JPH02113456A - Disk substrate manufacturing device - Google Patents
Disk substrate manufacturing deviceInfo
- Publication number
- JPH02113456A JPH02113456A JP26545488A JP26545488A JPH02113456A JP H02113456 A JPH02113456 A JP H02113456A JP 26545488 A JP26545488 A JP 26545488A JP 26545488 A JP26545488 A JP 26545488A JP H02113456 A JPH02113456 A JP H02113456A
- Authority
- JP
- Japan
- Prior art keywords
- stamper
- substrate
- resin material
- recording surface
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 238000013459 approach Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えばレーザ光等の光により情報の記録、
再生、消去を行う媒体としての光デイスク基板の製造装
置に係り、特にその記録面の転写に用いるスタンパの改
良に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to the recording of information using light such as a laser beam,
The present invention relates to an apparatus for manufacturing an optical disk substrate as a medium for reproducing and erasing, and particularly relates to an improvement of a stamper used for transferring a recording surface thereof.
第６図は例えば特開昭６１−３２２３９号公報に開示さ
れたこの種従来の光デイスク基板製造装置を示す断面図
である。図において、（１）はガラスまたは透明樹脂か
らなる基板、（２）は製造工程中、基板（１）の中央に
設けられた穴を塞いでおくための穴塞ぎ治具、（３）は
スタンパで、その表面には記録面（３ａ）が形成されて
いる。このスタンパ（３）は例えば以下のようにして製
作される。即ち、先ずガラス円盤を鏡面研磨し、その表
面にフォトレジストをコーティングし、次にレーザ光に
よってこのレジスト面に露光記録する。これを現像して
得られたレジスト原盤にニッケル電鋳した後、これを剥
離してスタンパ（３）が得られる。そして、このスタン
パ（３）は平板状に製作され、その中央には穴塞ぎ治具
（２１の下端に嵌合する溝（３ｂ）が形成されている。FIG. 6 is a sectional view showing a conventional optical disk substrate manufacturing apparatus of this kind disclosed in, for example, Japanese Patent Application Laid-Open No. 61-32239. In the figure, (1) is a substrate made of glass or transparent resin, (2) is a hole closing jig for closing the hole provided in the center of the substrate (1) during the manufacturing process, and (3) is a stamper. A recording surface (3a) is formed on the surface thereof. This stamper (3) is manufactured, for example, as follows. That is, first, a glass disk is mirror-polished, its surface is coated with a photoresist, and then a laser beam is used to expose and record the resist surface. After developing this and electroforming nickel onto the obtained resist master, this is peeled off to obtain a stamper (3). This stamper (3) is manufactured in the shape of a flat plate, and a groove (3b) that fits into the lower end of the hole closing jig (21) is formed in the center thereof.
（イ）は基台（５１上に取付けられた支柱、（６）は支
柱（４）に摺動可動に取付られ、基板（１）を支持固定
する固定具である。(A) is a support that is attached to the base (51), and (6) is a fixture that is slidably attached to the support (4) and supports and fixes the board (1).
次に以上の装置を使って光デイスク基板を製造する場合
の動作を説明する。先ず、固定具（６）を上方位置にセ
ットした状態で、光デイスク基板の記録層となる紫外線
硬化型の樹脂材料（７）を所定量スタンパ（３）の中央
溝（３ｂ）の部分に置く、ここで、基板（１）の中央の
穴は穴塞ぎ治具（２）で塞いでおく０次に、固定具（６
）を図示しない押圧治具によって徐々に下降させる。す
ると、樹脂材料（７）は中央部から外周部へ向って次第
に押し広げられ、所定の均一な厚さの円板状となる。こ
の状態で紫外線を上方から樹脂材料■に照射すると、硬
化し、第７図に示すように、基板（１）と一体となって
光デイスク基板（８）が出来上がる。そして、樹脂材料
（２）の表面にはスタンパ（３）の記録面（３ａ）が転
写されて記録層（７ａ）が形成されている。Next, the operation of manufacturing an optical disk substrate using the above-mentioned apparatus will be explained. First, with the fixture (6) set in the upper position, a predetermined amount of ultraviolet curing resin material (7), which will become the recording layer of the optical disk substrate, is placed in the central groove (3b) of the stamper (3). , Here, the hole in the center of the board (1) is closed with a hole closing jig (2).
