JP2010058316A - Mold for transferring minute pattern, method for producing the mold and transfer method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for transferring a minute pattern, which can prevent the generation of such a phenomenon that a minute pattern to be formed on one surface of the mold is not transferred to an article to be molded. <P>SOLUTION: The mold 20 for transferring the minute pattern is provided, as one integrated body, with: a mold 21 having one surface 21a, on which the minute pattern P to be transferred to the article 11 to be molded is formed, and the other flat surface 21b on the opposite side of the one surface 21a; and a warp correction plate 22 which is stuck onto the other surface 21b of the mold 21 in heated states and then cooled, shrunken and bent together with the mold 21 in order to beforehand impart the second warp of the direction countervailing against the first warp of the mold 21 to be generated by the reaction force to be received from the article 11 to be molded when the minute pattern P is transferred to the article 11 to be molded. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a fine pattern transfer mold for transferring a fine pattern to a molded product, a method for manufacturing a fine pattern transfer mold, and a transfer method.

  In recent years, a mold (mold) is produced by forming an uneven fine pattern on a quartz substrate or the like by an electron beam drawing method or the like, and the mold is applied to a resist film formed on the surface as a molded article with a predetermined pressure. Research and development has been conducted on nanoimprint technology that presses and transfers a fine pattern formed on the mold (see, for example, Non-Patent Document 1).

  Such nanoimprint technology is applied when forming concave and convex fine patterns on the surface of optical disks, light diffusion plates, diffraction gratings, etc., and interest in methods that utilize nanoimprint technology has increased. It is coming.

  At this time, an imprint method using a lithography technique has been devised as a method for forming a nano-order fine pattern at a low cost. This molding method is roughly classified into a thermal imprint method and a UV imprint method.

  In the thermal imprint method described above, a resin made of a thermoplastic polymer is heated to a temperature at which the resin can flow between the fine pattern formed on one surface of the mold and the surface of the substrate to be molded. After letting the resin flow, the mold is pressed to the substrate side, the mold and the resin are cooled to below the glass transition temperature, the fine pattern of the resin fixed on the surface of the substrate is solidified, and then the mold is pulled apart. Yes.

  On the other hand, in the UV imprint method described above, a transparent mold that can transmit light is used, the mold is pressed against the UV curable liquid applied to the surface of the substrate to be molded, and the UV radiation is applied to the UV curable liquid. The mold is separated after the UV curable liquid is cured and the fine pattern is transferred.

  Here, when applying the nanoimprint technology described above, a micro-embossing apparatus that can prevent misalignment between the mold and the workpiece (molded product) and maintain the parallelism between the mold and the workpiece. (For example, refer to Patent Document 1).

According to the micro-embossing apparatus disclosed in the above-mentioned Patent Document 1 (Japanese Patent Laid-Open No. 2004-34300), although not shown here, the mold supported by the mold support portion and the workpiece support When the workpiece material supported by the part is pressed against each other and the pattern of the mold is transferred to the workpiece, a magnet is arranged on either the mold support part or the workpiece support part, and the magnetic material is placed on the other side. Alternatively, it is disclosed that a magnet is arranged to prevent relative movement in a direction orthogonal to the pressing direction between the mold and the workpiece by a magnetic attraction force.
Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology 25 (2001) 192-199 JP 2004-34300 A

  By the way, in the micro-embossing apparatus disclosed in Patent Document 1 described above, there is no description about adjusting the relative positional relationship between the mold and the workpiece, and a fine pattern transfer that is a kind of precision machining is performed. In general, the alignment adjustment is performed by measuring the relative difference between the mold reference and the workpiece reference by image processing.

  FIG. 5 is a longitudinal sectional view showing a schematic configuration of a general transfer apparatus to which the UV imprint method is applied. FIG. 6 is a diagram of a mold when transferring without providing a backup glass in the transfer apparatus shown in FIG. It is the figure which showed the deformation | transformation state typically.

  As shown in FIG. 5, in a general transfer apparatus 100 for transferring a fine pattern, an ultraviolet curable resin 102 is formed on one surface (upper surface) 101a of a molded product 101. The other surface (lower surface) 101 b of the molded product 101 is held on the molded product holder 103.

