JPH0210766Y2 - - Google Patents
Info
- Publication number
- JPH0210766Y2 JPH0210766Y2 JP2154384U JP2154384U JPH0210766Y2 JP H0210766 Y2 JPH0210766 Y2 JP H0210766Y2 JP 2154384 U JP2154384 U JP 2154384U JP 2154384 U JP2154384 U JP 2154384U JP H0210766 Y2 JPH0210766 Y2 JP H0210766Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cable
- weight
- tape
- junction box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 62
- 238000005260 corrosion Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 238000004804 winding Methods 0.000 claims description 14
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 7
- 239000005062 Polybutadiene Substances 0.000 claims description 5
- -1 isocyanate compound Chemical class 0.000 claims description 5
- 229920002857 polybutadiene Polymers 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 229920001084 poly(chloroprene) Polymers 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004819 Drying adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2154384U JPS60135024U (ja) | 1984-02-17 | 1984-02-17 | ケ−ブル接続箱 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2154384U JPS60135024U (ja) | 1984-02-17 | 1984-02-17 | ケ−ブル接続箱 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60135024U JPS60135024U (ja) | 1985-09-07 |
| JPH0210766Y2 true JPH0210766Y2 (OSRAM) | 1990-03-16 |
Family
ID=30513028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2154384U Granted JPS60135024U (ja) | 1984-02-17 | 1984-02-17 | ケ−ブル接続箱 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135024U (OSRAM) |
-
1984
- 1984-02-17 JP JP2154384U patent/JPS60135024U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60135024U (ja) | 1985-09-07 |
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