JPH02127040U - - Google Patents
Info
- Publication number
- JPH02127040U JPH02127040U JP3719589U JP3719589U JPH02127040U JP H02127040 U JPH02127040 U JP H02127040U JP 3719589 U JP3719589 U JP 3719589U JP 3719589 U JP3719589 U JP 3719589U JP H02127040 U JPH02127040 U JP H02127040U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- bumps
- metal substrate
- chip
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3719589U JPH0648873Y2 (ja) | 1989-03-30 | 1989-03-30 | マルチチップ実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3719589U JPH0648873Y2 (ja) | 1989-03-30 | 1989-03-30 | マルチチップ実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02127040U true JPH02127040U (US20080094685A1-20080424-C00004.png) | 1990-10-19 |
JPH0648873Y2 JPH0648873Y2 (ja) | 1994-12-12 |
Family
ID=31544087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3719589U Expired - Lifetime JPH0648873Y2 (ja) | 1989-03-30 | 1989-03-30 | マルチチップ実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648873Y2 (US20080094685A1-20080424-C00004.png) |
-
1989
- 1989-03-30 JP JP3719589U patent/JPH0648873Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0648873Y2 (ja) | 1994-12-12 |
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