  On the other hand, the mold 111 has a concave / convex fine pattern P formed on one surface (lower surface) 111a using a quartz substrate or the like that transmits ultraviolet rays, and the mold 111 is attached to the mold holder 113 via the mold fixing plate 112. The mold 111 is held on the lower surface 113a and is opposed to the molded product 101 with a gap before transfer, and is integrated with the mold 111 and the mold fixing plate 112 by a vertical movement drive mechanism (not shown). The mold holder 113 is movable up and down.

  In addition, the structure which vertically moves the to-be-molded product holding body 103 side without moving the mold holding body 113 side up and down may be sufficient.

  Further, in the transfer apparatus 100, for example, in order to perform transfer by the UV imprint method, through holes 113b, 113c, and 113d are formed in the mold holder 113, and are not shown above the mold holder 113. The ultraviolet ray emitted from the ultraviolet ray generator passes through the through holes 113b, 113c, 113d and the mold 111 and is applied to the upper surface 101a of the article 101 to be pressed by the mold 111. The fine pattern P that is irradiated onto the ultraviolet curable resin 102 that has been formed and transferred onto the ultraviolet curable resin 102 is cured by the ultraviolet light.

  Further, in the transfer apparatus 100, a backup glass 114 that transmits ultraviolet rays is disposed in the through hole 113d of the mold holder 113, and the backup glass 114 is brought into contact with the other surface (upper surface) 111b of the mold 111. The mold 111 is prevented from being deformed by the force received from the molded product 101 during the transfer, so that a uniform transfer can be performed.

  In the transfer device 100, the alignment between the product 101 and the mold 111 may be automatically adjusted, for example. In this case, for example, an alignment mark (not shown) formed on the product 101 and an alignment mark (not shown) formed on the mold 111 are placed in the through hole 113b of the mold holding body 113. Photographing is performed using two provided imaging means (hereinafter referred to as cameras) 115, and the captured image is subjected to image processing to determine the relative position of the molded article 101 with respect to the mold 111. The alignment can be adjusted by moving in the horizontal direction shown in the figure or in a direction perpendicular to the paper surface via an X-axis / Y-axis table (not shown) attached to the holding body 103.

  Note that the two cameras 115 are configured to be retracted from the inside of the through hole 113b of the mold holding body 113 when the above-described ultraviolet rays are irradiated.

  Then, the mold holder 113 is moved relative to the molded article holder 103 integrally with the mold 111 and the mold fixing plate 112 to bring the mold 111 closer to the molded article 101, and the mold 111 holds the molded article 101 with the mold 111. The fine pattern P formed on the one surface 101a of the mold 111 is transferred onto the ultraviolet curable resin 102 formed on the upper surface 101a of the molded product 101 by pressing.

  By the way, when the alignment of the molded product 101 and the mold 111 is automatically adjusted, the focal distance (depth of field) between the photographing lens 116 in the camera 115 and the mold 111 or the molded product 101 is determined. From the relationship, it is desirable to make the camera 115 as close as possible to the mold 111, but since the backup glass 114 is provided, there arises a problem that the camera 115 is separated from the mold 111.

  In order to solve this problem, the camera 115 is brought close to the mold 111, and when the configuration of the transfer apparatus 100 is simplified, the backup glass 114 for pressing the mold 111 is not provided for preventing the mold warpage. When the mold 111 is transferred to the molded article 101, the mold 111, which should originally be flat, is caused by the reaction force received from the molded article 101 by the transfer, as shown by the two-dot chain line in FIG. Warping occurs such that one surface (lower surface) 111a side on which the fine pattern P is formed becomes a concave curved surface, and the other surface (upper surface) 111b side opposite to this one surface (lower surface) 111a becomes a convex curved surface. Deforms very slightly.

  Then, the transfer pressing force is insufficient at the central portion of the mold 111, and a phenomenon (so-called hollowing out phenomenon) occurs in which the fine pattern P provided at the central portion of the mold 111 is not transferred to the molded product 101. There is a problem of end.

