JPH02122548A - マイクロ波集積回路装置用パッケージ - Google Patents
マイクロ波集積回路装置用パッケージInfo
- Publication number
- JPH02122548A JPH02122548A JP27656488A JP27656488A JPH02122548A JP H02122548 A JPH02122548 A JP H02122548A JP 27656488 A JP27656488 A JP 27656488A JP 27656488 A JP27656488 A JP 27656488A JP H02122548 A JPH02122548 A JP H02122548A
- Authority
- JP
- Japan
- Prior art keywords
- package
- aluminum alloy
- integrated circuit
- microwave integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims description 42
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 229910000676 Si alloy Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Plasma Technology (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27656488A JPH02122548A (ja) | 1988-10-31 | 1988-10-31 | マイクロ波集積回路装置用パッケージ |
| EP89119744A EP0366082B1 (en) | 1988-10-28 | 1989-10-24 | Member for carrying semiconductor device |
| DE68926211T DE68926211T2 (de) | 1988-10-28 | 1989-10-24 | Träger für eine Halbleiteranordnung |
| US07/668,794 US5132776A (en) | 1988-10-28 | 1991-03-06 | Member for carrying a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27656488A JPH02122548A (ja) | 1988-10-31 | 1988-10-31 | マイクロ波集積回路装置用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122548A true JPH02122548A (ja) | 1990-05-10 |
| JPH0410223B2 JPH0410223B2 (enrdf_load_stackoverflow) | 1992-02-24 |
Family
ID=17571244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27656488A Granted JPH02122548A (ja) | 1988-10-28 | 1988-10-31 | マイクロ波集積回路装置用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122548A (enrdf_load_stackoverflow) |
-
1988
- 1988-10-31 JP JP27656488A patent/JPH02122548A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410223B2 (enrdf_load_stackoverflow) | 1992-02-24 |
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