JPH0210578B2 - - Google Patents

Info

Publication number
JPH0210578B2
JPH0210578B2 JP59072425A JP7242584A JPH0210578B2 JP H0210578 B2 JPH0210578 B2 JP H0210578B2 JP 59072425 A JP59072425 A JP 59072425A JP 7242584 A JP7242584 A JP 7242584A JP H0210578 B2 JPH0210578 B2 JP H0210578B2
Authority
JP
Japan
Prior art keywords
heat sink
protrusion
power transistor
groove
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59072425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60216572A (ja
Inventor
Kikuo Isoyama
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP59072425A priority Critical patent/JPS60216572A/ja
Publication of JPS60216572A publication Critical patent/JPS60216572A/ja
Publication of JPH0210578B2 publication Critical patent/JPH0210578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/027—
    • H10W72/07351—
    • H10W72/30—
    • H10W72/381—
    • H10W72/387—
    • H10W74/127—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
JP59072425A 1984-04-11 1984-04-11 ヒ−トシンクの製造方法 Granted JPS60216572A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59072425A JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59072425A JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS60216572A JPS60216572A (ja) 1985-10-30
JPH0210578B2 true JPH0210578B2 (cg-RX-API-DMAC10.html) 1990-03-08

Family

ID=13488922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59072425A Granted JPS60216572A (ja) 1984-04-11 1984-04-11 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS60216572A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62238026A (ja) * 1986-04-08 1987-10-19 Sanyo Electric Co Ltd ヒ−トシンクの製造方法
DE10333329B4 (de) * 2003-07-23 2011-07-21 SEMIKRON Elektronik GmbH & Co. KG, 90431 Leistungshalbleitermodul mit biegesteifer Grundplatte

Also Published As

Publication number Publication date
JPS60216572A (ja) 1985-10-30

Similar Documents

Publication Publication Date Title
JP4121185B2 (ja) 電子回路装置
US6720646B2 (en) Power converter with improved lead frame arrangement including stand-up portion
KR101099242B1 (ko) 전자 제어 장치
GB2305029A (en) Surface-mount type microminiature electric current fuse
KR101994727B1 (ko) 전력 모듈 패키지 및 그 제조방법
JP2003115681A (ja) 電子部品の実装構造
JP2006100759A (ja) 回路装置およびその製造方法
WO2000054560A1 (en) A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
JP3544757B2 (ja) 半導体装置及びその製造方法
JPH0210578B2 (cg-RX-API-DMAC10.html)
JP4046623B2 (ja) パワー半導体モジュールおよびその固定方法
JPH11260968A (ja) 複合半導体装置
JP2950468B2 (ja) 半導体装置
JP2698259B2 (ja) ヒートシンクの製造方法
US6128189A (en) Device for withdrawal of thermal power loss of electronic or electrical components
JP3171330B2 (ja) 半導体装置
JPH0410742B2 (cg-RX-API-DMAC10.html)
JPS6233330Y2 (cg-RX-API-DMAC10.html)
JPH0617249U (ja) 半導体装置
JP2002076259A (ja) パワーモジュール
JPH04313257A (ja) 放熱用のスラッグを有した電子部品搭載用基板
KR100373936B1 (ko) 파워 모듈 방열 구조
JPH0338745B2 (cg-RX-API-DMAC10.html)
JP2575836Y2 (ja) 半導体装置
JPH0412677Y2 (cg-RX-API-DMAC10.html)