JP2009200345A - Processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing apparatus which has superior pattern transfer property and low mold forming cost while actualizing high-speed transfer. <P>SOLUTION: The processing apparatus presses a mold with a pattern against a material to be processed which is applied to a body to be transferred to transfer the pattern to a substrate WF, and includes a tilting mechanism which tilts the mold ML, a moving mechanism which puts the tilted mold ML and substrate WF close to each other, a rotating mechanism which rotates the mold ML so that the mold ML becomes parallel to the substrate WF when an end of the tilted mold ML comes into contact with the substrate WF, and a control mechanism which controls the position of the end of the mold ML not to move relatively to the substrate WF while the mold ML is rotated by the rotating mechanism. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

    The present invention relates to a processing apparatus, and more particularly to a processing apparatus that transfers a pattern of a mold as an original to a substrate such as a wafer.

    Conventionally, when a fine structure (device such as an electronic circuit, a MEMS, or a grating lens) is manufactured using a lithography technique, a projection exposure apparatus has been used. The projection exposure apparatus transfers a pattern by reducing and projecting a pattern drawn on a reticle (mask) onto a substrate (silicon or glass) coated with a resist (photosensitive agent). A projection exposure apparatus can form a very fine structure, but is very expensive and cannot be easily used.

    On the other hand, nanoimprint, which can form a very fine structure and is a low-cost patterning method, has attracted attention. Nanoimprint is a method of copying a pattern onto a resist by pressing (imprinting) a mold (template) on which a fine pattern is formed by electron beam exposure or the like onto a wafer coated with a resin material as a resist. . In the nanoimprint, if a mold is prepared, it is only necessary to have a stamping mechanism that presses the mold against a resin material, so that fine processing can be realized at low cost.

    Currently, nanoimprints can transfer a fine shape of about 10 nm and have sufficient performance for miniaturization. The nanoimprint is expected to be applied to a new device that has not been manufactured because the projection exposure apparatus is not profitable, and is particularly expected as a means for forming a fine periodic structure of a magnetic recording medium.

    In nanoimprinting, a thermal cycle method, a photocuring method (also referred to as “UV curing type”), and the like are proposed as a transfer method. The thermal cycle method is a method in which a resin to be processed (thermoplastic material) is heated to a glass transition temperature or higher (that is, the fluidity of the resin is increased), a mold is imprinted, and the mold is released after being cooled. On the other hand, the photocuring method is a method in which an ultraviolet curable resin (UV curable resin) is used, and the mold is peeled (released) after being exposed and cured in a state of being stamped with a transparent mold.

    Among these, the photocuring method is suitable for manufacturing a semiconductor element because the temperature can be controlled relatively easily. In manufacturing a semiconductor element, high overlay accuracy (accuracy when overlaying several patterns on a substrate) is required. In the photocuring method, the alignment mark on the substrate can be observed through a transparent mold. Thus, also from the viewpoint of alignment, the photocuring method is suitable for manufacturing a semiconductor element. On the other hand, since the thermal cycle method includes a heating step, it is difficult to maintain the overlay accuracy by thermal expansion due to the temperature rise of the substrate and the mold.

    Further, not only in the manufacture of semiconductor elements, but also in production sites where products are produced in large quantities, the productivity of manufacturing equipment is also required. This is because even if the cost of the manufacturing apparatus is low, the total production cost is not lowered if the production capacity is low.

    Currently, in a generally used exposure apparatus (stepper or scanner), the number of wafers (throughput) that can be processed per unit time is about 150. Therefore, the time required for one transfer by the exposure apparatus is 1 second or less.

    As described above, the transfer of the nanoimprint includes three steps: a stamping step, a curing step, and a release step. Therefore, in order to achieve a throughput equivalent to that of the exposure apparatus by nanoimprinting, it is necessary to perform the above three steps in about 1 second.

    Patent Document 1 proposes a method in which in a stamping process, a mold is inclined and brought into contact with a substrate, and then the mold is pressed parallel to the substrate in order to perform the transfer process at high speed. According to such a method, the process of spreading the dropped UV curable resin over the entire pattern surface can be promoted, so that high-speed transfer is possible.

Patent Document 2 proposes a method of performing transfer by rolling the mold on the substrate while curving and hardening the pattern surface of the mold.
JP-T-2004-505439 Japanese Patent Laid-Open No. 2005-268779

    However, when performing the stamping operation disclosed in Patent Document 1, the following problem occurs.

    14 (a) to 14 (c) are schematic diagrams showing a stamping operation in a conventional processing apparatus shown in Patent Document 1. FIG. This figure shows a stamping operation when pattern transfer is performed on a flat substrate using a mold having a pattern formed on the flat surface.

