JPH02113332U - - Google Patents
Info
- Publication number
- JPH02113332U JPH02113332U JP1989021644U JP2164489U JPH02113332U JP H02113332 U JPH02113332 U JP H02113332U JP 1989021644 U JP1989021644 U JP 1989021644U JP 2164489 U JP2164489 U JP 2164489U JP H02113332 U JPH02113332 U JP H02113332U
- Authority
- JP
- Japan
- Prior art keywords
- bubbler
- main pipe
- foaming part
- air bubbles
- branch pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005187 foaming Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 claims 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/231—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
- B01F23/23105—Arrangement or manipulation of the gas bubbling devices
- B01F23/2312—Diffusers
- B01F23/23125—Diffusers characterised by the way in which they are assembled or mounted; Fabricating the parts of the diffusers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021644U JPH0644098Y2 (ja) | 1989-02-27 | 1989-02-27 | 半導体ウェハーの洗浄用バブラー |
DE3942351A DE3942351A1 (de) | 1989-02-27 | 1989-12-21 | Vorrichtung zur blasenbildung fuer die verwendung beim waschen von halbleitermaterialien |
US07/452,746 US5014727A (en) | 1989-02-27 | 1989-12-21 | Bubbler device for washing semiconductor materials |
KR1019900000022A KR900013593A (ko) | 1989-02-27 | 1990-01-04 | 반도체 웨이퍼(wafer)의 세정용 발포기 |
GB9001127A GB2228424B (en) | 1989-02-27 | 1990-01-18 | Bubbler device for washing semiconductor materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021644U JPH0644098Y2 (ja) | 1989-02-27 | 1989-02-27 | 半導体ウェハーの洗浄用バブラー |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02113332U true JPH02113332U (US07321065-20080122-C00160.png) | 1990-09-11 |
JPH0644098Y2 JPH0644098Y2 (ja) | 1994-11-14 |
Family
ID=12060766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989021644U Expired - Lifetime JPH0644098Y2 (ja) | 1989-02-27 | 1989-02-27 | 半導体ウェハーの洗浄用バブラー |
Country Status (5)
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014020687A1 (ja) * | 2012-07-31 | 2014-02-06 | 三洋電機株式会社 | 太陽電池の製造方法 |
JPWO2014020693A1 (ja) * | 2012-07-31 | 2016-07-11 | パナソニックIpマネジメント株式会社 | 太陽電池の製造方法 |
JP2018014470A (ja) * | 2016-07-22 | 2018-01-25 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法および記憶媒体 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
JPH0521413A (ja) * | 1991-07-10 | 1993-01-29 | Matsushita Electric Ind Co Ltd | 半導体基板洗浄装置及び半導体基板洗浄方法 |
US5339842A (en) * | 1992-12-18 | 1994-08-23 | Specialty Coating Systems, Inc. | Methods and apparatus for cleaning objects |
DE4316096C1 (de) * | 1993-05-13 | 1994-11-10 | Wacker Chemitronic | Verfahren zur naßchemischen Behandlung scheibenförmiger Werkstücke |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
JPH0756015A (ja) * | 1993-08-18 | 1995-03-03 | Sony Corp | カラーフィルタの製造方法 |
FR2716267B1 (fr) * | 1994-02-11 | 1996-03-22 | Daniel Crespel | Dispositif de dégraissage notamment pour fibres optiques. |
US5419353A (en) * | 1994-05-04 | 1995-05-30 | Chen; Hong-Wel | Object cleaning and washing device |
US5505219A (en) * | 1994-11-23 | 1996-04-09 | Litton Systems, Inc. | Supercritical fluid recirculating system for a precision inertial instrument parts cleaner |
US6532976B1 (en) | 1995-07-10 | 2003-03-18 | Lg Semicon Co., Ltd. | Semiconductor wafer cleaning apparatus |
DE19541436C2 (de) * | 1995-11-07 | 1998-10-08 | Steag Micro Tech Gmbh | Anlage zur Behandlung von Gegenständen in einem Prozeßtank |
KR100211074B1 (ko) * | 1996-03-13 | 1999-07-15 | 구본준 | 웨이퍼 습식 처리장치 |
DE19644253A1 (de) | 1996-10-24 | 1998-05-07 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
US5815942A (en) * | 1996-12-13 | 1998-10-06 | Kabushiki Kaisha Toshiba | Vapor drying system and method |
US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
US5849091A (en) * | 1997-06-02 | 1998-12-15 | Micron Technology, Inc. | Megasonic cleaning methods and apparatus |
US5904156A (en) * | 1997-09-24 | 1999-05-18 | International Business Machines Corporation | Dry film resist removal in the presence of electroplated C4's |
US6199568B1 (en) * | 1997-10-20 | 2001-03-13 | Dainippon Screen Mfg. Co., Ltd. | Treating tank, and substrate treating apparatus having the treating tank |
US5971368A (en) * | 1997-10-29 | 1999-10-26 | Fsi International, Inc. | System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized |
US6273107B1 (en) * | 1997-12-05 | 2001-08-14 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
US6039055A (en) * | 1998-01-08 | 2000-03-21 | International Business Machines Corporation | Wafer cleaning with dissolved gas concentration control |
