JPS6426847U - - Google Patents
Info
- Publication number
- JPS6426847U JPS6426847U JP12340387U JP12340387U JPS6426847U JP S6426847 U JPS6426847 U JP S6426847U JP 12340387 U JP12340387 U JP 12340387U JP 12340387 U JP12340387 U JP 12340387U JP S6426847 U JPS6426847 U JP S6426847U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- membrane circuit
- metal stem
- bonding
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
Landscapes
- Die Bonding (AREA)
Description
第1図aは本考案の一実施例を説明するための
斜視図、第1図bは本考案の一実施例の正面図、
第2図aは本考案の他の実施例を説明するための
斜視図、第2図bは本考案の他の実施例の正面図
、第3図aは従来の技術を説明するための斜視図
、第3図bは従来の技術を説明するための正面図
である。 11……膜回路基板、12……半田、13……
金属ステム、14……接合用導体ランド。
斜視図、第1図bは本考案の一実施例の正面図、
第2図aは本考案の他の実施例を説明するための
斜視図、第2図bは本考案の他の実施例の正面図
、第3図aは従来の技術を説明するための斜視図
、第3図bは従来の技術を説明するための正面図
である。 11……膜回路基板、12……半田、13……
金属ステム、14……接合用導体ランド。
Claims (1)
- 膜回路基板と金属ステムとが前記膜回路基板の
側面に設けられた接合用導体ランドを介して接合
されていることを特徴とする膜回路基板と金属ス
テムとの接合構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12340387U JPS6426847U (ja) | 1987-08-11 | 1987-08-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12340387U JPS6426847U (ja) | 1987-08-11 | 1987-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6426847U true JPS6426847U (ja) | 1989-02-15 |
Family
ID=31372224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12340387U Pending JPS6426847U (ja) | 1987-08-11 | 1987-08-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6426847U (ja) |
-
1987
- 1987-08-11 JP JP12340387U patent/JPS6426847U/ja active Pending