JPH0210573B2 - - Google Patents

Info

Publication number
JPH0210573B2
JPH0210573B2 JP57111133A JP11113382A JPH0210573B2 JP H0210573 B2 JPH0210573 B2 JP H0210573B2 JP 57111133 A JP57111133 A JP 57111133A JP 11113382 A JP11113382 A JP 11113382A JP H0210573 B2 JPH0210573 B2 JP H0210573B2
Authority
JP
Japan
Prior art keywords
wire
discharge
section
signal
control section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57111133A
Other languages
English (en)
Japanese (ja)
Other versions
JPS592332A (ja
Inventor
Katsumi Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP57111133A priority Critical patent/JPS592332A/ja
Publication of JPS592332A publication Critical patent/JPS592332A/ja
Publication of JPH0210573B2 publication Critical patent/JPH0210573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57111133A 1982-06-28 1982-06-28 ワイヤボンド装置のワイヤクランプ抜け検出装置 Granted JPS592332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57111133A JPS592332A (ja) 1982-06-28 1982-06-28 ワイヤボンド装置のワイヤクランプ抜け検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57111133A JPS592332A (ja) 1982-06-28 1982-06-28 ワイヤボンド装置のワイヤクランプ抜け検出装置

Publications (2)

Publication Number Publication Date
JPS592332A JPS592332A (ja) 1984-01-07
JPH0210573B2 true JPH0210573B2 (cg-RX-API-DMAC10.html) 1990-03-08

Family

ID=14553282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57111133A Granted JPS592332A (ja) 1982-06-28 1982-06-28 ワイヤボンド装置のワイヤクランプ抜け検出装置

Country Status (1)

Country Link
JP (1) JPS592332A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5929390A (en) * 1994-09-14 1999-07-27 Ishida Co., Ltd. Load cell weighing apparatus using the same

Also Published As

Publication number Publication date
JPS592332A (ja) 1984-01-07

Similar Documents

Publication Publication Date Title
US4771930A (en) Apparatus for supplying uniform tail lengths
JPS5811307B2 (ja) 短絡ア−ク溶接装置
JPS644338B2 (cg-RX-API-DMAC10.html)
US5326015A (en) Wire bonder tail length monitor
JP2617351B2 (ja) ワイヤ接続不良検出方法
JPH0210573B2 (cg-RX-API-DMAC10.html)
US4687897A (en) Flame-off limited circuit for wire bonding ball forming apparatus
JPH06101491B2 (ja) ワイヤボンデイング方法及びその装置
JPS62267080A (ja) プラズマト−チしや断回路
JPS6238074B2 (cg-RX-API-DMAC10.html)
EP0061852A2 (en) Self starting current controlled discharge bonding wire ball maker
JPH03281064A (ja) 溶接電源の出力制御方法
TW202442344A (zh) 線切割放電加工方法
JP2722886B2 (ja) ワイヤボンディング装置
JPS6215017A (ja) ワイヤ放電加工装置
JPH03281063A (ja) 溶接電源の出力制御方法
JP2600706B2 (ja) 溶接用ワイヤ溶着防止検出方法
JP3078116B2 (ja) 消耗電極式アーク溶接電源装置
JP3253049B2 (ja) ワイヤボンディング装置におけるボール径検出方法及びボール径検出装置
JP3462304B2 (ja) 電気溶接装置及び電気溶接方法
US6660956B1 (en) Method of and apparatus for monitoring a ball forming process
JP2611891B2 (ja) ワイヤボンディング装置及びその方法
JPH0317377B2 (cg-RX-API-DMAC10.html)
JPH0341895Y2 (cg-RX-API-DMAC10.html)
JP3908380B2 (ja) ワイヤボンディング装置及び該装置を用いた半導体装置の製造方法