JP3533332B2 (ja) * | 1998-05-20 | 2004-05-31 | Tdk株式会社 | 電子部品の製造方法および水処理装置 |
US6235641B1 (en) | 1998-10-30 | 2001-05-22 | Fsi International Inc. | Method and system to control the concentration of dissolved gas in a liquid |
US6372051B1 (en) * | 1998-12-04 | 2002-04-16 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
GB2346093A (en) * | 1999-01-27 | 2000-08-02 | Addavita Ltd | Gas diffuser for an air lift pump |
JP2000271471A (ja) * | 1999-03-24 | 2000-10-03 | Nippon M K S Kk | 液体ソース供給システム及びその洗浄方法、気化器 |
US6274506B1 (en) | 1999-05-14 | 2001-08-14 | Fsi International, Inc. | Apparatus and method for dispensing processing fluid toward a substrate surface |
US6406551B1 (en) | 1999-05-14 | 2002-06-18 | Fsi International, Inc. | Method for treating a substrate with heat sensitive agents |
US6217667B1 (en) | 1999-09-24 | 2001-04-17 | Semitool, Inc. | Method for cleaning copper surfaces |
US6530388B1 (en) | 2000-02-15 | 2003-03-11 | Quantum Global Technologies, Llc | Volume efficient cleaning systems |
US7328712B1 (en) | 2000-02-15 | 2008-02-12 | Quantum Global Technologies | Cleaning bench for removing contaminants from semiconductor process equipment |
US6926016B1 (en) | 2001-02-15 | 2005-08-09 | Quantum Global Technologies, Llc | System for removing contaminants from semiconductor process equipment |
US6911097B1 (en) * | 2000-07-31 | 2005-06-28 | Taiwan Semiconductor Manufacturing Company | Photoresist stripper using nitrogen bubbler |
SE517821C2 (sv) * | 2000-09-29 | 2002-07-16 | Tetra Laval Holdings & Finance | Metod och anordning för att kontinuerligt avlufta en vätska |
KR100481309B1 (ko) * | 2002-06-27 | 2005-04-07 | 삼성전자주식회사 | 반도체 기판의 건조장비 |
JP2004121962A (ja) * | 2002-10-01 | 2004-04-22 | National Institute Of Advanced Industrial & Technology | ナノバブルの利用方法及び装置 |
US20040238119A1 (en) * | 2003-05-26 | 2004-12-02 | Ching-Yu Chang | [apparatus and method for etching silicon nitride thin film ] |
WO2006099619A2 (en) * | 2005-03-17 | 2006-09-21 | Noah Precision, Llc | Temperature control unit for bubblers |
CN101983560A (zh) * | 2010-11-19 | 2011-03-09 | 宋剑 | 水产养殖水下增氧盘 |
KR101297111B1 (ko) * | 2011-12-20 | 2013-08-21 | 비나텍주식회사 | 셀 세척 시스템 및 세척 방법 |
GB201316716D0 (en) * | 2013-09-20 | 2013-11-06 | Alphasonics Ultrasonic Cleaning Systems Ltd | Ultrasonic cleaning apparatus and method |
JP2017140605A (ja) * | 2016-02-12 | 2017-08-17 | 光洋機械産業株式会社 | 洗浄方法及びこの洗浄方法に用いられる洗浄装置 |
CN114951126A (zh) * | 2022-06-17 | 2022-08-30 | 徐州徐工精密工业科技有限公司 | 一种机械设备零部件生产清洗装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2541838A (en) * | 1947-06-12 | 1951-02-13 | Rca Corp | Water resistant porous medium |
GB660666A (en) * | 1948-11-19 | 1951-11-07 | Activated Sludge Ltd | Improvements in or relating to means for diffusing gases into liquids |
US3396950A (en) * | 1967-01-16 | 1968-08-13 | Elmer R. Wood | Diffuser for sewage treatment |
DE1694552A1 (de) * | 1967-03-09 | 1970-10-15 | Kanegafuchi Spinning Co Ltd | Poroeser Feststoffkoerper und Verfahren zu seiner Herstellung |
FI49704C (fi) * | 1974-01-23 | 1975-09-10 | Nokia Oy Ab | Kuplia kehittävä ilmastin. |
GB1475193A (en) * | 1974-10-16 | 1977-06-01 | Whatman Reeve Angel Ltd | Porous element and the preparation thereof |
US4288394A (en) * | 1978-10-19 | 1981-09-08 | Water Pollution Control Corp. | Sewage aeration system |
GB2183497B (en) * | 1985-12-10 | 1989-10-11 | Gore & Ass | A diffuser device |
-
1989
- 1989-02-27 JP JP1989021644U patent/JPH0644098Y2/ja not_active Expired - Lifetime
- 1989-12-21 DE DE3942351A patent/DE3942351A1/de not_active Withdrawn
- 1989-12-21 US US07/452,746 patent/US5014727A/en not_active Expired - Fee Related
-
1990
- 1990-01-04 KR KR1019900000022A patent/KR900013593A/ko not_active Application Discontinuation
- 1990-01-18 GB GB9001127A patent/GB2228424B/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014020687A1 (ja) * | 2012-07-31 | 2014-02-06 | 三洋電機株式会社 | 太陽電池の製造方法 |
JPWO2014020687A1 (ja) * | 2012-07-31 | 2016-07-11 | パナソニックIpマネジメント株式会社 | 太陽電池の製造方法 |
JPWO2014020693A1 (ja) * | 2012-07-31 | 2016-07-11 | パナソニックIpマネジメント株式会社 | 太陽電池の製造方法 |
US9818904B2 (en) | 2012-07-31 | 2017-11-14 | Panasonic Intellectual Property Management Co., Ltd. | Method of manufacturing solar cell |
JP2018014470A (ja) * | 2016-07-22 | 2018-01-25 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法および記憶媒体 |
Also Published As
Publication number | Publication date |
---|---|
JPH0644098Y2 (ja) | 1994-11-14 |
KR900013593A (ko) | 1990-09-06 |
GB2228424B (en) | 1992-11-18 |
GB2228424A (en) | 1990-08-29 |
GB9001127D0 (en) | 1990-03-21 |
DE3942351A1 (de) | 1990-08-30 |
US5014727A (en) | 1991-05-14 |