JPH02110903A - Manufacture of resistor - Google Patents
Manufacture of resistorInfo
- Publication number
- JPH02110903A JPH02110903A JP1225535A JP22553589A JPH02110903A JP H02110903 A JPH02110903 A JP H02110903A JP 1225535 A JP1225535 A JP 1225535A JP 22553589 A JP22553589 A JP 22553589A JP H02110903 A JPH02110903 A JP H02110903A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- paste
- resistance film
- lead
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000010953 base metal Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 238000000605 extraction Methods 0.000 claims description 16
- 229920006015 heat resistant resin Polymers 0.000 claims description 10
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 abstract 2
- 239000010949 copper Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は半田耐熱性を改善した抵抗体の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a resistor with improved solder heat resistance.
（従来の技術）
基板の上に抵抗体を形成する方法としては、たとえば特
開昭５７−９６５８９号公報に記載されたものがある。(Prior Art) As a method for forming a resistor on a substrate, there is a method described in, for example, Japanese Patent Laid-Open No. 57-96589.
この方法によれば、まず基板の上に銅ペーストを所定形
状に印刷し、約１５０℃の温度で約１５分間加熱して硬
化させ、銅の配線パターンを形成する。次にポリマーレ
ジン抵抗体ペーストを所定形状、所定厚さに印刷し、約
８５℃の温度で約１５分間加熱し、抵抗ペースト中の有
機溶媒を除去するとともに仮硬化させる。さらに仮硬化
状態の抵抗体ペーストをチッ素、アルゴン等の不活性ガ
ス中で約１７０〜２００℃の温度で約１〜３時間焼成し
て硬化させて抵抗体を形成する。そののち保護膜となる
レジストを印刷し、約１５０℃の温度で約１５分間加熱
硬化させることにより、保護膜を形成する。According to this method, copper paste is first printed in a predetermined shape on a substrate, and heated at a temperature of about 150° C. for about 15 minutes to harden it, thereby forming a copper wiring pattern. Next, a polymer resin resistor paste is printed in a predetermined shape and thickness, and heated at a temperature of about 85° C. for about 15 minutes to remove the organic solvent in the resistor paste and temporarily harden it. Further, the temporarily hardened resistor paste is fired and hardened in an inert gas such as nitrogen or argon at a temperature of about 170 to 200° C. for about 1 to 3 hours to form a resistor. Thereafter, a resist that will become a protective film is printed and cured by heating at a temperature of approximately 150° C. for approximately 15 minutes, thereby forming a protective film.
ここに開示の技術によれば、抵抗ペーストを不活性雰囲
気ガス中で焼成しているため、銅の配線パターンの酸化
膜がほとんど生ぜず、高温で短時間の処理を行うことが
できるとしている。According to the technique disclosed herein, since the resistance paste is fired in an inert atmospheric gas, almost no oxide film is formed on the copper wiring pattern, and the process can be performed at high temperatures for a short time.
また、卑金属の引出電極からなる抵抗体の製造方法とし
て、特開昭５８−１０８８６号公報に記載されたものが
ある。Further, as a method for manufacturing a resistor made of base metal lead electrodes, there is a method described in Japanese Patent Laid-Open No. 10886/1986.
この公報に記載の方法によれば、表面に下地用アンダー
コートを塗布した絶縁基板の上に、力一ボン抵抗などの
抵抗体を加熱硬化させて抵抗回路を形成し、この抵抗回
路の一部に導電性の良好な銅導電ペーストを重ね塗布し
て加熱硬化させ、さらにこの銅導電ペーストの要半田付
は箇所に半田付は性の良好な銅導電ペーストを重ね塗布
して加熱硬化させるというものである。According to the method described in this publication, a resistance circuit is formed by heating and hardening a resistor such as a Rikibon resistor on an insulating substrate whose surface is coated with a base undercoat, and a part of this resistance circuit is Copper conductive paste with good conductivity is layered on the surface and cured by heating, and then copper conductive paste with good soldering properties is layered on the areas where soldering is required and the copper conductive paste is heated and cured. It is.
