JPS63115233U - - Google Patents
Info
- Publication number
- JPS63115233U JPS63115233U JP766387U JP766387U JPS63115233U JP S63115233 U JPS63115233 U JP S63115233U JP 766387 U JP766387 U JP 766387U JP 766387 U JP766387 U JP 766387U JP S63115233 U JPS63115233 U JP S63115233U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- lead
- lead frame
- resin
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP766387U JPS63115233U (de) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP766387U JPS63115233U (de) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115233U true JPS63115233U (de) | 1988-07-25 |
Family
ID=30791326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP766387U Pending JPS63115233U (de) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115233U (de) |
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1987
- 1987-01-21 JP JP766387U patent/JPS63115233U/ja active Pending