    The rotation center when adjusting the posture (tilt) of the mold is the center 1004 of the surface on which the pattern of the mold 1001 is formed. As shown in FIG. 14A, in the initial state (initial position) of the seal, the mold 1001 is lowered perpendicularly to the substrate 1002 onto which the UV curable resin 1003 has been dropped in a state that is not parallel to the substrate 1002. Let

    When the mold 1001 is further lowered, an end portion 1005 (below the left end in FIG. 14B) which is the lowest point of the mold 1001 comes into contact with the substrate 1002 first. Further, when the stamping operation (mold lowering operation) is continued, the contact line 1005 that first comes into contact moves while rubbing on the substrate 1002, and finally the surface of the substrate 1002 and the mold 1001 becomes parallel (see FIG. 14 (c)).

    In this case, as described above, the corner portion (end portion 1005) of the mold 1001 rubs on the substrate 1002, so that rubbing occurs between the substrate 1002 and the corner of the mold, or the corner of the mold is damaged. There is a possibility. In order to prevent generation of dust and breakage of the mold, it is conceivable to perform a stamping operation (mold lowering operation) at a very low speed. However, in that case, the purpose of performing the transfer operation at high speed cannot be achieved.

    On the other hand, as shown in Patent Document 2, in the method of rolling a curved pattern surface on a substrate, the mold does not rub on the substrate, so that problems such as generation of dust do not occur. However, since the transfer pattern must be formed on the curved surface, the mold production process becomes complicated and the mold production cost increases. Further, in a state where the UV curable resin is not cured, a series of operations from curing to release is continuously performed at the same position. For this reason, the problem that transferability will deteriorate remarkably arises.

    Accordingly, an object of the present invention is to provide a processing apparatus that is excellent in pattern transferability and mold creation cost while realizing high-speed transfer.

    A processing apparatus according to an aspect of the present invention is a processing apparatus that presses a mold on which a pattern is formed against a material to be processed applied to a transfer object, and transfers the pattern to the transfer object. A tilting mechanism for tilting, a moving mechanism for bringing the tilted mold close to the transferred body, and an end of the tilted mold contacting the transferred body, the mold becomes parallel to the transferred body. And a control mechanism for controlling the position of the end of the mold so as not to move with respect to the transfer target while the mold is rotated by the rotation mechanism.

    Other features and objects of the present invention are illustrated in the following examples.

    ADVANTAGE OF THE INVENTION According to this invention, the processing apparatus excellent in pattern transfer property and mold creation cost can be provided, implement | achieving high-speed transcription | transfer.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

    The processing apparatus of the present embodiment is a processing apparatus that presses a mold (original plate) on which a pattern is formed against a material to be processed applied to a transfer target (substrate) and transfers the pattern to the transfer target. The processing apparatus of the present embodiment is, for example, a processing apparatus that uses nanoimprint technology, and is suitably used for performing fine processing such as semiconductors and MEMS (Micro Electro-Mechanical Systems).

    FIG. 1 is a schematic diagram showing a stamping operation in the processing apparatus (imprint apparatus) of the present embodiment. FIGS. 1A to 1C show the positional relationship between the mold ML and the substrate WF at the time of (a) the start of stamping, (b) at the time of contact, and (c) at the time of completion of stamping, respectively.

    In FIG. 1A, UVR is a UV curable resin dropped on the substrate WF. The mold ML is located at a position (downward) away from the substrate WF onto which the UV curable resin UVR has been dropped. At this time, the mold ML is inclined at a predetermined angle with respect to the substrate WF. A fine pattern (not shown) is formed on the lower surface of the mold ML.

    When the mold ML is brought closer to the substrate WF, as shown in FIG. 1B, the mold ML contacts the substrate WF with the end portion (end point, end line) of the mold ML as a contact point. With this contact point (contact portion) as the rotation center (axis), the pattern surface of the mold ML is made parallel to the substrate WF while rotating the mold ML clockwise.

    As shown in FIG. 1C, the stamping operation is completed when the mold ML is parallel to the substrate WF.

    First, a stamping operation is performed while rotating the mold ML around the contact point (contact portion) between the mold ML and the substrate WF. For this reason, as shown in FIG. 1B, the UV curable resin UVR gradually spreads in the right direction in the figure. At the same time, bubbles mixed in the resin are pushed rightward. As described above, in the processing apparatus of this embodiment, the UV curable resin UVR is spread in one direction, so that there is a low possibility that bubbles are mixed in the resin, and a good transfer pattern can be obtained in a short time. Can do.

    Further, since the contact point between the substrate WF and the mold ML is the center of rotation, the contact point is not rubbed after both contact at the contact point. For this reason, generation | occurrence | production of a particle is reduced and the yield improvement can be anticipated. In addition, the possibility of the mold breaking due to friction is reduced.

