JPH02113271U - - Google Patents
Info
- Publication number
- JPH02113271U JPH02113271U JP1989021289U JP2128989U JPH02113271U JP H02113271 U JPH02113271 U JP H02113271U JP 1989021289 U JP1989021289 U JP 1989021289U JP 2128989 U JP2128989 U JP 2128989U JP H02113271 U JPH02113271 U JP H02113271U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- connection pad
- melting point
- low melting
- point metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 230000005496 eutectics Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第1図は本考案に係るコネクタ装置図、第2図
は第1図のA部の離隔状態拡大図、第3図は第1
図のA部の拡大図、第4図は第2図のB部の拡大
図、第5図は第2図のC部の拡大図。 10,12……回路基板、14……接続パツド
、16……コイルばね、18……コンタクト、2
6,30……ポーラスな銀メツキ層、34……錫
・亜鉛合金、36……ガリウム。
は第1図のA部の離隔状態拡大図、第3図は第1
図のA部の拡大図、第4図は第2図のB部の拡大
図、第5図は第2図のC部の拡大図。 10,12……回路基板、14……接続パツド
、16……コイルばね、18……コンタクト、2
6,30……ポーラスな銀メツキ層、34……錫
・亜鉛合金、36……ガリウム。
Claims (1)
- 対向した被接続物10,12間を電気的接続す
るコネクタであつて、一方の被接続物10には接
続パツド14を設け、他方の被接続物12にはば
ね手段16を有したコンタクト18を設け、前記
接続パツド14とコンタクト18との各対向面上
にポーラスな拡散融合しにくい材料より成る層2
6,30を形成し、該層26,30に室温で共晶
の極低融点金属となる第1と第2の低融点金属を
夫々含浸させたことを特徴とするコネクタ装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021289U JPH0454703Y2 (ja) | 1989-02-28 | 1989-02-28 | |
DE69022605T DE69022605T2 (de) | 1989-02-28 | 1990-02-07 | Elektrische Verbindungsvorrichtung. |
EP90102348A EP0385142B1 (en) | 1989-02-28 | 1990-02-07 | Electrical connecting apparatus |
CA002010306A CA2010306C (en) | 1989-02-28 | 1990-02-19 | Connecting apparatus |
US07/483,170 US5017738A (en) | 1989-02-28 | 1990-02-22 | Connecting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021289U JPH0454703Y2 (ja) | 1989-02-28 | 1989-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02113271U true JPH02113271U (ja) | 1990-09-11 |
JPH0454703Y2 JPH0454703Y2 (ja) | 1992-12-22 |
Family
ID=31524337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989021289U Expired JPH0454703Y2 (ja) | 1989-02-28 | 1989-02-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0454703Y2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05258812A (ja) * | 1991-03-27 | 1993-10-08 | Yamaichi Electron Co Ltd | 入れ子形加圧接続子 |
-
1989
- 1989-02-28 JP JP1989021289U patent/JPH0454703Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05258812A (ja) * | 1991-03-27 | 1993-10-08 | Yamaichi Electron Co Ltd | 入れ子形加圧接続子 |
Also Published As
Publication number | Publication date |
---|---|
JPH0454703Y2 (ja) | 1992-12-22 |
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