JPH021111B2 - - Google Patents

Description

[Detailed description of the invention]

"Industrial Application Field" The present invention relates to a ceramic sintered body, which is suitably used as an electrically insulating material for IC packages, hybrid boards, multilayer wiring boards, thick film wiring boards, and the like. ``Prior art'' Alumina, which has excellent properties such as insulation, heat resistance, and mechanical strength, is widely used as this type of electrical insulating material, and other materials include mullite, zircon, magnesia, CaO, BaO, and SrO. A ceramic composition described in Japanese Patent Application No. 58-204871 obtained by firing a composition containing at least one type of oxide in the group, a low dielectric constant glass, and a heat-resistant filler powder mixed in a predetermined ratio. A low dielectric constant glass composition for high frequency thick film circuits, etc., described in JP-A-58-151345, have been proposed. "Problems to be Solved by the Invention" Alumina and the ceramic composition described in JP-A-58-204871 are sintered at a high temperature of 1300 to 1600°C, so W, Mo, and Mn have high electrical resistance. It is necessary to use high melting point metals such as metals as conductor materials, which is unsuitable for the trend toward higher speed and higher density LSI in the electronics field. In addition, alumina has a high dielectric constant, which causes signal propagation delays. Furthermore, the low dielectric constant glass composition for high frequency thick film circuits described in JP-A-58-151345 has poor mechanical strength and also poor electrical properties because it contains an alkali component. The object of the present invention is to solve the above-mentioned problems and provide a ceramic sintered body having a low dielectric constant, easy sinterability, and a bending strength of 1000 Kg/cm ² or more. "Means to solve the problem" The first method is SiO ₂ 28-55% by weight,
A composition consisting _of 10-30 _% CaO, 5-15% _B2O3 and 5-18% _Al2O3 is applied. Similarly, the second means related to the above specifying means is to add 5% MgO or less to the above composition as desired.
The purpose is to apply a composition in which one or more selected from TiO ² 10% or less and ZnO 20% or less are added. "Effect" By the first means, (a) the sintering temperature becomes 1000℃ or less, (b) the bending strength becomes 1000Kg/cm ² or more, (c) the dielectric constant (1MHz) becomes 8 or less, and (d) The coefficient of thermal expansion is 8×10 ^-6 /°C or less (20 to 700°C). If the content of each component exceeds the upper limit of the first means
If _SiO2 is exceeded, (d), if CaO is exceeded, (c) and
(d), if it exceeds B ₂ O ₃ (b), if it exceeds Al ₂ O ₃ (b)
On the other hand, if the content of each component is less than the lower limit of the first method, SiO ₂
In case of deficiency, (a) and (b), in case of CaO deficiency, (b),
In the case of B ₂ O ₃ deficiency, the effect of (a) will not be exhibited, and in the case of Al ₂ O ₃ deficiency, the effect of (d) will not be exhibited. In the second method, MgO prevents warping and deformation of the sintered body, but if the amount added exceeds the upper limit,
Preventing the effects of (a) and (d). TiO ₂ promotes the effects of (a) and (b), but if the amount added exceeds the upper limit, it hinders the effect of (c). ZnO promotes the effect of (a), but if the amount added exceeds the upper limit, it hinders the effect of (b). Example Reagents primary silicic anhydride, calcium carbonate, magnesia, titanium dioxide, zinc oxide, calcium borate (Tomita Pharmaceutical), and alumina (Sumitomo Aluminum Smelting A-HPS30) were converted into oxides after firing. Blend to have the composition shown in the table, add an organic binder and water, wet mix, spray dry, granulate, mold, and then sinter at the sintering temperature shown in the table to make a size 50φ. ×3 [mm] and 10×35
Ceramic sintered bodies having compositions 1 to 24 shown in the table were manufactured with a size of ×3 [mm]. The dielectric constant of the ceramic sintered body having the former size, and the bending strength and the ceramic sintered body of the latter size.
The results of measuring the thermal expansion coefficients in the temperature range of 20 to 700°C are shown in the table.

【table】

[Table] "Effects of the Invention" Because it is easy to sinter, it is possible to sinter simultaneously with low-resistance materials such as Au, Ag, and Cu. Therefore, these metals can be used as conductor materials, and high-performance wiring can be achieved. Contributes to density. The low dielectric constant improves signal propagation speed. Since the coefficient of thermal expansion is close to that of a semiconductor silicon chip, the adhesiveness with the semiconductor silicon chip is improved.

Claims (1)

[Claims] 1. SiO ₂ 28-55%, CaO 10-30%, by weight;
_A ceramic sintered body consisting of 5-15% _{B2O3 and} 5-18% _Al2O3 . 2 SiO ₂ 28-55%, CaO 10-30% by weight,
B ₂ O ₃ 5-15% and Al ₂ O ₃ 5-18% are essential components,
The essential components include MgO 5% or less, TiO ₂ 10% or less, and
A ceramic sintered body made by adding one or more types of ZnO selected from 20% or less.