) is gradually lowered using a pressing jig (not shown). Then, the resin material (7) is gradually expanded from the center toward the outer periphery, forming a disk shape with a predetermined uniform thickness. In this state, when the resin material (1) is irradiated with ultraviolet rays from above, it is cured and integrated with the substrate (1) to form an optical disk substrate (8), as shown in FIG. The recording surface (3a) of the stamper (3) is transferred onto the surface of the resin material (2) to form a recording layer (7a).
従来の光デイスク基板製造装置は以上のように構成され
ているので、樹脂材料（７）を円板状に押し広げる過程
でその内部に気泡を巻き込むことがあった。即ち、基板
（１）をスタンパ（３）の方向に押圧して樹脂材料■を
押し広げていく場合、この樹脂材料（７）が絶えず円形
を保ち、樹脂材料■と基板（１）またはスタンパ（３）
との端面が一様連続的に外周方向へ移動すれば気泡は発
生しない、しかし、上記した現象を維持するには、樹脂
材料（７）の粘度や、その使用量、更にはその設置位置
等の諸条件を極めて狭い範囲に保つ必要があり、作業性
から一定の限度がある。そして、気泡が発生すると、ス
タンパ（３１の記録面（３ａ）の形状が正確に転写され
ず、光ディスク基板矧にした場合のエラーレートが増加
することになる。Since the conventional optical disk substrate manufacturing apparatus is configured as described above, air bubbles may be drawn into the interior of the resin material (7) during the process of spreading it out into a disk shape. That is, when pressing the substrate (1) in the direction of the stamper (3) to spread out the resin material (7), the resin material (7) constantly maintains a circular shape and the resin material (1) and the substrate (1) or the stamper ( 3)
If the end face of the resin material (7) moves uniformly and continuously toward the outer periphery, no bubbles will be generated. However, in order to maintain the above phenomenon, the viscosity of the resin material (7), its usage amount, and its installation position, etc. It is necessary to keep the various conditions within an extremely narrow range, and there are certain limits due to workability. If air bubbles are generated, the shape of the recording surface (3a) of the stamper (31) will not be accurately transferred, and the error rate will increase when the optical disc substrate is made small.
この発明は上記のような問題点を解消するためになされ
たもので、製造過程で気泡を巻き込むことがないディス
ク基板製造装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a disk substrate manufacturing apparatus that does not involve air bubbles during the manufacturing process.
この発明に係るディスク基板製造装置は、スタンパをそ
の記録面側が凸となる曲面状の弾性体で形成するととも
に、基板との間で樹脂材料とスタンパとを押圧すること
により、上記樹脂材料を押し広げるにつれて上記スタン
パの記録面が上記基板と平行な平面に近づくように上記
スタンパを順次変形させながら押圧する押圧治具を備え
たものである。In the disk substrate manufacturing apparatus according to the present invention, the stamper is formed of a curved elastic body whose recording surface side is convex, and the resin material is pressed by pressing the resin material and the stamper between the stamper and the substrate. The stamper is equipped with a pressing jig that sequentially deforms and presses the stamper so that the recording surface of the stamper approaches a plane parallel to the substrate as it is spread.
樹脂材料は先ずスタンパの記録面の凸状の部分から押圧
され、押圧が進むにつれて樹脂材料は次第に押し広げら
れる。工程中、スタンパは曲面を呈し、基板とスタンパ
との距離は外周へ向かうにつれて大きくなるので、樹脂
材料と基板またはスタンパとの端面は一様連続的に外周
方向へ移動することになり、気泡を巻き込むことはない
。The resin material is first pressed from the convex portion of the recording surface of the stamper, and as the pressing progresses, the resin material is gradually spread out. During the process, the stamper has a curved surface and the distance between the substrate and the stamper increases toward the outer periphery, so the end surfaces of the resin material and the substrate or stamper uniformly and continuously move toward the outer periphery, preventing air bubbles. There's no getting involved.
押圧が進むにつれてスタンパは平面に近づき、最終的に
は基板と平行な平面となり、従来と同様、所定厚さの平
板状の樹脂材料にスタンパの記録面が転写されることに
なる。As the pressing progresses, the stamper approaches a flat surface, and finally becomes a flat surface parallel to the substrate, and the recording surface of the stamper is transferred to a flat resin material of a predetermined thickness, as in the conventional case.
