JPH02110349U - - Google Patents

Info

Publication number
JPH02110349U
JPH02110349U JP1989019464U JP1946489U JPH02110349U JP H02110349 U JPH02110349 U JP H02110349U JP 1989019464 U JP1989019464 U JP 1989019464U JP 1946489 U JP1946489 U JP 1946489U JP H02110349 U JPH02110349 U JP H02110349U
Authority
JP
Japan
Prior art keywords
semiconductor chip
connection
bump electrodes
connection means
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989019464U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989019464U priority Critical patent/JPH02110349U/ja
Publication of JPH02110349U publication Critical patent/JPH02110349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)
JP1989019464U 1989-02-21 1989-02-21 Pending JPH02110349U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989019464U JPH02110349U (de) 1989-02-21 1989-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989019464U JPH02110349U (de) 1989-02-21 1989-02-21

Publications (1)

Publication Number Publication Date
JPH02110349U true JPH02110349U (de) 1990-09-04

Family

ID=31235000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989019464U Pending JPH02110349U (de) 1989-02-21 1989-02-21

Country Status (1)

Country Link
JP (1) JPH02110349U (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5866347A (ja) * 1981-10-16 1983-04-20 Nec Corp 複合半導体ペレツト
JPS58154254A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS5929036B2 (ja) * 1973-06-29 1984-07-17 株式会社日立製作所 半導体通話路スイツチ
JPS60150660A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929036B2 (ja) * 1973-06-29 1984-07-17 株式会社日立製作所 半導体通話路スイツチ
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5866347A (ja) * 1981-10-16 1983-04-20 Nec Corp 複合半導体ペレツト
JPS58154254A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS60150660A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置

Similar Documents

Publication Publication Date Title
JPH02110349U (de)
JPS6338328U (de)
JPH0289852U (de)
JPS6379677U (de)
JPS62168657U (de)
JPS61153374U (de)
JPS6416636U (de)
JPS62134254U (de)
JPH01113362U (de)
JPH01125541U (de)
JPS63145343U (de)
JPS63115233U (de)
JPS6228474U (de)
JPS646038U (de)
JPS63164245U (de)
JPH0350347U (de)
JPS6298242U (de)
JPS63197356U (de)
JPS6310571U (de)
JPS5881940U (ja) 半導体素子の取付構造
JPS6367255U (de)
JPS5954938U (ja) リ−ドレスパッケ−ジの多段構造
JPS59121849U (ja) 混成集積回路装置
JPS62163956U (de)
JPS62147355U (de)