JPH0211017B2 - - Google Patents

Info

Publication number
JPH0211017B2
JPH0211017B2 JP18798483A JP18798483A JPH0211017B2 JP H0211017 B2 JPH0211017 B2 JP H0211017B2 JP 18798483 A JP18798483 A JP 18798483A JP 18798483 A JP18798483 A JP 18798483A JP H0211017 B2 JPH0211017 B2 JP H0211017B2
Authority
JP
Japan
Prior art keywords
layer
winding
wire
winding part
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18798483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6080263A (ja
Inventor
Naoyuki Hosoda
Tamotsu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP18798483A priority Critical patent/JPS6080263A/ja
Publication of JPS6080263A publication Critical patent/JPS6080263A/ja
Publication of JPH0211017B2 publication Critical patent/JPH0211017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H55/00—Wound packages of filamentary material
    • B65H55/04—Wound packages of filamentary material characterised by method of winding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP18798483A 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ Granted JPS6080263A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18798483A JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18798483A JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6080263A JPS6080263A (ja) 1985-05-08
JPH0211017B2 true JPH0211017B2 (OSRAM) 1990-03-12

Family

ID=16215578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18798483A Granted JPS6080263A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6080263A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053114U (ja) * 1991-06-27 1993-01-19 本州製紙株式会社 食品用テ−パ付き折畳みトレ−

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053114U (ja) * 1991-06-27 1993-01-19 本州製紙株式会社 食品用テ−パ付き折畳みトレ−

Also Published As

Publication number Publication date
JPS6080263A (ja) 1985-05-08

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