  Therefore, when transferring the fine pattern formed on one surface of the mold to the molded product, even if the mold is thin, without providing a backup glass for pressing the mold to prevent mold warpage To provide a fine pattern transfer mold, a method for manufacturing a fine pattern transfer mold, and a transfer device that can prevent the occurrence of a phenomenon in which a fine pattern formed on one surface of a mold is not transferred to a molded product. Objective.

  The invention according to claim 1 is a mold in which a fine pattern to be transferred to a molded product is formed on one surface, and a reaction force received from the molded product when the fine pattern is transferred to the molded product. In order to preliminarily give the mold a second warp in a direction that counteracts the first warp generated in the mold, the mold is cooled and contracted after being bonded on the other surface of the mold in a heated state. This is a fine pattern transfer mold provided integrally with a warp correction plate for bending the mold.

  According to a second aspect of the present invention, when the first warp occurs such that the other surface side of the mold becomes a convex curved surface when the fine pattern is transferred, the other surface of the mold and the 2. The fine pattern transfer mold according to claim 1, wherein the second warp is applied in advance so that the bonding surface side of the warp correction plate becomes a concave curved surface.

  According to a third aspect of the present invention, there is provided a step of forming a fine pattern to be transferred to the molded product on one surface of the mold, and receiving from the molded product when the fine pattern is transferred to the molded product. In order to preliminarily give the mold a second warp in a direction that counteracts the first warp generated in the mold by a reaction force, a warp correction plate was bonded to the other surface of the mold in a heated state. And a step of bending the mold by cooling and contracting it later.

  According to a fourth aspect of the present invention, when the first warp occurs such that the other surface side of the mold becomes a convex curved surface when the fine pattern is transferred, the other surface of the mold and the 4. The method for producing a fine pattern transfer mold according to claim 3, wherein the second warp is applied in advance so that the adhesive surface side of the warp correction plate becomes a concave curved surface.

  The invention according to claim 5 comprises: a molded product holder that holds the molded product; and a mold holder that holds the fine pattern transfer mold according to claim 1 or 2, wherein the fine pattern is provided. The mold holder is moved relative to the molded product holder integrally with the transfer mold, and the molded product is pressed by the fine pattern transfer mold to place the fine pattern on the molded product. This is a transfer method for transferring to a film.

  According to the fine pattern transfer mold of the first and second inventions (inventions 1 and 2), the warp correction plate is adhered to the other surface of the mold on which the fine pattern is formed on one surface. When the fine pattern transfer mold is integrally configured, the second in a direction to cancel the first warp generated in the mold by the reaction force received from the molded product when the fine pattern is transferred to the molded product. In order to preliminarily give the warp to the mold, the warp correction plate is bonded to the other surface of the mold in a heated state and then cooled and bent together with the mold by shrinkage. When the fine pattern is transferred to the molded product, the first warp generated in the mold due to the reaction force received from the molded product and the second warp previously applied to the mold and the warp correction plate are warped in reverse. This offsets and warps the mold for fine pattern transfer. If the fine pattern formed on the mold is transferred onto the molded product in a flat state, the phenomenon that the fine pattern provided at the center of the mold is not transferred to the molded product (so-called hollowing out phenomenon) occurs. Therefore, when the fine pattern transfer mold is pulled away from the molded product after the transfer, the second warp returns to the mold and the warp correction plate so that the molded product can be easily separated. Can be typed.

  According to the method for manufacturing a fine pattern transfer mold of the third and fourth inventions (inventions of claims 3 and 4), in particular, a fine pattern formed on one surface of the mold is molded. In order to pre-apply a second warp to the mold in a direction that cancels the first warp generated in the mold due to the reaction force received from the molded product when transferred to the product, the warp correction plate is placed on the other surface Since it is bonded after being heated and then cooled and curved together with the mold by shrinkage, the same effects as those of the first and second inventions described above can be obtained.

  Further, according to the transfer device of the fifth invention (the invention of claim 5), since the fine pattern transfer mold of the first or second invention is used, the first and second described above. The same effect as that of the present invention can be obtained.

  A fine pattern transfer mold, a method for manufacturing a fine pattern transfer mold, and a transfer apparatus according to the present invention will be described below in detail with reference to FIGS.

  In the fine pattern transfer mold, the fine pattern transfer mold manufacturing method, and the transfer apparatus according to the present invention, when the UV imprint method described in the prior art is applied when transferring a nano-order fine pattern. Although described, the present invention is not limited to this, and the thermal imprint method can also be applied.