    Next, the structure of the processing apparatus (nanoimprint apparatus) in Example 1 is demonstrated. FIG. 2 is a schematic configuration diagram of a processing apparatus according to the first embodiment. The processing apparatus of the present embodiment is a photo-curing nanoimprint apparatus.

    In the nanoimprint apparatus 1 of this example, the mold ML on which the three-dimensional pattern is formed is pressed against the substrate WF coated with the UV curable resin UVR. The UV curable resin UVR is cured by irradiating ultraviolet rays in a state where the mold ML is pressed against the substrate WF. After the UV curable resin UVR is cured, when the mold ML is pulled up and separated from the substrate WF, the pattern formed on the mold ML is transferred onto the substrate WF.

    In this embodiment, the apparatus is a step-and-repeat type apparatus that transfers a plurality of mold pattern shots onto the substrate WF, and also includes an alignment mechanism that aligns the substrate WF and the pattern on the mold ML.

    The configuration of the nanoimprint apparatus 1 of the present embodiment will be described with reference to FIG. The nanoimprint apparatus 1 includes a mold driving mechanism that holds and drives the mold ML, and a substrate driving mechanism that holds and drives the substrate WF.

    The mold driving mechanism includes an inclination mechanism that adjusts the posture (inclination angle) of the mold ML, and moves the mold ML in the Z direction (up and down direction) to press (contact) the mold ML against the substrate WF (transfer object). It has a moving mechanism.

    The substrate driving mechanism has a function of holding the substrate WF as a transfer target in the apparatus and a function of moving the substrate WF in accordance with positioning.

    In addition to the above mechanism, the nanoimprint apparatus 1 includes an illumination optical system for irradiating ultraviolet rays for curing the UV curable resin UVR, a microscope for accurately measuring the positions of the substrate WF and the mold ML, and UV curing on the substrate WF. A coating apparatus for coating the resin UVR is provided.

    The nanoimprint apparatus 1 is configured on a surface plate. A substrate transport mechanism is installed on the surface plate. Further, a mold driving mechanism, a microscope, an illumination optical system, a coating device, and the like are fixed to a frame installed on the surface plate.

    Hereafter, each part in the nanoimprint apparatus 1 of a present Example is demonstrated in detail.

    Reference numeral 100 denotes a mold stage. The mold stage 100 is used to hold the mold ML and change the posture (inclination angle) of the mold ML. The mold stage 100 has at least a mold tilt stage 101 described later.

    ML is a mold that is a master of a transfer pattern. A fine transfer pattern is three-dimensionally formed on the lower surface of the mold ML (the surface facing the substrate WF). The pattern formed on the mold ML is, for example, a line and space pattern in which a plurality of grooves having a width of 50 nm and a depth of 100 nm are formed.

    The mold ML is made of a material that transmits ultraviolet rays, such as quartz. This is because the ultraviolet rays irradiated from the back surface of the mold ML (the surface opposite to the surface on which the pattern is formed) pass through the mold ML and irradiate the UV curable resin UVR with the ultraviolet rays.

    The mold ML is held on a mold tilt stage 101 (mold holding means). The mold tilt stage 101 holds the mold ML by vacuum chucking, electrostatic chucking, or mechanical clamping. The mold tilt stage 101 is located below a mold Z driving unit 103 described later, and the posture (tilt angle) of the mold ML can be freely changed in directions around the X axis and Y axis in the drawing. is there.

    A mold position reference mirror 102 is attached to the mold tilt stage 101 on the right side surface. The mold position reference mirror 102 is a reference mirror for measuring the posture (tilt angle) of the mold ML with a laser length measuring device. The mold position reference mirror 102 measures two positions separated in the Z direction, and detects the posture (tilt angle) of the mold tilt stage 101 from the difference therebetween. Thus, the mold position reference mirror 102 is used as a measurement unit that measures the inclination of the mold ML.

    Reference numeral 109 denotes a mold measurement laser beam. The mold measuring laser beam 109 is a measuring beam of a laser length measuring device (not shown).

    Reference numeral 103 denotes a mold Z driving unit (moving mechanism). The mold Z driving unit 103 is held by a linear motion guide 108 and is configured to be able to move the mold stage 100 in the Z direction (up and down direction). The mold Z drive unit 103 is connected to the mold Z drive unit 104 via a load sensor 105 at the upper part thereof.

    Similar to the mold Z drive unit 103, the mold Z drive unit 104 is held on the frame by the linear motion guide 108, and is configured to be movable in the Z direction. The mold Z drive unit 104 is held rigidly so that it cannot move or rotate in directions other than the Z direction. The mold Z drive unit is connected to the ball screw 106 via a ball nut (not shown).