（発明が解決しようとする技術的課題）しかしながら、
前者の方法では、銅の配線パターンを先に形成するため
、抵抗体を形成するときに銅の配線パターンの酸化を避
ける工夫が必要である。このために、まず抵抗体に含有
されている有機溶剤を除去するために空気中で低温で焼
成し、次いで抵抗体を硬化させるために不活性ガス雰囲
気中で焼成して硬化させるという工程を設けており、製
造工程が複雑になる。また、このような工程を採用して
も、銅の配線パターンの表面には酸化膜が形成されるこ
とは避けられず、この酸化膜の厚みが厚くならないよう
に焼付は温度のコントロールを厳密に行わなければなら
ないという問題を有している。(Technical problem to be solved by the invention) However,
In the former method, since the copper wiring pattern is formed first, it is necessary to take measures to avoid oxidation of the copper wiring pattern when forming the resistor. For this purpose, a process of first firing the resistor at a low temperature in the air to remove the organic solvent contained in the resistor, and then firing and hardening it in an inert gas atmosphere to harden the resistor is used. This complicates the manufacturing process. Furthermore, even if such a process is adopted, it is unavoidable that an oxide film will form on the surface of the copper wiring pattern, and the baking temperature must be strictly controlled to prevent the oxide film from becoming thick. There is a problem that has to be done.
また、後者の方法では、引出電極を銅で構成するもので
あるが、この銅からなる引出電極の形成が可能となった
のは、特殊な銅ペーストの使用を前提としたものであっ
て、汎用性に乏しく、焼付はタイプの抵抗体の引出電極
には使用できないものである。したがって、焼付はタイ
プの抵抗体の引出電極を卑金属で構成するには他の技術
的解決手段が必要となる。In addition, in the latter method, the extraction electrode is made of copper, but the formation of the extraction electrode made of copper was made possible on the premise of the use of a special copper paste. It lacks versatility and cannot be used as a lead electrode for resistors of this type due to seizure. Therefore, other technical solutions are required to construct the extraction electrodes of resistors of the seizure type from base metals.
そこで、発明者等は第１図に示す構造からなる焼付はタ
イプの新規な抵抗体を検討した。この第１図の抵抗体は
、たとえばアルミナなどのセラミックからなる耐熱性を
有する絶縁基板１の上に、たとえばＲｕｂ２からなる抵
抗ペーストをスクリーン印刷し、空気中で焼付けて抵抗
膜２を形成し、さらにこの抵抗膜２の端部の上に一部重
なるように卑金属、たとえば銅ペーストをスクリーン印
刷し、窒素雰囲気中で焼付けて電極３．４を形成した。Therefore, the inventors investigated a new resistor of the seizure type having the structure shown in FIG. The resistor shown in FIG. 1 is made by screen-printing a resistance paste made of, for example, Rub2 on a heat-resistant insulating substrate 1 made of ceramic such as alumina, and baking it in air to form a resistance film 2. Further, a base metal such as copper paste was screen printed so as to partially overlap the end of this resistive film 2, and was baked in a nitrogen atmosphere to form electrodes 3.4.
このような抵抗体によれば、先に抵抗膜を焼付け、その
のちにＣｕ、ＡＩ、Ｎｉ系の卑金属からなる引出電極を
焼付けており、この卑金属からなる引出電極は抵抗膜の
焼付は温度より低い温度で焼付けることができるため、
引出電極を酸化させたり、劣化させたりするという問題
がなくなる。また抵抗膜と卑金属からなる引出電極との
間に酸化膜が形成されないため、良好な接触状態が得ら
れることになる。According to such a resistor, the resistive film is baked first, and then the lead electrode made of a base metal such as Cu, AI, or Ni is baked. Because it can be baked at low temperatures,
This eliminates the problem of oxidizing or deteriorating the extraction electrode. Further, since no oxide film is formed between the resistive film and the extraction electrode made of base metal, a good contact state can be obtained.
しかしながら、この抵抗体を溶融している半田槽に浸漬
し、電極３．４の上に接続用の半田槽を形成すると、抵
抗値が初期値にくらべて１０％も変化することが確認さ
れた。その原因はまだ判明していないが、半田浸漬時に
熱の影響によって抵抗膜と電極との界面で接触抵抗に変
化が生じるものと考えられる。However, when this resistor was immersed in a molten solder bath and a solder bath for connection was formed on top of the electrode 3.4, it was confirmed that the resistance value changed by as much as 10% compared to the initial value. . Although the cause is not yet clear, it is thought that the contact resistance changes at the interface between the resistive film and the electrode due to the influence of heat during solder immersion.