FIG. 1 is a diagram schematically showing a fine pattern transfer mold according to the present invention.
FIGS. 2A to 2E are process diagrams shown for explaining a method for manufacturing a fine pattern transfer mold according to the present invention.
FIG. 3 is a longitudinal sectional view showing a configuration of a transfer apparatus to which a fine pattern transfer mold according to the present invention is attached. (A) shows a state before transfer, and (b) shows a state when transferring. Figure,
FIGS. 4A to 4D are process diagrams showing a process of transferring a product to be molded with the fine pattern transfer mold in the transfer apparatus to which the fine pattern transfer mold according to the present invention is attached.

  As shown in FIG. 1, a molded product 11 to be transferred is mounted on a molded product holder 13 as shown by a two-dot chain line, and this molded product 11 is opposed to the molded product 11 in the present invention. Such a fine pattern transfer mold 20 is provided as shown by a solid line.

  In the fine pattern transfer mold 20 according to the present invention described above, the concave and convex fine pattern P for transferring to the product 11 is formed on one surface (lower surface) 21a, and one surface (lower surface) 21a. The mold 21 having the other surface (upper surface) 21b on the opposite side to the mold 21 and the reaction force received from the molded article 11 when the fine pattern P formed on the mold 21 is transferred to the molded article 11 are applied to the mold 21. A warp correction plate 22 is integrally provided on the other surface 21b of the mold 21 in order to preliminarily impart to the mold 21 a second warp in a direction that cancels out the generated first warp. .

  The warpage correction plate 22 is bonded to the other surface 21b using the UV curable resin adhesive 23 in a heated state. After the bonding, the warpage correction plate 22 is cooled and contracted, and the mold 21 Is curved. The warp correction plate 22 is also curved together with the mold 21.

  At this time, the first warp generated in the mold 21 occurs when, for example, the fine pattern P formed on the mold 21 is transferred to the molded product 11 as described above with reference to FIG. There is a warp such that one surface 21a side on which the fine pattern P is formed becomes a concave curved surface, and the other surface 21b side opposite to the one surface 21a becomes a convex curved surface.

  Along with the above, the second warpage preliminarily applied to the mold 21 and the warp correction plate 22 is the other surface (upper surface) 21b of the mold 21 and one surface (lower surface) to be bonded to the surface 21b. ) The warpage is such that the 22a side becomes a convex curved surface. At this time, the warpage correction plate 22 is set to a thickness sufficiently thinner than the thickness of the backup glass 114 described above with reference to FIG.

  Therefore, when one surface 22a of the warp correction plate 22 is bonded onto the other surface 21b of the die 21, the die 21 is deformed along the second warp previously given to the warp correction plate 22 and this die 21. The second warp is applied in advance to the mold 21 due to the reaction force received from the molded article 11 during transfer, and the second warp applied to the mold 21 and the warp correction plate 22 in advance. When the fine pattern P formed on the mold 21 is transferred onto the molded product 11 in a state in which the warp and the warp are offset from each other and offset and the fine pattern transfer mold 20 is flat without warping, the mold 21 Since the phenomenon that the fine pattern P provided in the central portion of the sheet is not transferred to the molded product 11 (so-called hollowing out phenomenon) does not occur, good transfer can be performed and the fine pattern transfer mold 20 can be transferred after the transfer. 11 molded products Has to be able to easily release the object to be molded article 11 since the second warp back against the mold 21 and the warp correction plate 22 when pulled apart.

  Further, when the UV imprint method is applied to the fine pattern transfer mold 20, both the mold 21 and the warp correction plate 22 use a quartz substrate that transmits ultraviolet rays, while the thermal imprint method is used. In the case of application, since it is not necessary to transmit ultraviolet rays to the mold 21 and the warp correction plate 22, an appropriate material may be used.

  Note that the left and right sides of the mold 21 need to be pressed, so that they are formed on inclined surfaces 21c and 21d so that the distance between the left and right gradually increases from one surface 21a to the other surface 21b. It is only necessary to form a flange (not shown) that is recessed by one step from the surface 21.

