JPH02106846U - - Google Patents

Info

Publication number
JPH02106846U
JPH02106846U JP1600989U JP1600989U JPH02106846U JP H02106846 U JPH02106846 U JP H02106846U JP 1600989 U JP1600989 U JP 1600989U JP 1600989 U JP1600989 U JP 1600989U JP H02106846 U JPH02106846 U JP H02106846U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
ceramic substrate
bias
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1600989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1600989U priority Critical patent/JPH02106846U/ja
Publication of JPH02106846U publication Critical patent/JPH02106846U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】
第１図はこの考案の一実施例による混成集積回
路装置の回路図、第２図は従来の混成集積回路装
置の回路図である。 図において、１はトランジスタ、２は電源電圧
端子、３はダイオード、４，５，６は厚膜抵抗素
子、７，８は厚膜による感熱抵抗素子を示す。な
お、図中、同一符号は同一、又は相当部分を示す
。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク基板上に構成される混成集積回路に
    おいて、大電力動作で設計されたトランジスタの
    バイアス回路のバイアス抵抗に直列または並列に
    感熱抵抗素子を厚膜形成により、セラミツク基板
    上に形成したことを特徴とする混成集積回路装置
    。
JP1600989U 1989-02-14 1989-02-14 Pending JPH02106846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1600989U JPH02106846U (ja) 1989-02-14 1989-02-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1600989U JPH02106846U (ja) 1989-02-14 1989-02-14

Publications (1)

Publication Number Publication Date
JPH02106846U true JPH02106846U (ja) 1990-08-24

Family

ID=31228563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1600989U Pending JPH02106846U (ja) 1989-02-14 1989-02-14

Country Status (1)

Country Link
JP (1) JPH02106846U (ja)

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