    Reference numeral 107 denotes a motor. The motor 107 is configured to move the mold Z driving unit 104, the load sensor 105, and the mold Z driving unit 103 in the Z direction by rotating the ball screw 106. Thus, the mold Z driving unit 103, the mold Z driving unit 104, the load sensor 105, the ball screw 106, and the motor 107 function as a moving mechanism that brings the inclined mold ML close to the substrate WF.

    Since the load sensor 105 is disposed between the mold Z drive unit 103 and the mold Z drive unit 104, the load sensor 105 can detect a load applied to the mold ML.

    An illumination optical system 401 is held inside the mold Z driving unit 103. The illumination optical system 401 includes a light source and a lens group that generate ultraviolet rays therein, and irradiates the UV curable resin UVR with ultraviolet rays emitted from the light source. Illumination light composed of ultraviolet rays is emitted from the illumination optical system 401, passes through the mold ML from the back surface (upper surface) of the mold ML through an opening (not shown) provided in the mold Z driving unit 103, and uses the UV curable resin UVR. Harden.

    Reference numeral 200 denotes a wafer stage. The wafer stage 200 is for holding the substrate WF, which is a transfer target, in the apparatus and moving it in the XY directions. The substrate WF is detachably held on the wafer chuck 201 by vacuum suction, and the wafer chuck 201 is attached on the wafer stage main body 202. The wafer stage 200 includes at least a wafer chuck 201 and a wafer stage main body 202.

    In addition to the wafer chuck 201, a mold height sensor 205 is provided on the upper part of the wafer stage main body 202. A wafer position reference mirror 203 is held on the right side surface of the wafer stage main body 202. Reference numeral 204 denotes a wafer measurement laser beam. Wafer measurement laser light 204 is measurement light from a laser length measuring device (not shown). The position of the wafer position reference mirror 203 is measured by the wafer measurement laser beam 204. For this reason, the position of the substrate WF can be accurately detected.

    Reference numeral 302 denotes a frame. The frame 302 is fixed on the surface plate 301. The frame 302 holds the above-described mold Z driving units 103 and 104, the microscope 601, and the coating apparatus 501, and has a role of supporting the entire nanoimprint apparatus 1.

    The nanoimprint apparatus 1 is installed on the floor via a vibration isolation device 303. The vibration isolation device 303 supports the entire nanoimprint apparatus 1 and is installed on the floor, thereby blocking vibration from the floor and reducing positioning errors due to vibration.

    Next, the mold tilt stage 101 will be described in detail. FIG. 3 is an enlarged view of the periphery of the mold stage in the processing apparatus of this embodiment.

    As shown in FIG. 3, the mold tilt stage 101 includes a mold chuck 111, a mold actuator 112, and a mold stage support portion 113.

    The mold chuck 111 (tilting mechanism) is supported by the mold stage support 113 by a bearing mechanism so as to be rotatable in the direction around the Y axis. In order to control the rotation position, the mold actuator 112 (rotation mechanism) is installed between the mold chuck 111 and the mold stage support part 113. By extending and contracting the mold actuator 112, the posture of the mold ML can be rotated around the Y axis.

    As is apparent from FIG. 3, the center of rotation is away from the pattern surface of the mold in the Z direction. For this reason, the position of the mold pattern surface also shifts in the X direction depending on the posture of the mold. However, this configuration is excellent in cost because it can easily achieve high rigidity using a bearing. Although only the posture around the Y axis is described here, an arbitrary posture can be realized by adopting the same configuration around the X axis.

    Next, the operation of the processing apparatus (nanoimprint apparatus 1) will be described with reference to FIGS.

    The mold ML is carried into the apparatus by a mold conveyance system (not shown), and the mold ML is mounted on the mold chuck 111. The height of the surface (the surface on which the pattern is formed) of the mold chuck 111 is measured by a mold height sensor 205 mounted on the wafer stage 200. Then, the posture of the mold ML is adjusted so that the mold ML is parallel to the XY plane.

    Thereafter, the substrate WF as a transfer substrate is carried into the apparatus, and the substrate WF is held on the wafer chuck 201. When aligning the mold ML and the substrate WF, the position of the substrate WF on the apparatus is measured by the microscope 601 and the wafer stage positioning command value is corrected. Then, the UV curable resin UVR is dropped on the substrate WF by the coating device 501 and the substrate WF is moved to the transfer position.

