JPH02105499A - Method of supplying chip component of chip mounter - Google Patents

Abstract

PURPOSE:To obviate the need to separate the top tape of a carrier tape prior to the suction of chip components by a suction nozzle by pushing out chip components from the side opposite to the suction nozzle of the carrier tape using a thrust head. CONSTITUTION:When a carrier tape 11 is fed, a roll cutter 21 is rotated and a top tape 24 is damaged reasonably. When a chip component 13 to be taken out is moved above a thrust head 25, the supply of the carrier tape 11 is stopped. In this state, by making the thrust head 25 move in the upward direction, the chip component 13 is projected out of a top tape. The section where the chip component 13 are projected from the top tape 14 or the chip component 13 projecting completely from the top tape 14 is suck on the suck nozzle 24 and these chip components are transferred to a preset position on a printed wiring board.

Description

[Detailed Description of the Invention] Summary: A method for supplying chip components housed in a carrier tape in a chip mounter, which facilitates setting of the carrier tape to a tape feeding unit, simplifies the configuration, and eliminates waste of chip components. Regarding a suitable chip component supply method for a chip mounter, the present invention relates to a chip mounter in which chip components are suctioned by a suction nozzle from a carrier tape in which chip components are arranged and housed, and are taken out in order and mounted on a predetermined position on a printed wiring board. The chip component is pushed out from the side of the carrier tape opposite to the suction nozzle by a push-up head, and the portion of the chip component protruding from the carrier tape is sucked and taken out by the suction nozzle.

FIELD OF INDUSTRIAL APPLICATION The present invention relates to a method for supplying chip components accommodated in a carrier tape for use in chip mounters.

In the field of electronic device manufacturing, electronic components such as transistors, resistors, and capacitors are attached to printed wiring boards on which wiring patterns are formed, and electronic circuits are constructed by soldering the electronic components and wiring patterns. I have to. In recent years, in order to automate the mounting or soldering work of components or to increase the mounting density, surface mounting technology has been used in which soldering is performed by, for example, a reflow method. One type of reflow is
The adhesiveness of the cream solder attached to the predetermined position of the wiring pattern allows the chip parts (components without lead wires) to be attached to the printed wiring board, and by remelting the cream solder in a heating furnace, for example, It is designed to electrically connect and mechanically fix chip components to wiring patterns. Chip mounter uses carrier tape in surface mount technology using one-sided reflow method. This device is used to take out the chip components that have been arranged and housed one by one, transport them to a predetermined position on a printed wiring board, and mount the chip components at that position. Since this single layer chip mounter usually handles a wide variety of chip components, it is desired that the carrier tape in which the chip components are accommodated be easily set.

BACKGROUND OF THE INVENTION FIG. 5 is a diagram for explaining the structure and operation of a general chip mounter. This chip mounter includes a chip component supply section 41, a chip component transfer section 42 that transfers the chip components supplied by the chip component supply section 41, and a chip component transferred by the chip component transfer section 42 onto a printed wiring board 44. The chip component mounting section 43 is mounted at a predetermined position of the chip component mounting section 43. In the chip component supply unit 41, a plurality of tape feeding units 41-1.2 are configured to supply respective chip components from carrier tapes each containing a unique chip component.
3. ... are installed in parallel, each tape feeding unit) 41-1.
2, 3. ... can be moved from side to side in the figure to supply chip components from a desired unit. The chip component transfer unit 42 arranges, for example, 24 suction nozzles 42-1 to 24 at equal intervals on a concentric circle,
For example, by rotating these clockwise by 15 degrees (in the case of 24 heads), the chip components taken out from the chip component supply section 41 by the respective suction nozzles 42-1 to 42-24 are sequentially transferred to the chip component mounting section 43. is configured to do so. The chip component mounting section 43 is configured to move the printed wiring board 44 in the horizontal and vertical directions in the figure depending on the position where each chip component is to be mounted.

In the operating state shown in FIG.
-1 is a tape feeding unit 41-41: It sucks and sucks the chip components supplied from the tape feeding unit 41-41, and the suction nozzle 42-1
3 releases the suction and the transferred chip components are mounted on a predetermined position on the printed wiring board 44. in this way,
By continuously operating the chip component supply section 4L, the chip component transfer section 42, and the chip component mounting section 43 in cooperation, it is possible to mount, for example, several chip components on a printed wiring board at high speed per second.

