JPH02120841U - - Google Patents
Info
- Publication number
- JPH02120841U JPH02120841U JP3063789U JP3063789U JPH02120841U JP H02120841 U JPH02120841 U JP H02120841U JP 3063789 U JP3063789 U JP 3063789U JP 3063789 U JP3063789 U JP 3063789U JP H02120841 U JPH02120841 U JP H02120841U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- container
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 239000003365 glass fiber Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989030637U JPH0723963Y2 (ja) | 1989-03-16 | 1989-03-16 | 混成集積回路の封止容器用金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989030637U JPH0723963Y2 (ja) | 1989-03-16 | 1989-03-16 | 混成集積回路の封止容器用金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02120841U true JPH02120841U (US07655688-20100202-C00010.png) | 1990-09-28 |
JPH0723963Y2 JPH0723963Y2 (ja) | 1995-05-31 |
Family
ID=31255873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989030637U Expired - Lifetime JPH0723963Y2 (ja) | 1989-03-16 | 1989-03-16 | 混成集積回路の封止容器用金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0723963Y2 (US07655688-20100202-C00010.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62224949A (ja) * | 1986-03-27 | 1987-10-02 | S M C:Kk | Icパツケ−ジ |
JPS63129653A (ja) * | 1986-11-20 | 1988-06-02 | Sankyo Kasei Kk | 熱可塑性合成樹脂製回路板およびその製法 |
-
1989
- 1989-03-16 JP JP1989030637U patent/JPH0723963Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62224949A (ja) * | 1986-03-27 | 1987-10-02 | S M C:Kk | Icパツケ−ジ |
JPS63129653A (ja) * | 1986-11-20 | 1988-06-02 | Sankyo Kasei Kk | 熱可塑性合成樹脂製回路板およびその製法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0723963Y2 (ja) | 1995-05-31 |
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