以下、この発明の一実施例を図について説明する。第１
図において、（１１（５１（７）は従来と同一または相
当部分である。なお、ここでは基板（１）は透明材料か
らなる基台（５］上に置かれている。（９）はスタンパ
で、その記録面（９ａ）側が凸となり、中心点が最下端
となるほぼ球面状に形成されている。第２図。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (11 (51 (7)) is the same or equivalent part as the conventional one. In this case, the substrate (1) is placed on the base (5) made of transparent material. (9) is the stamper. The recording surface (9a) side is convex and is formed into a substantially spherical shape with the center point being the lowest end.FIG.
第３図はこのスタンパ（９）の製造方法を説明する断面
図である。先ず、従来と同様、レジスト原盤にニッケル
を電鋳した後、これを剥離して平板状のスタンパ（９）
を製作する０次に、第２図に示すように、スタンパ（９
）の記録面（９ａ）と反対側の面に、接着剤叫により熱
収縮シート（１１）を張付ける。これを加熱器内に入れ
て全体を所定温度に加熱すると、熱収縮シート（１１）
が均一に収縮し、第３図に示すように、記録面（９ａ）
側が凸となる曲面状のスタンパ（９）が得られ、この状
態で熱収縮シート（１１）を取除いてやればよい、スタ
ンパ（９）はその厚さを適当に選ぶことにより、適当な
弾性を有し、後述する曲面、平面の変形を繰り返すこと
ができる。FIG. 3 is a sectional view illustrating a method of manufacturing this stamper (9). First, as in the past, nickel is electroformed on a resist master, and then this is peeled off to form a flat stamper (9).
Next, as shown in Figure 2, use a stamper (9
) A heat-shrinkable sheet (11) is attached to the surface opposite to the recording surface (9a) using an adhesive. When this is placed in a heater and the whole is heated to a predetermined temperature, a heat shrink sheet (11) is formed.
shrinks uniformly, and as shown in Figure 3, the recording surface (9a)
A curved stamper (9) with convex sides is obtained, and in this state the heat-shrinkable sheet (11) can be removed.The stamper (9) can be made with appropriate elasticity by appropriately selecting its thickness. , and can repeat the deformation of curved surfaces and planes, which will be described later.
再び第１図に戻り、（１２）はスタンパ（９）を上方か
ら下方へ押圧する押圧治具、（１３）は押圧治具（１２
）の下面に取付られな支持具で、スタンパ（９）の外周
を支持する。 （１４）は基台（５１に固定され、押圧
治具（１２）を摺動可能に支持するガイド筒である。Returning to FIG. 1 again, (12) is a pressing jig that presses the stamper (9) from above to below, and (13) is a pressing jig (12) that presses the stamper (9) from above to below.
) supports the outer periphery of the stamper (9). (14) is a guide cylinder fixed to the base (51) and slidably supports the pressing jig (12).
次に動作について説明する。先ず、第１図に示すように
、押圧治具（１２）を上方の位置にした状態で、基板（
１）の中央に紫外線硬化型の樹脂材料■を挿入する。Next, the operation will be explained. First, as shown in FIG. 1, with the pressing jig (12) in the upper position, the substrate (
1) Insert an ultraviolet curable resin material (■) into the center.
次に、押圧治具（！２）を徐々に下降させ、スタンパ（
９）を介して樹脂材料■を基板（１）上に押し広げてい
く、この場合、スタンパ（９）中央の最下端が先ず樹脂
材料（７）に触れ、押圧治具（１２）の下降に従って、
スタンパ（９）が樹脂材料（７）を外周方向へ押し広げ
ていくが、スタンパ（９）が下に凸の曲面状に形成され
ているので、第１図に示すように、基板（１）とスタン
パ（９）の記録面（９ａ）との距離が中心から外周方向
へ向けて確実に増大する構成となっている。従って、樹
脂材料口の粘度等の条件をあまり厳格に管理しなくても
、樹脂材料（７）の外周縁は外向きに安定して移動し、
従来のように局部的に突出して気泡を巻き込むことはな
い。Next, gradually lower the pressing jig (!2) and press the stamper (!