  Here, the manufacturing method of the fine pattern transfer mold 20 according to the present invention will be described with reference to FIGS.

  First, in the first step shown in FIG. 2A, a mold 21 and a warp correction plate 22 are prepared.

  The above-described mold 21 is formed, for example, by using quartz glass or the like that transmits ultraviolet rays to form a concave / convex fine pattern P on one surface (lower surface) 21a by a well-known electron beam drawing method, and the other surface ( The upper surface 21b is formed flat and the length between the left and right is set to L1.

  On the other hand, the above-described warpage correction plate 22 uses quartz glass or the like made of the same material as the mold 21 to form one surface (lower surface) 22a and the other surface (upper surface) 22b as flat flat plates. The left-right length is set to be the same as the left-right length L1 of the mold 21.

  Next, in the second step shown in FIG. 2B, the UV curable resin adhesive 23 is applied to the other surface 21b of the mold 21 with a uniform film thickness, and the warp correction plate 22 is heated and heated. When inflated, the length L2 between the left and right sides of the warp correction plate 22 is slightly longer than the length L1 between the left and right sides of the mold 21.

  Next, in the third step shown in FIG. 2C, the warpage correction plate 22 is mounted on the ultraviolet curable resin adhesive 23 applied on the other surface 21 b of the mold 21, and from above the warpage correction plate 22. Irradiate ultraviolet rays V. At this time, the warp correction plate 22 is mounted on the die 21 so that the left-right dimension L1 of the die 21 and the left-right dimension L2 of the warp correction plate 22 are symmetrical.

  Next, in the fourth step shown in FIG. 2D, when the irradiation of ultraviolet rays is stopped, the ultraviolet curable resin adhesive 23 is cured and the warp correction plate 22 is placed on the mold 21 via the ultraviolet curable resin adhesive 23. Is glued. Even at this stage, the warp correction plate 22 is thermally expanded.

  Next, in the fifth step shown in FIG. 2E, when the warp correction plate 22 is cooled on the mold 21 with the UV curable resin adhesive 23 bonded thereto, the warp correction plate 22 contracts, As the shrinkage occurs, the warp correction plate 22 is curved together with the die 21, and the other surface (upper surface) 21b of the die 21 and one surface (lower surface) 22a side of the warp correction plate 22 bonded to the surface 21b are convex curved surfaces. A warp such that the length L1 ′ between the left and right is slightly shorter than the initial length L1. Then, the mold 21 having the concave and convex fine pattern P formed on the one surface 21a of the mold 21 and the warp correction plate 22 are integrated to obtain the micropattern transfer mold 20 according to the present invention.

  Here, a transfer apparatus to which the fine pattern transfer mold according to the present invention is applied will be described with reference to FIGS.

  As shown in FIG. 3 (s), in the transfer apparatus 10 to which the fine pattern transfer mold 20 according to the present invention is applied, an ultraviolet curable resin 12 is formed on one surface (upper surface) 11a of the article 11 to be molded. The other surface (lower surface) 11 b of the molded product 11 is held on the molded product holding body 13.

  On the other hand, the fine pattern transfer mold 20 according to the present invention is held on the lower surface 25a of the mold holding body 25 via a mold fixing plate 24, and the fine pattern transfer mold 20 is molded before transfer. The mold holder 25 is vertically movable integrally with the fine pattern transfer mold 20 and the mold fixing plate 24 by a vertical movement drive mechanism (not shown).

  In addition, the structure which moves the to-be-molded product holding body 13 up and down without moving the mold holding body 25 side up and down may be used.

  As described above, in the fine pattern transfer mold 20, the one surface 22a of the warp correction plate 22 is bonded to the other surface 21b of the mold 21 in which the concave and convex fine pattern P is formed on the one surface 21a. The second warp in the direction that cancels the first warp that occurs in the mold 21 due to the reaction force received from the molded article 11 during transfer is applied to the mold 21 and the warp correction plate 22. It is given in advance.

  That is, the fine pattern transfer mold 20 assumes that a first warp occurs so that the other surface 21b side of the mold 21 becomes a convex curved surface when transferring, and then the other surface 21b of the mold 21 and The warp correction plate 22 bonded to the surface 21b is attached to the mold holding body 25 via the mold fixing plate 24 in a state in which a second warp such that one surface 22a side becomes a concave curved surface is provided in advance. .