A carrier tape containing chip components is generally sealed with a top tape to prevent the chip components from falling off, and when the chip components are sucked by a suction nozzle and taken out from the carrier tape, the top tape is used to remove the chip components from the carrier tape. need to be peeled off. For this reason, conventionally, a tape feeding unit as shown in FIG. 6 has been used. This tape feeding unit passes a carrier tape 52 fed from a tape reel 51 under a holding plate 53 and winds it around a ratcheted shaft 54, and then peels off the top tape 52.
5 is wound up by a winding wheel 56 that passes through the upper side of a pressing plate 53 and is rotated counterclockwise. When the ratcheted shaft 54 is rotated clockwise in the figure to move the carrier tape 52 step by step at intervals of the chip parts, the top tape 55 that has been sent out in front of the presser plate 53 by the amount of movement of the carrier tape 52 is wound up - The chip component is wound up by a suction nozzle and exposed at the position indicated by the arrow 8, so that it can be sucked up by a suction nozzle.

Problems to be Solved by the Invention The conventional tape feeding unit as shown in FIG. 6 has a complicated structure due to the necessity of peeling off the top tape. Providing a large number of devices depending on the type increases production costs and requires complicated maintenance work. Furthermore, it is not easy to set the carrier tape on the tape feeding unit, and it is difficult to automate this process. Furthermore, when reusing a tape reel whose carrier tape has been partially used, there is also a problem in that it is not possible to use chip components for the length of the tape required for the tape set.

The present invention was created in view of the above circumstances, and provides a chip mounter for supplying chip parts suitable for facilitating the setting of a carrier tape in a tape feeding unit, simplifying the configuration, and eliminating waste of chip parts. The purpose is to provide a method.

Means to solve problems FIG. 1 is a diagram showing the principle of the present invention.

In the chip component supply method of the present invention, chip components 1 are suctioned by a suction nozzle 3 from a carrier tape 2 in which chip components 1 are arranged and housed, and the chips are taken out in order and mounted on a predetermined position on a printed wiring board. Can be applied to mounters.

The feature is that the chip component 1 is pushed out by the push-up head 4 from the side opposite to the suction nozzle 3 of the carrier tape 2, and the part of the chip component 1 that protrudes from the carrier tape 2 is sucked by the suction bow nozzle 3. This is done so that it can be taken out.

Function: In the method of the present invention, a push-up head is used to push out a chip component from the side opposite to the suction bow nozzle of the carrier tape, so that the chip component is made to protrude from the carrier tape, and the protruding portion is sucked by a suction nozzle. Therefore, there is no need to peel off the top tape of the carrier tape prior to suction of the chip component by the suction nozzle. That is, the above-mentioned problem is achieved.

Example Embodiments of the present invention will be described below based on the drawings.

FIG. 2 is a cross-sectional configuration diagram of the main parts of a tape feeding unit showing an embodiment of the present invention, and FIG. 3 is a plan view of the carrier tape shown in FIG. FIG.

First, the structure of the carrier tape will be explained. As shown in FIG. 3, this carrier tape 11 includes a tape base 12 in which a plurality of depressions 12a are formed for arranging and accommodating a plurality of chip components 13, and the chip components accommodated in the depressions 12a. 13, and a top tape 14 that closes the opening of the recess 12a to prevent the chip component 13 from falling off. The top tape 14 is attached to the tape base 12 at a position where it does not come into contact with the chip component 13, for example. A hole 12b is provided approximately at the center of the bottom of the recess 12a in order to allow a push-up head (described later) to pass therethrough and push the chip component 13 toward the top tape 14 side. Incidentally, a plurality of holes or grooves 12c are provided at equal intervals in the longitudinal direction of the tape base 12 so that the carrier tape can be moved in the same direction by a shaft with a ratchet.

As shown in FIG. 2, the carrier tape 11 having the above-described structure is held in accordance with the conventional structure so as to move from left to right in the figure by the distance between the chip components. A roll cutter 21 is rotated counterclockwise in the figure around a rotating shaft 22 in conjunction with a tape feeding mechanism, and has a cutter portion 23 protruding from its surface. roll cutter 2
1, it is possible to form a perforation-like hole in the top tape 14 of the carrier tape or to break the top tape 14. A suction nozzle 24 is provided above the top tape 14 side of the carrier tape and moves vertically in the figure to suck and take out the chip component 13, and there is a suction hole 2 inside which is under negative pressure.
4a is formed. A push-up head 25 is provided on the opposite side of the carrier tape from the suction nozzle 24, and a suction hole 25a is formed in the interior thereof, similar to the suction nozzle 24. The tip of the push-up head 25 has a shape that penetrates the hole 12b of the tape base,
Therefore, by moving the push-up head 25 upward in the figure, it is possible to press the chip component 13 upward and cause the chip component 13 to protrude upward from the top tape 14 through the perforation or the like. 26 is chip part 1
This is a chip guide having an inner wall 26a having a shape corresponding to the outer shape of the top tape 14, and by inserting the chip component 13 protruding from the top tape 14 into the chip guide 26 along the inner wall 26a, the tilting of the chip component 13 is prevented. At the same time, the position of the chip component 13 within a plane perpendicular to the paper surface can be determined.

