。 Fig. 1 is a diagram showing the cross-sectional structure of the embodiment of the present invention, Fig. 2 is a diagram showing the planar structure of the embodiment of the invention, Fig. 3 is a diagram showing the planar structure of the conventional example, and Fig. 4 is a diagram showing the planar structure of the conventional example. FIG. 3 is a diagram showing a cross-sectional structure. 1...Film, 2...Stage, 3...Vacuum suction hole, 4...Net.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 吸着孔付ステージに載置されたフイルム上に回
路パターンを導電性インキにより印刷するスクリ
ーン印刷装置において、上記吸着孔付ステージ上
に網を介してフイルムを載置する構造であるスク
リーン印刷装置。 A screen printing device that prints a circuit pattern using conductive ink on a film placed on a stage with suction holes, the screen printing device having a structure in which the film is placed on the stage with suction holes through a net.
JP931288U 1988-01-27 1988-01-27 Pending JPH01115272U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP931288U JPH01115272U (en) 1988-01-27 1988-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP931288U JPH01115272U (en) 1988-01-27 1988-01-27

Publications (1)

Publication Number Publication Date
JPH01115272U true JPH01115272U (en) 1989-08-03

Family

ID=31215948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP931288U Pending JPH01115272U (en) 1988-01-27 1988-01-27

Country Status (1)

Country Link
JP (1) JPH01115272U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078497A (en) * 2006-09-22 2008-04-03 Nitto Denko Corp Underlay substrate, screen printing method, and manufacturing method of wired circuit board
US7851013B2 (en) 2007-03-08 2010-12-14 Nitto Denko Corporation Underlay substrate, screen printing method and manufacturing method of printed circuit substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078497A (en) * 2006-09-22 2008-04-03 Nitto Denko Corp Underlay substrate, screen printing method, and manufacturing method of wired circuit board
JP4646882B2 (en) * 2006-09-22 2011-03-09 日東電工株式会社 Underlay substrate, screen printing method, and printed circuit board manufacturing method
US7908965B2 (en) 2006-09-22 2011-03-22 Nitto Denko Corporation Underlay substrate for printing a printed circuit on a substrate
US7851013B2 (en) 2007-03-08 2010-12-14 Nitto Denko Corporation Underlay substrate, screen printing method and manufacturing method of printed circuit substrate

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