    FIG. 4 shows the state of the mold stage at the start of the stamping operation. As shown in FIG. 4, in the stamping operation, the mold chuck 111 (tilting mechanism) first tilts the mold ML, so that the posture of the mold ML is tilted. Thereafter, the mold Z that is tilted is brought close to the substrate WF by the mold Z drive unit 103 (movement mechanism). In the present embodiment, the motor 107 as a moving mechanism drives the inclined mold ML downward. When the mold ML comes into contact with the substrate WF in an inclined state, the mold actuator 112 (rotation mechanism) rotates the mold ML so that the mold ML is parallel to the surface of the substrate WF. The processing apparatus of the present embodiment includes a control mechanism for keeping the relative positional relationship between the end of the mold ML and the substrate WF constant.

    FIG. 13 is a block diagram showing a control mechanism of the machining apparatus in the present embodiment. As shown in FIG. 13, the position or the inclination angle of the mold ML is changed by the moving mechanism and the rotating mechanism. The control mechanism detects the tilt angle of the mold ML, and changes the position of the substrate WF, which is a transfer target, based on the detected tilt angle. According to such a control mechanism, it is possible to control the position of the end portion of the mold ML so as not to move with respect to the substrate WF (wafer stage 200) while the mold ML is rotated by the rotation mechanism.

    Hereinafter, the stamping operation will be described in detail. FIGS. 5A to 5E sequentially show states in the stamping operation of this embodiment.

    FIG. 5A shows a state (first state) before the start of stamping. At this time, the mold ML is inclined by an angle θ with respect to the plane of the substrate WL. In this first state, Z driving is performed on the mold ML by the motor 107, and the mold ML is lowered. FIG. 5B shows a second state during the lowering of the mold ML.

    As the mold ML is lowered, the end of the mold ML comes into contact with the substrate WF. FIG. 5C shows a third state in which the end portion of the mold ML is in contact with the substrate WF at the landing point (contact point).

    When the end of the mold ML comes into contact with the substrate WF, the mold ML is rotated using a rotation mechanism. The mold actuator 112 (rotation mechanism) rotates the mold ML around the contact point (line) as the rotation center so that the mold ML is parallel to the surface of the substrate WF, and corrects the posture of the mold ML.

    Here, the rotation center of the mold stage 100 and the position of the contact point (landing point) do not match. For this reason, it is necessary to move the wafer stage 200 in the −X direction in accordance with the posture change of the mold ML.

    Specifically, the control mechanism includes a mold position reference mirror 102 (measurement unit) that measures the inclination of the mold ML, and a drive unit (not shown). The drive unit moves the wafer stage 200 (substrate WL) based on the measurement result by the measurement unit.

    FIG. 5D shows a fourth state in the middle. In the fourth state, the mold ML is rotated by an angle α from the initial posture of the mold ML that is inclined by the angle θ. At this time, wafer stage 200 (substrate WF) has moved by ΔXα. The UV curable resin is filled in the pattern surface of the mold ML so as to be pushed out from the left side to the right side in the drawing.

    FIG. 5E shows a fifth state in which the stamping operation is completed. In this state, the mold ML and the substrate WF are parallel to each other, and the UV curable resin UVR is filled on the entire pattern of the mold ML. Wafer stage 200 (substrate WF) has moved by ΔX.

    As described above, while the mold ML is lowered in the Z direction by the moving mechanism, the posture of the mold ML in the rotation direction (around the Y axis) and the wafer stage 200 (X direction) are operated in a coordinated manner. Therefore, it is possible to realize a stamping operation with the contact point (line) where the mold ML and the substrate WF first contact each other as the rotation center. According to the configuration of the present embodiment, the mold ML and the substrate WF are not rubbed during the stamping process, so that generation of particles and damage to the mold ML can be prevented.

    Next, the operation of each part at the time of stamping will be described in detail with reference to FIGS. 6 (A) and 6 (B). FIGS. 6A and 6B show changes in the mold posture, the Z position of the mold, and the X position of the wafer stage, respectively.

    FIG. 6A is a diagram for explaining a control method in the stamping operation. In FIG. 6A, the position of the mold ML in the initial state is indicated by a dotted line, and the time when the mold ML comes into contact is indicated by a solid line. In the initial state, the mold ML is at a position separated from the substrate WF by Z0. Further, the mold ML is inclined by an angle θ with respect to the Z axis. The posture change amount after the mold ML contacts the substrate WF is defined as α.

    FIG. 6B is a graph showing an example of the movement amount (control amount) of each axis in the stamping operation. The posture of the mold ML is constant at an angle θ before contact, and is corrected so that the inclination gradually decreases after contact. The Z position of the mold descends at a constant speed before and after contact. The X direction of the wafer stage does not change before contact and starts to change after contact. At this time, the wafer stage 200 moves in the −X direction according to the Z position of the mold and the attitude of the mold.