9) to spread the resin material ■ onto the substrate (1). In this case, the bottom end of the center of the stamper (9) first touches the resin material (7), and as the pressing jig (12) descends, the resin material ■ is spread over the substrate (1). ,
The stamper (9) pushes the resin material (7) outward in the outer circumferential direction, but since the stamper (9) has a downwardly convex curved surface, the substrate (1) The distance between the recording surface (9a) of the stamper (9) and the recording surface (9a) of the stamper (9) increases reliably from the center toward the outer circumference. Therefore, even if the conditions such as the viscosity of the resin material opening are not controlled too strictly, the outer peripheral edge of the resin material (7) can stably move outward.
It does not protrude locally and entrap air bubbles as in the conventional case.
そして、押圧治具（１２）の下降が更に進むと、基板（
１）からスタンパ（９）への抗力が次第に増大し、弾性
を有するスタンパ（９）は徐々に平面状に変形し、第４
図に示すように、その記録面（９ａ）は最終的には完全
な平面となる。この状態で紫外線ランプ（１５）により
基台（（５）および基板（１）を介して樹脂材料■に紫
外線を照射し、これを硬化させ基板（１）に固着させる
。このように、スタンパ（９）の記録面（９ａ）が平面
状になった状態で樹脂材料（７）が硬化するので、記録
面（９ａ）からの転写が完全に行われる。Then, as the pressing jig (12) further descends, the substrate (
1) to the stamper (9) gradually increases, the elastic stamper (9) gradually deforms into a flat shape, and the fourth stamper (9) gradually deforms into a flat shape.
As shown in the figure, the recording surface (9a) eventually becomes a completely flat surface. In this state, the ultraviolet lamp (15) irradiates the resin material (1) with ultraviolet light through the base (5) and the substrate (1) to cure it and fix it to the substrate (1). Since the resin material (7) is cured with the recording surface (9a) of 9) in a flat state, the transfer from the recording surface (9a) is completed.
第５図は、樹脂材料ｍの硬化が完了し、押圧治具（１２
）を上昇させたところで、基台（（５）上には樹脂材料
（７）が硬化して基板（１）と一体となった光デイスク
基板（５）が出来上り、スタンパ（９）は押圧力から開
放され再び元の曲面状に戻っている。なお、上記したス
タンパ（９）の反り量としてはその端部から１４０ｍｍ
離れた位置での値で５〜２０ｍｍ程度の範囲に収めるの
が最適であった。Figure 5 shows that the curing of the resin material m has been completed and the pressing jig (12
) is raised, the resin material (7) is cured on the base (5) to form an optical disk substrate (5) that is integrated with the substrate (1), and the stamper (9) is pressed against the pressing force. It is released and returns to its original curved shape.The amount of warp of the stamper (9) described above is 140 mm from its end.
It was optimal to keep the value at a distance in the range of about 5 to 20 mm.
ここで、気泡の巻き込みを防止する場合、スタンパ（９
）を曲面状にする代りに基板（１）を曲面状にすること
も理論上は考えられないことはない、しかし、光デイス
ク基板（８）に使用する基板（１）の材料であるガラス
板や例えばポリメチルアクリレート、ポリカーボネート
のような透明樹脂板は、元々曲げ破断たわみ量が小さく
適当な曲げ変形が得にくい。また、これら樹脂板を曲げ
た場合、内部応力が残りその結果、複屈折を増加させた
りクレージングを生じさせて光学特性や透明度が低下す
る。Here, if you want to prevent air bubbles from getting trapped, use the stamper (9
) It is not inconceivable in theory to make the substrate (1) curved instead of curved. Transparent resin plates such as polymethyl acrylate and polycarbonate originally have a small amount of bending and breaking deflection, making it difficult to obtain appropriate bending deformation. Furthermore, when these resin plates are bent, internal stress remains and as a result, birefringence increases and crazing occurs, resulting in a decrease in optical properties and transparency.
従って、以上説明したようにスタンパ（９）を曲面に形
成するのがよい。Therefore, it is preferable to form the stamper (9) into a curved surface as explained above.
