JPH0211794Y2 - - Google Patents
Info
- Publication number
- JPH0211794Y2 JPH0211794Y2 JP18264584U JP18264584U JPH0211794Y2 JP H0211794 Y2 JPH0211794 Y2 JP H0211794Y2 JP 18264584 U JP18264584 U JP 18264584U JP 18264584 U JP18264584 U JP 18264584U JP H0211794 Y2 JPH0211794 Y2 JP H0211794Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- receiving element
- silicone resin
- polyimide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002050 silicone resin Polymers 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000007665 sagging Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は発光素子と受光素子が対向配置され、
光によつて情報の伝達を行なう光結合素子に関す
る。[Detailed description of the invention] [Industrial application field] The present invention has a light-emitting element and a light-receiving element arranged facing each other,
The present invention relates to an optical coupling device that transmits information using light.
本考案は光結合素子において発光素子及び受光
素子をモールドする透明なシリコーン樹脂のダレ
を防止する為に発光素子及び受光素子のリードの
下面にポリイミドフイルムを被着したものであ
る。
In the present invention, a polyimide film is applied to the lower surfaces of the leads of the light-emitting element and the light-receiving element in order to prevent the transparent silicone resin molding the light-emitting element and the light-receiving element from sagging in the optical coupling element.
従来の光結合素子であるホトカプラの一般的な
構造を第２図に示す。発光素子１に上下方向に対
向して受光素子２が設けられ、その間を透明なシ
リコーン樹脂３にて介在せしめ、その周囲を黒色
エポキシ樹脂４でモールドしたものである。５，
５は発光素子１及び受光素子２のリードフレーム
である。しかし、この構造によれば発光素子１の
光が直接受光素子２に伝達される為に伝達効率が
大きい反面、シリコーン樹脂３と黒色エポキシ樹
脂との間の界面状態が不安定である為絶縁耐圧を
大きくすることが困難であつた。又リードフレー
ム５，５と発光素子１及び受光素子２との間を接
続するワイヤー６，６の高さはアセンブリ上のバ
ラツキによつて大きく影響される為、発光素子、
受光素子間の最小電極間距離を精度良く管理する
ことが困難であつた。
FIG. 2 shows the general structure of a photocoupler, which is a conventional optical coupling device. A light receiving element 2 is provided vertically facing a light emitting element 1, a transparent silicone resin 3 is interposed between them, and a black epoxy resin 4 is molded around the light receiving element 2. 5,
5 is a lead frame for the light emitting element 1 and the light receiving element 2. However, with this structure, the light from the light emitting element 1 is directly transmitted to the light receiving element 2, so the transmission efficiency is high, but on the other hand, the interface state between the silicone resin 3 and the black epoxy resin is unstable, so the dielectric strength It was difficult to increase the size. In addition, the height of the wires 6, 6 connecting the lead frames 5, 5 and the light emitting element 1 and the light receiving element 2 is greatly affected by variations in the assembly.
It has been difficult to accurately manage the minimum inter-electrode distance between light-receiving elements.
この点に鑑み従来、発光素子、受光素子間の最
小電極間距離をリードフレームの抜き金型精度の
みで管理し得る、第３図に示す如き反射型ホトカ
プラが開発されている。この反射型ホトカプラは
発光素子１と受光素子２が平面上において対向配
置され、それらが透明なシリコーン樹脂３にてモ
ールドされるものである。 In view of this point, a reflective photocoupler as shown in FIG. 3 has been developed in which the minimum distance between electrodes between a light emitting element and a light receiving element can be controlled only by the accuracy of a lead frame punching die. In this reflective photocoupler, a light emitting element 1 and a light receiving element 2 are arranged facing each other on a plane, and are molded with a transparent silicone resin 3.
しかし、第３図の反射型ホトカプラの構造では
シリコーン樹脂３の粘度があまり大きくない為に
樹脂ダレを生じる。この樹脂ダレは、発光素子１
及び受光素子２上を被うシリコーン樹脂３の量を
少なくし、また反射に必要なモールド形状を維持
できない等の結果となる。そしてこれを回避する
為には発光側及び受光側のリードフレーム５，５
の隙間を大きくすることができず、絶縁耐圧を大
きくできなかつた。
However, in the structure of the reflective photocoupler shown in FIG. 3, the viscosity of the silicone resin 3 is not very high, so resin sag occurs. This resin sag is caused by the light emitting element 1.