    These three control amounts are uniquely determined and are driven in a coordinated manner by a moving mechanism, a rotating mechanism, and a driving unit. When it is necessary to superimpose the pattern of the mold ML and the pattern previously formed on the substrate WF, the initial position of the wafer stage 200 is corrected so that the alignment of the wafer stage 200 coincides at the end of the stamping. The

    Here, the description has been made on the assumption that the three control amounts are controlled by a driving system including a moving mechanism, a rotating mechanism, and a driving unit. However, it is not limited to this. For example, as in Example 3 to be described later, another mold may be driven freely by performing Z driving of the mold.

    When the stamping operation is completed by the above-described control, the illumination optical system 401 irradiates illumination light to cure the UV curable resin UVR. After the UV curable resin UVR is cured, the mold ML is released from the substrate WF by driving the mold Z driving unit 103 (moving mechanism). After the mold release, a replica pattern of the pattern formed on the mold ML is formed on the substrate WF.

    Thus, the transfer for one shot on the substrate is completed. When performing a plurality of transfers on a single substrate, the wafer stage 200 is driven, a UV curable resin is applied to the next shot position, and the above operation is repeated to perform the transfer over the entire surface of the substrate. it can. When all the transfer is completed on the substrate, the substrate is unloaded, the next transfer substrate is loaded, and the same operation as described above is repeated.

    Next, a processing apparatus in Embodiment 2 of the present invention will be described.

    FIG. 7 is an enlarged view around the mold stage of the processing apparatus according to the second embodiment. The processing apparatus shown in FIG. 7 is an imprint apparatus similar to that of the first embodiment. FIG. 7 shows only the periphery of the mold stage as in FIG. In addition, the same code | symbol is attached | subjected to the member showing the function similar to Example 1, and the description is abbreviate | omitted.

    The difference between the second embodiment and the first embodiment is that the mold ML is approximately the same size as the substrate WF, and the pattern can be transferred to the entire surface of the substrate WF by a single transfer operation.

    The mold ML has such a size that the entire surface of the substrate WF can be transferred at once. A pattern to be transferred is formed on the lower surface of the mold ML, and the back surface (upper surface) is held by the mold chuck 111. The mold chuck 111 includes holding means such as a vacuum suction means, an electrostatic suction means, and a mechanical clamp.

    The mold chuck 111 (tilting mechanism) is held by the mold Y stage 121 via a rotation guide mechanism such as a bearing. The mold chuck 111 is rotatable in the direction around the Y axis with the rotation guide as an axis.

    A mold actuator 112 (rotating mechanism) is disposed between the mold Y stage 121 and the mold chuck 111. The mold actuator 112 is an actuator that expands and contracts in the Z direction. When the mold actuator 112 expands and contracts, the posture of the mold chuck 111 can be changed in the direction around the Y axis.

    The mold Y stage 121 is attached to the mold X stage 123 via a mold Y guide 122. The mold Y guide 122 is a linear motion guide. The mold X stage 123 is connected to the mold Z driving unit 103 via the mold X guide 124.

    The mold X guide 124 is also a linear motion guide similar to the mold Y guide 122, and is a guide for movement of the mold X stage 123 in the X direction. As described above, the mold stage in the XY direction and the tilt direction is configured below the mold Z driving unit 103.

    The stamping operation in the second embodiment is the same as that in the first embodiment. In the initial state, the mold ML is inclined with respect to the substrate WF. The stamping is started by lowering the mold ML by the moving mechanism (mold Z driving unit 103). When the end (end point, end line) of the mold ML comes into contact with the substrate WF, the mold actuator 112 (rotation mechanism) causes the mold ML to be parallel to the substrate WF with the contact point (line) as the rotation center axis. To drive. At the same time, the mold X stage 123 (driving unit) drives the mold ML in the X direction so that the contact point does not move.

    As described above, in this embodiment, the mold X stage 123 and the mold actuator 112 perform the stamping operation while moving the mold ML according to the mold Z driving amount.

    The driving amount of the mold in the Z direction, the moving amount of the mold X stage, and the moving amount of the mold tilt are the same as those in the graph shown in FIG. By simultaneously controlling the three control amounts, the point where the mold first contacts the substrate is not rubbed. For this reason, generation | occurrence | production of a particle and damage to a mold can be prevented, and it becomes possible to perform a stamping operation stably.

    Next, a processing apparatus in Embodiment 3 of the present invention will be described.

    FIG. 8 is an enlarged view around the mold stage of the processing apparatus according to the third embodiment. The processing apparatus shown in FIG. 8 is an imprint apparatus similar to that of the first embodiment. FIG. 8 shows only the periphery of the mold stage as in FIG. In addition, the same code | symbol is attached | subjected to the member showing the function similar to Example 1, and the description is abbreviate | omitted.

