JPH0212660Y2 - - Google Patents
Info
- Publication number
- JPH0212660Y2 JPH0212660Y2 JP2988182U JP2988182U JPH0212660Y2 JP H0212660 Y2 JPH0212660 Y2 JP H0212660Y2 JP 2988182 U JP2988182 U JP 2988182U JP 2988182 U JP2988182 U JP 2988182U JP H0212660 Y2 JPH0212660 Y2 JP H0212660Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive parts
- key switch
- switch mechanism
- prevention member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002265 prevention Effects 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000000576 coating method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2988182U JPS58133221U (ja) | 1982-03-02 | 1982-03-02 | キ−スイツチ機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2988182U JPS58133221U (ja) | 1982-03-02 | 1982-03-02 | キ−スイツチ機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58133221U JPS58133221U (ja) | 1983-09-08 |
| JPH0212660Y2 true JPH0212660Y2 (enrdf_load_stackoverflow) | 1990-04-10 |
Family
ID=30041643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2988182U Granted JPS58133221U (ja) | 1982-03-02 | 1982-03-02 | キ−スイツチ機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58133221U (enrdf_load_stackoverflow) |
-
1982
- 1982-03-02 JP JP2988182U patent/JPS58133221U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58133221U (ja) | 1983-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5986289A (ja) | モ−ルド回路基板およびその製造方法 | |
| US4675786A (en) | Flexible circuit board and method of making the same | |
| US4440823A (en) | Printed board for electrical circuits | |
| TWI699143B (zh) | 印刷電路板及製造印刷電路板之方法 | |
| US3745094A (en) | Two resist method for printed circuit structure | |
| US5112648A (en) | Method of manufacturing a printed circuit board | |
| JPH02150090A (ja) | プリント配線板の製造方法 | |
| JPH0212660Y2 (enrdf_load_stackoverflow) | ||
| US2823286A (en) | Contacts for electrical circuits and methods for making same | |
| JP2773288B2 (ja) | プリント配線板 | |
| US5686135A (en) | Method of forming an electrically conductive contact on a substrate | |
| JP3044495U (ja) | 突起付フレキシブルプリント配線板 | |
| JP2002216581A (ja) | メタルドーム付きプリント配線板 | |
| US5195238A (en) | Method of manufacturing a printed circuit board | |
| JPH0514418Y2 (enrdf_load_stackoverflow) | ||
| JP2002290000A (ja) | メタルドーム付きプリント配線板 | |
| KR950001266B1 (ko) | 알루미늄 회로기판의 제조방법 및 그 회로기판 | |
| US4992139A (en) | Conductive mask and method of making same | |
| JP3161896B2 (ja) | 金属べ−ス回路基板の製造法 | |
| JPH0419823Y2 (enrdf_load_stackoverflow) | ||
| JPS6233230Y2 (enrdf_load_stackoverflow) | ||
| JP2024122426A (ja) | 配線回路基板 | |
| KR900004078Y1 (ko) | 플렉시블한 인쇄 배선기판 | |
| KR950005717Y1 (ko) | 텔레비젼 수상기의 회로기판 동박 보호 장치 | |
| JP2000058991A (ja) | 印刷回路基板 |