This results in a reduction in the amount of silicone resin 3 covering the light receiving element 2, and an inability to maintain the mold shape necessary for reflection. In order to avoid this, lead frames 5, 5 on the light emitting side and the light receiving side
It was not possible to increase the gap between them, and it was not possible to increase the dielectric strength.
〔問題点を解決する為の手段〕
本考案では上記問題点を解決する為に発光素子
及び受光素子のリードの下面にシリコーン樹脂の
ダレを防止するポリイミドフイルムを被着したも
のである。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention covers the lower surfaces of the leads of the light-emitting element and the light-receiving element with a polyimide film that prevents the silicone resin from sagging.
本考案では上記構成により透明なシリコーン樹
脂のダレを防止し、従つて同一平面上のリードの
隙間を大きくしても、シリコーン樹脂によるモー
ルドをなんら支障なく行うことができ、絶縁耐圧
の優れた光結合素子が得られる。
In the present invention, the structure described above prevents the transparent silicone resin from sagging, and even if the gap between the leads on the same plane is large, molding with the silicone resin can be performed without any problem, and the light beam with excellent dielectric strength can be used. A coupling element is obtained.
第１図ａに本考案に係る光結合素子の一実施例
の断面図、第１図ｂにその平面図を示す。
FIG. 1a shows a sectional view of an embodiment of the optical coupling device according to the present invention, and FIG. 1b shows a plan view thereof.
同図で１は発光素子であり、該発光素子１と同
一平面上において対向して受光素子２が配置され
る。５，５は夫々の素子１，２のリードフレーム
である。このリードフレーム５，５の裏面に一体
のポリイミドフイルム７が熱圧着される。この熱
圧着後発光素子１と受光素子２とが透明なシリコ
ーン樹脂３にて一体化される。この際発光側及び
受光側のリードフレーム５，５の中間位置下部に
はポリイミドフイルム７が存在する為シリコーン
樹脂３のダレは生じない。また、ポリイミドフイ
ルム７はリードフレーム５，５間の絶縁性を保つ
に十分な絶縁性を有しており、ポリイミドフイル
ム７の被着によつて絶縁耐圧を下げることがな
い。尚、ポリイミドフイルム７の表面にはエポキ
シ系接着剤が塗布され更に保護フイルムとしてポ
リエステルフイルムが貼付されている。８は外囲
器を形成するエポキシ樹脂であり、シリコーン樹
脂３との界面での光の反射効果を高める為に散乱
用フイラーを含有する白色エポキシ樹脂を用いて
いる。 In the figure, 1 is a light emitting element, and a light receiving element 2 is disposed opposite to the light emitting element 1 on the same plane. 5 and 5 are lead frames of the elements 1 and 2, respectively. An integral polyimide film 7 is thermocompression bonded to the back surfaces of the lead frames 5, 5. After this thermocompression bonding, the light emitting element 1 and the light receiving element 2 are integrated with a transparent silicone resin 3. At this time, the silicone resin 3 does not sag because the polyimide film 7 is present at the lower intermediate position between the lead frames 5, 5 on the light emitting side and the light receiving side. Further, the polyimide film 7 has sufficient insulation to maintain the insulation between the lead frames 5, 5, so that the dielectric strength voltage does not decrease due to the attachment of the polyimide film 7. Incidentally, an epoxy adhesive is applied to the surface of the polyimide film 7, and a polyester film is further attached as a protective film. Reference numeral 8 denotes an epoxy resin forming the envelope, and in order to enhance the light reflection effect at the interface with the silicone resin 3, a white epoxy resin containing a scattering filler is used.