  Further, in the transfer device 10, for example, through holes 25 b and 25 c are formed in the mold holding body 25 in order to perform transfer by the UV imprint method, and ultraviolet rays (not shown) are provided above the mold holding body 25. A generator is installed, and ultraviolet rays emitted from the ultraviolet generator pass through the through holes 25b and 25c and the fine pattern transfer mold 20 and are pressed by the fine pattern transfer mold 20. A fine pattern (not shown) transferred onto the ultraviolet curable resin 12 is cured by irradiating the ultraviolet curable resin 12 formed on the one surface 11a of the film.

  Further, in this transfer apparatus 10, the alignment between the molded product 11 and the fine pattern transfer mold 20 may be automatically adjusted, for example. In this case, for example, an alignment mark (not shown) formed on the molded article 11 and an alignment mark (not shown) formed on the fine pattern transfer mold 20 are passed through the mold holder 25. Photographing is performed using two imaging means (hereinafter referred to as cameras) 26 provided in the hole 25b, and the captured image is subjected to image processing, so that the molded product 11 is relatively relative to the fine pattern transfer mold 20 The alignment position can be adjusted by moving the actual position in the horizontal direction in the figure or in a direction perpendicular to the paper surface via an X-axis / Y-axis table (not shown) attached to the molded product holder 13.

  Note that the two cameras 26 are configured to retreat to the outside from the inside of the through hole 25b of the mold holding body 25 when the above-described ultraviolet rays are irradiated.

  In the case of this embodiment, since the backup glass 114 previously described with reference to FIG. 5 is not provided, the photographing lens 27 in the camera 26 can be brought as close as possible to the fine pattern transfer mold 20 and alignment adjustment can be performed. Can be performed reliably.

  After aligning the two cameras 26 and retracting the two cameras 26 to the outside of the mold holder 25, as shown in FIG. 3B, the fine pattern transfer mold 20 and the mold fixing are performed. The mold holding body 25 is moved relative to the molded article holding body 13 integrally with the plate 24 to bring the fine pattern transfer mold 20 closer to the molded article 11, and the fine pattern transfer mold 20 uses the molded article 11. Is pressed to transfer the fine pattern P formed on one surface 21a of the mold 21 of the fine pattern transfer mold 20 onto the ultraviolet curable resin 12, and from the upper side of the fine pattern transfer mold 20 to the ultraviolet V Is irradiated onto the ultraviolet curable resin 12, and the fine pattern P transferred onto the ultraviolet curable resin 12 is cured with ultraviolet V.

  Here, when the mold 21 of the fine pattern transfer mold 20 is pressed against the molded product 11, as described above, the other surface 21 b side of the mold 21 has a convex curved surface due to the reaction force received from the molded product 11 during transfer. However, the second warp that gives a convex curved surface is preliminarily applied to the other surface 21b of the mold 21 and one surface 22a of the warp correction plate 22 bonded to the surface 21b. Therefore, the first warp and the second warp cancel each other, so that the fine pattern transfer mold 20 has no warp and is formed into a flat plate shape, which is formed on one surface 21a of the mold 21. The fine pattern P that is present can be satisfactorily transferred onto the ultraviolet curable resin 12 formed on the molded article 11.

  Here, the transfer operation by the UV imprint method will be described more specifically with reference to FIGS.

  First, as shown in FIG. 4 (a), a fine pattern transfer mold in which a warp correction plate 22 is bonded and integrated with an ultraviolet curable resin adhesive 23 on a mold 21 on which a fine pattern P is formed on one surface 21a. 20 is moved in the direction of the arrow toward the ultraviolet curable resin 12 formed on the article 11.

  Next, as shown in FIG. 4 (b), the fine pattern formed on one surface 21 a of the mold 21 by pressing the ultraviolet curable resin 12 formed on the molded product 11 with the fine pattern transfer mold 20. The pattern P is transferred onto the ultraviolet curable resin 12, and the ultraviolet curable resin 12 is cured by irradiating the ultraviolet ray V from above the fine pattern transfer mold 20.

