JPH0211034B2 - - Google Patents
Info
- Publication number
- JPH0211034B2 JPH0211034B2 JP27847984A JP27847984A JPH0211034B2 JP H0211034 B2 JPH0211034 B2 JP H0211034B2 JP 27847984 A JP27847984 A JP 27847984A JP 27847984 A JP27847984 A JP 27847984A JP H0211034 B2 JPH0211034 B2 JP H0211034B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- wiring board
- adhesive
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 37
- 238000007747 plating Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27847984A JPS61154198A (ja) | 1984-12-27 | 1984-12-27 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27847984A JPS61154198A (ja) | 1984-12-27 | 1984-12-27 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61154198A JPS61154198A (ja) | 1986-07-12 |
| JPH0211034B2 true JPH0211034B2 (en, 2012) | 1990-03-12 |
Family
ID=17597901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27847984A Granted JPS61154198A (ja) | 1984-12-27 | 1984-12-27 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61154198A (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126297A (ja) * | 1986-11-14 | 1988-05-30 | イビデン株式会社 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
-
1984
- 1984-12-27 JP JP27847984A patent/JPS61154198A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61154198A (ja) | 1986-07-12 |
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