なお、上記実施例では、熱収縮シート（１１）を使用し
てスタンパ（９）を曲面状に変形させるようにしたが、
ニッケル電鋳時に発生するメツキ応力を利用して変形さ
せるようにしてもよい。In addition, in the above embodiment, the stamper (9) was deformed into a curved shape using the heat-shrinkable sheet (11).
The deformation may be performed using plating stress generated during nickel electroforming.
また、スタンパ（９）側を移動させる代りに、基板（１
１ｉｌｌを移動させて樹脂材料（７）を押し広げるよう
にしてもよい。Also, instead of moving the stamper (9) side, the substrate (1
1ill may be moved to spread out the resin material (7).
更に、この発明は光デイスク基板の製造に限られる訳で
はなく、スタンパを樹脂材料に押し当て、その記録面を
転写してディスク基板を製造する装置に広く適用するこ
とができる。Furthermore, the present invention is not limited to the manufacture of optical disk substrates, but can be widely applied to devices that press a stamper against a resin material and transfer the recording surface thereof to manufacture disk substrates.
以上のように、この発明では、スタンパを所定の曲面状
の弾性体で形成し、このスタンパの裏面から押圧治具で
基板を押圧するようにしたので、樹脂材料の外周縁は外
向きに安定して移動し、従来のように局部的に突出して
気泡を巻き込むことはない。As described above, in this invention, the stamper is formed of an elastic body with a predetermined curved surface, and the substrate is pressed from the back side of the stamper with a pressing jig, so that the outer periphery of the resin material is stabilized outward. It does not protrude locally and entrap air bubbles as in the conventional case.
第１図はこの発明の一実施例における光デイスク基板製
造装置を示す断面図、第２図、第３図は第１図のスタン
パの製造方法を説明する断面図、第４図、第５図は第１
図の装置の動作を説明する断面図、第６図は従来の光デ
イスク基板製造装置を示す断面図、第７図は出来上った
光デイスク基板の一部を拡大した断面図である。
図において、（１）は基板、（７）は樹脂材料、（８１
は光デイスク基板、（９）はスタンパ、（９ａ）は記録
面、（１２）は押圧治具である。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing an optical disk substrate manufacturing apparatus according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views explaining a method for manufacturing the stamper shown in FIG. 1, and FIGS. 4 and 5. is the first
FIG. 6 is a cross-sectional view showing a conventional optical disk substrate manufacturing apparatus, and FIG. 7 is an enlarged cross-sectional view of a part of the completed optical disk substrate. In the figure, (1) is the substrate, (7) is the resin material, (81
(9) is a stamper, (9a) is a recording surface, and (12) is a pressing jig. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
挿入して相互に押圧することにより、上記樹脂材料を所
定の厚さに押し広げ、上記スタンパの表面に形成された
記録面を上記樹脂材料に転写してディスク基板を製造す
るものにおいて、上記スタンパをその記録面側が凸とな
る曲面状の弾性体で形成するとともに、上記基板との間
で上記樹脂材料とスタンパとを押圧することにより、上
記樹脂材料を押し広げるにつれて上記スタンパの記録面
が上記基板と平行な平面に近づくように上記スタンパを
順次変形させながら押圧する押圧治具を備えたことを特
徴とするディスク基板製造装置。By arranging a substrate and a stamper facing each other, inserting a resin material between them and pressing them against each other, the resin material is spread to a predetermined thickness, and the recording surface formed on the surface of the stamper is covered with the resin material. In the device for manufacturing a disk substrate by transferring the stamper to the substrate, the stamper is formed of a curved elastic body whose recording surface side is convex, and the resin material and the stamper are pressed between the stamper and the substrate. A disk substrate manufacturing apparatus comprising a pressing jig that sequentially deforms and presses the stamper so that the recording surface of the stamper approaches a plane parallel to the substrate as the resin material is spread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26545488A JPH02113456A (en) | 1988-10-20 | 1988-10-20 | Disk substrate manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26545488A JPH02113456A (en) | 1988-10-20 | 1988-10-20 | Disk substrate manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113456A true JPH02113456A (en) | 1990-04-25 |
Family
ID=17417389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26545488A Pending JPH02113456A (en) | 1988-10-20 | 1988-10-20 | Disk substrate manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113456A (en) |
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1988
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