以上の構成により、リードフレーム５，５間の
距離を比較的長く取ることができ、又ポリイミド
フイルム７は絶縁性及び耐熱性に優れているので
絶縁耐圧を高めることができるものである。 With the above configuration, the distance between the lead frames 5 can be made relatively long, and since the polyimide film 7 has excellent insulation properties and heat resistance, the dielectric strength can be increased.
本考案によれば絶縁耐圧に優れた反射型のホト
カプラを得ることができる。
According to the present invention, a reflective photocoupler with excellent dielectric strength can be obtained.
第１図ａは本考案に係る光結合素子の一実施例
の断面図、第１図ｂはその平面図、第２図及び第
３図は従来のホトカプラの断面図を示す。
図中、１：発光素子、２：受光素子、３：シリ
コーン樹脂、５：リードフレーム、７：ポリイミ
ドフイルム、８：エポキシ樹脂。
FIG. 1a is a sectional view of an embodiment of the optical coupling device according to the present invention, FIG. 1b is a plan view thereof, and FIGS. 2 and 3 are sectional views of a conventional photocoupler. In the figure, 1: light emitting element, 2: light receiving element, 3: silicone resin, 5: lead frame, 7: polyimide film, 8: epoxy resin.
Claims (1)
おいて対向配置され、それらを透明なシリコーン
樹脂にて一体化してなる反射型の光結合素子にお
いて、上記発光素子及び受光素子のリードの下面
に上記シリコーン樹脂のダレを防止するポリイミ
ドフイルムを被着したことを特徴とする光結合素
子。 In a reflective optical coupling device in which a light-emitting element and a light-receiving element are placed facing each other on each lead on the same plane and are integrated with a transparent silicone resin, the silicone is applied to the lower surface of the leads of the light-emitting element and the light-receiving element. An optical coupling element characterized by being coated with a polyimide film that prevents resin from sagging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264584U JPH0211794Y2 (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18264584U JPH0211794Y2 (en) | 1984-11-30 | 1984-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197865U JPS6197865U (en) | 1986-06-23 |
| JPH0211794Y2 true JPH0211794Y2 (en) | 1990-04-03 |
Family
ID=30740180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18264584U Expired JPH0211794Y2 (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211794Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009093283A1 (en) * | 2008-01-24 | 2009-07-30 | Hiyoshiya Workshop Co., Ltd. | Illuminator having structure of japanese umbrella |
-
1984
- 1984-11-30 JP JP18264584U patent/JPH0211794Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009093283A1 (en) * | 2008-01-24 | 2009-07-30 | Hiyoshiya Workshop Co., Ltd. | Illuminator having structure of japanese umbrella |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197865U (en) | 1986-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4745294A (en) | Photocoupler with light emitting and receiving elements coupled through a soft resin | |
| JPH0211794Y2 (en) | ||
| JPS63274188A (en) | Optical coupling element | |
| JPH0349403Y2 (en) | ||
| JP3824696B2 (en) | Photocoupler and manufacturing method thereof | |
| CN115241297B (en) | Chip packaging structure and manufacturing method thereof | |
| KR100271423B1 (en) | Light couple device and method manufacture of the same | |
| JPH0451991B2 (en) | ||
| JPS6312181A (en) | Resin-sealed type photo-coupler | |
| JPS6254974A (en) | Optical coupling semiconductor device | |
| JPH0428687U (en) | ||
| JPS61276273A (en) | Switching element | |
| JPS5998565A (en) | Optical coupling element | |
| JPS5911457Y2 (en) | Optical coupling semiconductor device | |
| JP2981355B2 (en) | Manufacturing method of optical coupling device | |
| JPS5889844A (en) | Resin sealed type semiconductor device | |
| JPH0651001Y2 (en) | Optical coupling element | |
| JP4475726B2 (en) | Photo coupler | |
| JPS6237949A (en) | Electronic-part mounting package | |
| JPS62174354U (en) | ||
| JPS63200551A (en) | Lead frame | |
| JPH0614562B2 (en) | Optical coupling device | |
| JPH02288370A (en) | Manufacture of light-coupled device | |
| JPS60206183A (en) | Semiconductor optical coupling device | |
| JPS63253676A (en) | Light-emitting device |