  Thereafter, as shown in FIG. 4 (c), when the fine pattern transfer mold 20 is moved in the direction of the arrow and the fine pattern transfer mold 20 is separated from the molded product 11 side, the fine pattern transfer mold 20 is placed on the molded product 11. The fine pattern P is transferred onto the ultraviolet curable resin 12 that has been formed.

  After the transfer, in the state shown in FIG. 4C, the ultraviolet curable resin 12 to which the fine pattern P has been transferred and cured is used as a masking member, and the uneven fine pattern 11aP is formed on the molded article 11 by etching. After that, if the cured ultraviolet curable resin 12 is removed with a solvent, for example, as shown in FIG. 4 (d), an uneven fine object is formed on one surface (upper surface) 11a of the article 11 to be molded. The pattern 11aP is formed satisfactorily.

It is the figure which showed typically the type | mold for fine pattern transfer which concerns on this invention. (A)-(e) is process drawing shown in order to demonstrate the manufacturing method of the type | mold for fine pattern transfer which concerns on this invention. It is the longitudinal cross-sectional view which showed the structure of the transfer apparatus which attached the type | mold for fine pattern transfer which concerns on this invention, (a) shows the state before transfer, (b) is the figure which showed the state at the time of transfer. is there. (A)-(d) is process drawing which showed the process of transcribe | transferring a to-be-molded product with the mold for fine pattern transfer in the transfer apparatus which attached the mold for fine pattern transfer which concerns on this invention. It is the longitudinal cross-sectional view which showed schematic structure of the general transfer apparatus to which UV imprint method was applied. FIG. 6 is a diagram schematically showing a deformed state of a mold when performing transfer without providing a backup glass in the transfer device shown in FIG. 5.

Explanation of symbols

10: Transfer device,
11 ... Molded product,
11a ... one surface (upper surface), 11a1 ... fine pattern, 11b ... the other surface (lower surface),
12 ... UV curable resin, 13 ... Molded product holder,
20 ... Fine pattern transfer mold,
21 ... Mold, 21a ... One surface (lower surface), 21b ... The other surface (upper surface),
21c, 21d ... inclined surfaces,
22 ... warpage correction plate, 22a ... one surface (lower surface), 22b ... the other surface (upper surface),
23 ... UV curable resin adhesive, 24 ... mold fixing plate,
25 ... Mold holder, 25a ... Lower surface, 25b, 25c ... Through hole,
26: imaging means (camera), 27: photographing lens, P: fine pattern.

Claims (5)

A mold having a fine pattern formed on one surface for transfer to a molded product;
In order to preliminarily give the mold a second warp in a direction that cancels the first warp generated in the mold by a reaction force received from the mold product when the fine pattern is transferred to the mold product. A warp correction plate that curves the mold by cooling and shrinking after bonding in a heated state on the other surface of the mold;
A mold for fine pattern transfer characterized by comprising   As the first warp occurs such that the other surface side of the mold becomes a convex curved surface when the fine pattern is transferred, the other surface of the mold and the adhesive surface side of the warp correction plate are concave curved surfaces. 2. The mold for fine pattern transfer according to claim 1, wherein the second warp is applied in advance. Forming a fine pattern on one side of the mold for transfer to the molded product;
In order to preliminarily give the mold a second warp in a direction that cancels the first warp generated in the mold by a reaction force received from the mold product when the fine pattern is transferred to the mold product. A step of bending the mold by cooling and shrinking after bonding the warp correction plate on the other surface of the mold in a heated state;
A method for producing a mold for transferring a fine pattern, comprising:   As the first warp occurs such that the other surface side of the mold becomes a convex curved surface when the fine pattern is transferred, the other surface of the mold and the adhesive surface side of the warp correction plate are concave curved surfaces. 4. The method for producing a fine pattern transfer mold according to claim 3, wherein the second warp is applied in advance. A molded product holder that holds the molded product;
A mold holder that holds the mold for transferring a fine pattern according to claim 1 or 2,
The mold holder is moved relative to the molded article holder integrally with the fine pattern transfer mold, and the molded article is pressed with the fine pattern transfer mold to apply the fine pattern to the molded pattern holder. A transfer method characterized by transferring onto a molded product.

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