    In the first and second embodiments, it is necessary to simultaneously control three amounts of the mold Z driving amount, the mold rotation driving amount, and the X movement amount of the wafer stage (or the mold X stage driving amount). On the other hand, in the third embodiment, only the mold Z driving amount is driven to detect a change in the posture of the mold ML. Then, the wafer stage is driven according to the change in the posture of the mold ML.

    The overall configuration of the processing apparatus is the same as that of the first embodiment, but the configuration of the mold tilt stage 101 is different from that of the first embodiment. Specifically, a spring 141 is provided instead of the mold actuator 112 constituting the mold tilt stage 101. For this reason, the mold stage of the present embodiment is always inclined with respect to the running surface (XY plane) of the wafer stage in a steady state.

    In FIG. 8, reference numeral 141 denotes a spring (rotation mechanism) installed between the mold chuck 111 (tilting mechanism) and the mold stage support portion 113. In a state where no external force is applied to the mold chuck 111, the spring 141 is extended, so that the mold ML is inclined. In this embodiment, there is no actuator in the posture control mechanism (rotation mechanism) of the mold ML.

    At the time of stamping, the mold ML starts in a state of being inclined with respect to the substrate WF. When the mold ML is driven in the Z direction by the mold Z drive unit 103 (moving mechanism), the end portion (lower left corner in the drawing) of the mold ML contacts the substrate WF.

    When the mold is further driven in the Z direction after the end portions contact, a rotational moment is generated in the mold ML by the reaction force from the contact point, and the mold ML rotates. This state is shown in FIG.

    The inclination of the mold ML is measured by a measuring unit that measures the inclination of the mold. When the mold ML rotates, a movement command is issued to the wafer stage according to the value. The position of the wafer stage is uniquely determined by the posture of the mold. The drive unit moves the wafer stage based on the tilt measurement result of the mold ML by the measurement unit.

When the position of the wafer stage is 0 when the mold ML and the substrate WF are in parallel, and the inclination of the mold is β,
X (β) = L−L × cos (β) + H × sin (β) (1)
It is represented by In equation (1), X (β) represents the position of the wafer stage. L is the distance in the X direction from the rotation center of the mold stage to the corner (contact point) of the mold, and H is the distance in the Z direction (see FIG. 10).

    In the initial state, the mold ML is inclined by the angle θ. Therefore, the wafer stage is set at a position of X (β) = L−L × cos (θ) + H × sin (θ).

    According to the above configuration and control, there is an advantage that the system configuration can be simplified because synchronous control for the mold Z drive and the wafer stage drive is not required. Further, it is not necessary to accurately grasp the distance from the initial position of the mold Z driving amount to the contact, and the sequence can be simplified, so that the cost of the apparatus can be reduced.

    Next, a processing apparatus in Embodiment 4 of the present invention will be described.

    FIG. 11 is an enlarged view around the mold stage of the processing apparatus according to the fourth embodiment. The processing apparatus shown in FIG. 11 is an imprint apparatus similar to that of the first embodiment. FIG. 11 shows only the periphery of the mold stage as in FIG. In addition, the same code | symbol is attached | subjected to the member showing the function similar to Example 1, and the description is abbreviate | omitted.

    Example 4 differs from Example 1 in the configuration of the mold stage. In the first embodiment, the Z position and posture (rotation direction about the Y axis) of the mold ML and the position of the wafer stage are coordinated so that the initial contact point between the mold ML and the substrate WF is relatively stationary. The position was controlled. On the other hand, in the present embodiment, a mold stage is used that makes the absolute position of the end (contact point) of the mold ML unchanged even when the mold ML is inclined.

    As shown in FIG. 11, the mold tilt stage of the present embodiment is a mold tilt stage having a link mechanism. The mold stage 133 is connected to the mold Z drive unit 104 (moving mechanism) shown in FIG. 2, and is movable in the vertical direction (Z direction).

    An arm 132L and an arm 132R are arranged below the mold stage 133 via a link mechanism. The other end is connected to the mold stage 131 via a link mechanism. The link mechanism is composed of a bearing or the like that can freely rotate around the Y axis in the figure, and is held with high rigidity in directions other than around the Y axis. With this configuration, the mold stage 131 is configured to rotate around the Y axis.

    The mold stage 131 has a holding function of holding the mold ML by inclining the mold ML. The corner (bottom left end in the figure) of the pattern surface of the mold ML is arranged so as to coincide with the rotation center of the mold stage. When the mold ML is in a posture parallel to the XY plane, the intersection of the straight line connecting the link mechanisms at both ends of the arm 132L and the straight line connecting the link mechanisms at both ends of the arm 132R is the corner (end part) of the pattern surface of the mold ML. ) Is held at a position coinciding with ().