したがって、この発明は引出電極に卑金属の使用が可能
となる抵抗体の製造方法を提供するとともに、半田耐熱
性を改善した抵抗体の製造方法を１是イ共すること目的
とする。Therefore, an object of the present invention is to provide a method for manufacturing a resistor that allows the use of base metals for lead electrodes, and also to provide a method for manufacturing a resistor with improved soldering heat resistance.
（技術的課題を解決するための手段）
すなわち、この発明の要旨とするところは、絶縁基板の
上に、抵抗膜を空気中で焼付け、この抵抗膜の端部の上
に一部重ねて卑金属ペーストを塗布し、この卑金属ペー
ストを抵抗膜の焼付は温度より低い温度で還元雰囲気で
焼付けて、抵抗膜の端部に一部重なる引出電極を形成し
、さらに抵抗膜と引出電極の重なり部分の上に耐熱性樹
脂を被覆したことを特徴とする抵抗体の製造方法である
。(Means for Solving the Technical Problems) That is, the gist of the present invention is to bake a resistive film in air on an insulating substrate, and to partially overlap the ends of the resistive film with base metal. Apply a paste, and bake this base metal paste in a reducing atmosphere at a temperature lower than the baking temperature of the resistive film to form an extraction electrode that partially overlaps the end of the resistive film. This is a method for manufacturing a resistor, characterized in that the resistor is coated with a heat-resistant resin.
（実施例）
以下、この発明を図示した一実施例に従って詳細に説明
する。(Example) Hereinafter, the present invention will be described in detail according to an illustrated example.
第２図はこの発明方法により得られる抵抗体の一例を示
したものである。図において、１１はアルミナなどの耐
熱性の絶縁基板、１２は絶縁基板の上に焼付けた抵抗膜
、１３．１４は抵抗膜１２の端部の上に一部重なるよう
に焼付けた引出電極、１５は耐熱性樹脂で、抵抗膜１２
と電極１３．１４の重なり部分を含めて被覆している。FIG. 2 shows an example of a resistor obtained by the method of this invention. In the figure, 11 is a heat-resistant insulating substrate such as alumina, 12 is a resistive film baked on the insulating substrate, 13.14 is an extraction electrode baked so as to partially overlap the end of the resistive film 12, and 15 is a heat-resistant resin, and the resistive film 12
The overlapping portions of the electrodes 13 and 14 are covered.
抵抗膜としては、Ｒｕｂ、系、 ＢｉＪｕ２０を系など
の材料が用いられる。また引出電極としてはたとえばＣ
ｕ、 Ａ１． Ｎｉ系の卑金属材料が用いられる。 Ｃ
ｕ電極は、たとえば、窒素などの還元雰囲気で５００〜
６５０℃の温度で焼付ける。また耐熱性樹脂としてはフ
ェノール樹脂、エポキシ樹脂などが用いられ、実際には
無機質フィラー、溶剤とともに混合してペースト状とし
、たとえばスクリーン印刷後硬化する。As the resistive film, materials such as Rub, BiJu20, etc. are used. Also, as an extraction electrode, for example, C
u, A1. A Ni-based base metal material is used. C
The u electrode is, for example, 500 ~
Bake at a temperature of 650°C. Phenol resin, epoxy resin, etc. are used as the heat-resistant resin, and in practice, they are mixed together with an inorganic filler and a solvent to form a paste, which is then hardened after, for example, screen printing.
次に、具体的な製造方法にしたがって説明する。Next, a specific manufacturing method will be explained.
抵抗膜の材料としてＲｕｂ、ペーストを用い、これをス
クリーン印刷して８００℃で焼付けて抵抗膜を作成し、
引出電極としてＣｕ電極を用い、さらに第２図に示すよ
うに、抵抗膜と引出電極とを含めてフェノール樹脂ペー
ストをスクリーン印刷し、２００℃で硬化して耐熱性樹
脂で被覆した。このとき、Ｃｕ電極にらいては窒素雰囲
気中６００℃で焼付した。Rub and paste were used as the material for the resistive film, and this was screen printed and baked at 800°C to create the resistive film.
A Cu electrode was used as the extraction electrode, and as shown in FIG. 2, a phenol resin paste was screen printed on the resistive film and the extraction electrode, and the paste was cured at 200° C. and covered with a heat-resistant resin. At this time, the Cu electrode was baked at 600° C. in a nitrogen atmosphere.
