JPH0211162U - - Google Patents

Info

Publication number
JPH0211162U
JPH0211162U JP8715188U JP8715188U JPH0211162U JP H0211162 U JPH0211162 U JP H0211162U JP 8715188 U JP8715188 U JP 8715188U JP 8715188 U JP8715188 U JP 8715188U JP H0211162 U JPH0211162 U JP H0211162U
Authority
JP
Japan
Prior art keywords
plating
plated
chamber
plating chamber
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8715188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8715188U priority Critical patent/JPH0211162U/ja
Publication of JPH0211162U publication Critical patent/JPH0211162U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例による連続電気メツ
キ装置の外形図、第２図は第１図のメツキ室の斜
視図、第３図は従来例による電気メツキ装置の組
立図である。 １：被メツキ物、６：搬送ローラ、７：前処理
室、８：メツキ室、９：後処理室、１０：噴流孔
、１１：メツキ液、１４：ドレン孔、１５：メツ
キ液タンク、１６：陽極板、１７：陰極給電子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 被メツキ物を搬送ローラで連続的に移送して電
    気メツキを施す装置であつて、メツキ室と、この
    メツキ室中央下部に開口し前記メツキ室内に搬送
    される被メツキ物を浸すようにメツキ液を噴流す
    る噴流孔と、前記メツキ室内の前記被メツキ物の
    両側に配置された陽極板と、前記メツキ室内で前
    記被メツキ物に接触して前記被メツキ物に負電気
    を供給する陰極給電子と、前記メツキ室の前後に
    配置され前記メツキ室からあふれたメツキ液を下
    部のドレン孔から回収する前処理室および後処理
    室とから構成することを特徴とする連続電気メツ
    キ装置。
JP8715188U 1988-06-30 1988-06-30 Pending JPH0211162U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8715188U JPH0211162U (ja) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8715188U JPH0211162U (ja) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH0211162U true JPH0211162U (ja) 1990-01-24

Family

ID=31311774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8715188U Pending JPH0211162U (ja) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH0211162U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153942U (ja) * 1974-10-22 1976-04-24
JPS51108738U (ja) * 1975-02-22 1976-08-31
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153942U (ja) * 1974-10-22 1976-04-24
JPS51108738U (ja) * 1975-02-22 1976-08-31
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法

Similar Documents

Publication Publication Date Title
EP0940483A3 (en) Anodizing method and apparatus and semiconductor substrate manufacturing method
JPH0211162U (ja)
ES2069544T3 (es) Celula electroquimica.
JPH0344495A (ja) カソードローラ機構
CN219430164U (zh) 一种倒v字形阳极布局电镀槽体
WO1993011281A3 (en) Electrochemical cell
JPS63162539U (ja)
JPH02136062U (ja)
JPH0460565U (ja)
JPH0325567U (ja)
JPH02149765U (ja)
JPS6410069U (ja)
JPH0269964U (ja)
JPH02136059U (ja)
JPH0444374U (ja)
JPS6162366U (ja)
JPS54138831A (en) One-side electrolytic treatment method for metal sheet
JPS6260261U (ja)
JPS6274338U (ja)
KR200141569Y1 (ko) 동 도금용 양극판
JPS56123399A (en) Plating device
JPS57210985A (en) Partial plating device
JPS6159670U (ja)
JPS6173666U (ja)
JPH0181863U (ja)