    Next, the stamping operation in the fourth embodiment will be described. FIG. 12 is a diagram illustrating an initial state of the mold stage in the fourth embodiment.

    The posture of the mold stage 131 (tilting mechanism) is tilted by an actuator (not shown). The mold stage 131 is lowered while maintaining this tilt angle, and the mold ML and the substrate WF are brought into contact with each other. After that, the mold ML and the substrate WF are made parallel by rotating the mold ML using the arms 132R and 132L (rotation mechanism). The stamping operation is executed by such control.

    As described above, in this embodiment, by using the arms 132R and 132L, the rotation center of the mold stage 131 is matched with the initial set point of the pattern surface of the mold ML. That is, in this embodiment, the arms 132R and 132L also include a control mechanism that rotates the mold ML around the position of the end of the mold ML.

    For this reason, it is possible to perform parallel alignment (that is, a stamping operation) by rotational movement about the initial grounding point between the mold ML and the substrate WF without moving the wafer stage (substrate WF) at the time of stamping. As a result, since the substrate WF and the mold ML are not rubbed, generation of particles and damage to the mold can be prevented.

    According to the first to fourth embodiments, in the nano-imprint apparatus, the transfer performance is high, and high-speed stamping can be realized while suppressing generation of particles, and a highly productive microfabrication apparatus can be realized. .

    The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

It is a schematic diagram which shows the stamping operation | movement in the processing apparatus of a present Example. It is a schematic block diagram of the processing apparatus in Example 1. FIG. 3 is an enlarged view of the periphery of a mold stage of the processing apparatus in Example 1. The state of the mold stage at the time of the stamping operation start in Example 1 is shown. It is a figure which shows the 1st state in the stamping operation | movement of Example 1. FIG. It is a figure which shows the 2nd state in the stamping operation | movement of Example 1. FIG. It is a figure which shows the 3rd state in the stamping operation | movement of Example 1. FIG. It is a figure which shows the 4th state in the stamping operation | movement of Example 1. FIG. It is a figure which shows the 5th state in the stamping operation | movement of Example 1. FIG. It is a figure explaining the control method in the stamping operation | movement of Example 1. FIG. 6 is a graph showing the amount of movement of each axis in the stamping operation of the first embodiment. It is an enlarged view of the mold stage periphery of the processing apparatus in Example 2. FIG. FIG. 6 is an enlarged view around a mold stage of a processing apparatus in Example 3. It is a figure explaining the operation principle of Example 3. It is a figure explaining the controlled variable of Example 3. FIG. FIG. 6 is an enlarged view around a mold stage of a processing apparatus in Example 4. It is a figure which shows the initial state of the mold stage in Example 4. FIG. It is a block diagram which shows the control mechanism of the processing apparatus in a present Example. It is the schematic which shows the stamping operation | movement in the conventional processing apparatus.

Explanation of symbols

ML: Mold WF: Substrate UVR: UV curable resin 1: Nanoimprint apparatus 100: Mold stage 101: Mold tilt stage 102: Mold position reference mirror 103, 104: Mold Z drive unit 105: Load sensor 106: Ball screw 107: Motor 108: Linear guide 109: Laser beam 111 for mold measurement: Mold chuck 112: Mold actuator 113: Mold stage support 121: Mold Y stage 122: Mold Y guide 123: Mold X stage 124: Mold X guide 131, 133: Mold stage 132R, 132L: Arm 200: Wafer stage 201: Wafer chuck 202: Wafer stage main body 203: Wafer position reference mirror 204: Wafer measurement lever Heather light 205: mold height sensor 301: a surface plate 302: Frame 303: anti-vibration device 401: an illumination optical system 501: the coating apparatus 601 Microscope 1001: mold 1002: substrate 1003: UV curable resin 1004: initial contact point

Claims (3)

A processing apparatus for pressing a mold on which a pattern is formed to a work material applied to a transfer object, and transferring the pattern to the transfer object,
An inclination mechanism for inclining the mold;
A moving mechanism for bringing the inclined mold close to the transfer target;
A rotating mechanism that rotates the mold so that the mold is parallel to the transferred body when the inclined end of the mold comes into contact with the transferred body;
And a control mechanism for controlling the position of the end of the mold so as not to move with respect to the transfer target while the mold is rotated by the rotation mechanism. The control mechanism is
A measuring unit for measuring the inclination of the mold;
The processing apparatus according to claim 1, further comprising: a drive unit that moves the transfer object based on a measurement result by the measurement unit. The processing apparatus according to claim 1, wherein the control mechanism rotates the mold around the position of the end of the mold as a rotation center.