得られた抵抗体を５ｎ６０％、Ｐｂ４０％の比率からな
る２３０℃の半田槽に５秒間浸漬し、そののち抵抗値を
測定し、初期抵抗値と比較してその変化率を求めた。な
おフラックスとしてはロジン系のものを用いた。The obtained resistor was immersed for 5 seconds in a 230° C. solder bath consisting of 60% 5N and 40% Pb, and then its resistance was measured and compared with the initial resistance to determine the rate of change. Note that a rosin-based flux was used as the flux.
下表は種々の面積抵抗値を有する抵抗体について、抵抗
変化率を示したものである。比較例として耐熱性樹脂を
被覆していないものの測定結果も合わせて示した。The table below shows the resistance change rate for resistors having various sheet resistance values. As a comparative example, the measurement results of a sample not coated with a heat-resistant resin are also shown.
上表から明らかなようにこの発明方法によれば、抵抗体
の半田耐熱性を向上させることができるとともに、抵抗
値の変化を小さくすることができるという効果が得られ
ている。As is clear from the table above, according to the method of the present invention, it is possible to improve the soldering heat resistance of the resistor and to reduce the change in resistance value.
上記した実施例では、抵抗膜と引出電極の重なり部分の
上のみならず、抵抗膜の上に耐熱性樹脂を被覆したが、
この発明の目的を達成するために抵抗膜と引出電極の重
なり部分の上にのみ耐熱性樹脂を被覆しても、十分目的
を達成することができる。In the above embodiment, the heat-resistant resin was coated not only on the overlapping portion of the resistive film and the extraction electrode but also on the resistive film.
Even if the heat-resistant resin is coated only on the overlapping portion of the resistive film and the extraction electrode, the object of the present invention can be sufficiently achieved.
（発明の効果）
この発明方法によれば、絶縁基板の上に、抵抗膜を空気
中で焼付け、この抵抗膜の端部の上に一部重ねて卑金属
ペーストを塗布し、この卑金属ペーストを抵抗膜の焼付
は温度より低い温度で還元雰囲気で焼付けて、抵抗膜の
端部に一部重なる引出電極を形成し、さらに抵抗膜と引
出電極の重なり部分の上を耐熱性樹脂で被覆することに
より、抵抗体の半田耐熱性を向上させることができると
ともに、抵抗値の変化を小さくすることができるという
効果を有する。(Effects of the Invention) According to the method of the invention, a resistive film is baked in air on an insulating substrate, a base metal paste is applied partially overlapping the ends of the resistive film, and the base metal paste is applied to the resistor. The film is baked in a reducing atmosphere at a temperature lower than the normal temperature to form an extraction electrode that partially overlaps the end of the resistive film, and then coats the overlapping part of the resistive film and the extraction electrode with a heat-resistant resin. This has the effect of being able to improve the soldering heat resistance of the resistor and to reduce the change in resistance value.
第１図はこの発明の背景となった抵抗体の断面図、第２
図はこの発明の製造方法により得られた抵抗体の一実施
例を示す断面図である。
１１−絶縁基板、・１２−抵抗膜、１３．１４−引出電
極、１５−耐熱性樹脂Figure 1 is a cross-sectional view of the resistor that forms the background of this invention, Figure 2
The figure is a sectional view showing an example of a resistor obtained by the manufacturing method of the present invention. 11-insulating substrate, 12-resistance film, 13.14-extracting electrode, 15-heat-resistant resin
Claims (1)
の端部の上に一部重ねて卑金属ペーストを塗布し、この
卑金属ペーストを抵抗膜の焼付け温度より低い温度で還
元雰囲気で焼付けて、抵抗膜の端部に一部重なる引出電
極を形成し、さらに抵抗膜と引出電極の重なり部分の上
に耐熱性樹脂を被覆したことを特徴とする抵抗体の製造
方法。A resistive film is baked in air on an insulating substrate, a base metal paste is applied partially overlapping the edges of the resistive film, and the base metal paste is baked in a reducing atmosphere at a temperature lower than the baking temperature of the resistive film. A method for manufacturing a resistor, comprising: forming an extraction electrode that partially overlaps an end of the resistance film, and further covering the overlapping portion of the resistance film and the extraction electrode with a heat-resistant resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1225535A JPH02110903A (en) | 1989-08-31 | 1989-08-31 | Manufacture of resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1225535A JPH02110903A (en) | 1989-08-31 | 1989-08-31 | Manufacture of resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02110903A true JPH02110903A (en) | 1990-04-24 |
