JPH02106840U - - Google Patents
Info
- Publication number
- JPH02106840U JPH02106840U JP1600689U JP1600689U JPH02106840U JP H02106840 U JPH02106840 U JP H02106840U JP 1600689 U JP1600689 U JP 1600689U JP 1600689 U JP1600689 U JP 1600689U JP H02106840 U JPH02106840 U JP H02106840U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- semiconductor
- leads
- operate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す半導体装置
のリード部分の斜視図、第２図は従来の半導体装
置のリード部分の斜視図である。
図中、１はリード、２は絶縁体、３はメタライ
ズ部、４はリード１の厚みの変化している部分で
ある。なお、図中、同一符号は同一、又は相当部
分を示す。
FIG. 1 is a perspective view of a lead portion of a semiconductor device showing an embodiment of this invention, and FIG. 2 is a perspective view of a lead portion of a conventional semiconductor device. In the figure, 1 is a lead, 2 is an insulator, 3 is a metallized portion, and 4 is a portion of the lead 1 where the thickness changes. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ードの厚さをパツケージの取付部よりパツケージ
外部で薄く形成したことを特徴とした半導体装置
。 A semiconductor device characterized in that the leads of a semiconductor package that operate in a high frequency band are formed thinner outside the package than at the mounting part of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1600689U JPH02106840U (en) | 1989-02-14 | 1989-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1600689U JPH02106840U (en) | 1989-02-14 | 1989-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106840U true JPH02106840U (en) | 1990-08-24 |
Family
ID=31228557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1600689U Pending JPH02106840U (en) | 1989-02-14 | 1989-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106840U (en) |
-
1989
- 1989-02-14 JP JP1600689U patent/JPH02106840U/ja active Pending
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