Next, the operation of this device will be explained. First, when the carrier tape 11 is sent out rightward in the figure, the roll cuffer 21 rotates in conjunction with this movement, and the top tape 24 is appropriately damaged. The chip component 13 to be taken out moves above the push-up head 25 (then the feeding of the carrier tape 11 stops, and in this state the push-up head 2
5 upward in the figure, the chip component 13 is made to protrude from the top tape 14. Then, the portion of the chip component 13 protruding from the top tape 14 or the chip component 13 completely protruding from the top tape 14 is sucked into the suction nozzle 24, and the chip component is transferred to a predetermined position on a printed wiring board (not shown). By sequentially performing this series of operations for each chip component, the chip component can be taken out without peeling off the top tape 14.

In addition to the carrier tape shown in FIG. 3, it is also possible to use the carrier tape shown in FIG. 4, for example.

That is, a hole 31a is formed in a tape base 31 made of thick paper or the like, a chip component 32 is housed in the hole 31a, and a top tape 33 and a hole 34a for pushing up the head are provided from both sides of the tape base 31. The method of the present invention can also be carried out by using a structure in which a bottom tape 34 is attached, in the same way as using the carrier tape shown in FIG.

In the above embodiment, a roll cutter is used to break the top tape, but the shape and size of the blade can be appropriately selected depending on the material of the top tape, etc. Moreover, not only a roll cutter but also a needle cutter, a razor cutter, and other cutters can be used. Furthermore, instead of providing a cutter in the tape feeding unit and interlocking the feeding of the carrier tape to damage the top tape, it is also possible to use a carrier tape with cuts, perforations, etc. formed in the top tape in advance.

In addition, if the strength of the top tape is weak compared to the pressing force of the chip component by the push-up head, the method of the present invention can be carried out without forming cuts, perforations, etc. in the top tape. . Furthermore, if the tape base or the bottom tape can be easily elastically deformed, the chip components can be pushed out from outside the tape base by the push-up head without providing a hole at the bottom of the chip component housing.

Effects of the Invention As detailed above, the method of the present invention has the effect that chip components can be supplied without peeling off the top tape on the carrier tape.

As a result, (1) the carrier tape can be easily attached to or detached from the tape feeding unit;

(2) (1) facilitates automation of processes including attachment and detachment of carrier tapes.

(3) When reusing a tape reel in which carrier tape has been used halfway, the tip of the carrier tape can be used from the beginning, which eliminates wastage of chip components.

(4) Compared to the top tape winding machine Tachibana in the prior art, the push-up head can be configured with a simpler structure, so the configuration of the chip mounter can be simplified.

[Brief explanation of drawings]

Fig. 1 is a principle diagram of the present invention, Fig. 2 is a cross-sectional configuration diagram of main parts of a tape feeding unit showing an embodiment of the present invention, and Fig. 3 is a plan view (a) of the carrier tape shown in Fig. 2.
) and (b) - sectional view (b) along the line (b), Figure 4 is a sectional view showing another example of the carrier tape, and Figure 5 is a cross-sectional view for explaining the structure and operation of the chip mounter. FIG. 6 is a side view of a conventional tape feeding unit. 1,! 3.32...Chip parts, 2.11...Carrier tape, 3.24...Suction bow nozzle, 2 principles of Figure 1. Zero sound lower f) To the front ellipse Figure 2
Figure 5... Push-up spatula

Claims (1)

[Claims] The chip components (1) are suctioned by a suction nozzle (3) from a carrier tape (2) in which the chip components (1) are arranged and housed, and taken out in order and mounted on a predetermined position on a printed wiring board. In a chip mounter configured to do this, the chip component (1) is pushed out from the opposite side of the carrier tape (2) from the suction nozzle (3) by the push-up head (4), and the chip component (1) is pushed out from the carrier tape (2). A chip component supply method for a chip mounter, characterized in that a protruding portion is sucked and taken out by a suction nozzle (3).