| JPH0553284B2 JPH0553284B2 (en) | 1993-08-09 |
Family
ID=16830818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1225535A Granted JPH02110903A (en) | 1989-08-31 | 1989-08-31 | Manufacture of resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110903A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5355112A (en) * | 1992-02-07 | 1994-10-11 | Murata Mfg., Co., Ltd. | Fixed resistor |
| US6242999B1 (en) * | 1998-01-20 | 2001-06-05 | Matsushita Electric Industrial Co., Ltd. | Resistor |
| US6470167B2 (en) | 2000-02-24 | 2002-10-22 | Samsung Electronics Co., Ltd. | Heating roller for fixing a toner image and method of manufacturing the same |
| EP1460649A1 (en) * | 2001-11-28 | 2004-09-22 | Rohm Co., Ltd. | Chip resistor and method for producing the same |
| US7240429B2 (en) | 2001-06-13 | 2007-07-10 | Denso Corporation | Manufacturing method for a printed circuit board |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10217550B2 (en) | 2009-09-04 | 2019-02-26 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| US11555831B2 (en) | 2020-08-20 | 2023-01-17 | Vishay Dale Electronics, Llc | Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508493A (en) * | 1973-05-19 | 1975-01-28 | ||
| JPS5368943U (en) * | 1976-11-12 | 1978-06-09 | ||
| JPS5595302A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Ind Co Ltd | Chip resistor and method of fabricating same |
| JPS57145358A (en) * | 1981-03-03 | 1982-09-08 | Nec Corp | Preparation of thin-film resistor |
| JPS57191001U (en) * | 1981-05-29 | 1982-12-03 | ||
| JPS57197802A (en) * | 1981-05-29 | 1982-12-04 | Rohm Kk | Chip-shaped electronic part |
| JPS5810886A (en) * | 1981-07-11 | 1983-01-21 | 株式会社アサヒ化学研究所 | Method of fomring conductor circuit on insulating board |
-
1989
- 1989-08-31 JP JP1225535A patent/JPH02110903A/en active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508493A (en) * | 1973-05-19 | 1975-01-28 | ||
| JPS5368943U (en) * | 1976-11-12 | 1978-06-09 | ||
| JPS5595302A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Ind Co Ltd | Chip resistor and method of fabricating same |
| JPS57145358A (en) * | 1981-03-03 | 1982-09-08 | Nec Corp | Preparation of thin-film resistor |
| JPS57191001U (en) * | 1981-05-29 | 1982-12-03 | ||
| JPS57197802A (en) * | 1981-05-29 | 1982-12-04 | Rohm Kk | Chip-shaped electronic part |
| JPS5810886A (en) * | 1981-07-11 | 1983-01-21 | 株式会社アサヒ化学研究所 | Method of fomring conductor circuit on insulating board |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5355112A (en) * | 1992-02-07 | 1994-10-11 | Murata Mfg., Co., Ltd. | Fixed resistor |
| US6242999B1 (en) * | 1998-01-20 | 2001-06-05 | Matsushita Electric Industrial Co., Ltd. | Resistor |
| US6470167B2 (en) | 2000-02-24 | 2002-10-22 | Samsung Electronics Co., Ltd. | Heating roller for fixing a toner image and method of manufacturing the same |
| US7240429B2 (en) | 2001-06-13 | 2007-07-10 | Denso Corporation | Manufacturing method for a printed circuit board |
| EP1460649A1 (en) * | 2001-11-28 | 2004-09-22 | Rohm Co., Ltd. | Chip resistor and method for producing the same |
| EP1460649A4 (en) * | 2001-11-28 | 2008-10-01 | Rohm Co Ltd | Chip resistor and method for producing the same |
| US10796826B2 (en) | 2009-09-04 | 2020-10-06 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
| US10217550B2 (en) | 2009-09-04 | 2019-02-26 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
| US12009127B2 (en) | 2009-09-04 | 2024-06-11 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
| US11562838B2 (en) | 2009-09-04 | 2023-01-24 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| US11555831B2 (en) | 2020-08-20 | 2023-01-17 | Vishay Dale Electronics, Llc | Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0553284B2 (en) | 1993-08-09 |
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