JPH02104963U - - Google Patents
Info
- Publication number
- JPH02104963U JPH02104963U JP1198989U JP1198989U JPH02104963U JP H02104963 U JPH02104963 U JP H02104963U JP 1198989 U JP1198989 U JP 1198989U JP 1198989 U JP1198989 U JP 1198989U JP H02104963 U JPH02104963 U JP H02104963U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- wafer
- liquid supply
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 1
Description
第１図は本考案の一実施例を示す部分断面図、
第２図は第１図のポリシングプレートの平面図、
第３図は本考案の実施例２におけるポリシングプ
レートを示す半断面図、第４図は従来の半導体ウ
エハポリシング装置を示す側面図、第５図は第４
図のポリシングプレートの平面図である。
１……Ｓｉ単結晶ウエハ、２……チヤツクテー
ブル、３……スピンドル、４……ポリシングプレ
ート、５……ポリシングパツト、６……供給路、
７……ポリシユ液供給口、８……Ｖ溝。
FIG. 1 is a partial sectional view showing an embodiment of the present invention;
Figure 2 is a plan view of the polishing plate in Figure 1;
FIG. 3 is a half-sectional view showing a polishing plate in Example 2 of the present invention, FIG. 4 is a side view showing a conventional semiconductor wafer polishing apparatus, and FIG.
FIG. 3 is a plan view of the polishing plate shown in the figure. DESCRIPTION OF SYMBOLS 1... Si single crystal wafer, 2... Chack table, 3... Spindle, 4... Polishing plate, 5... Polishing pad, 6... Supply path,
7...Polish liquid supply port, 8...V groove.
Claims (1)
ポリシユする半導体ウエハポリシング装置におい
て、ポリシングプレートに複数のポリシユ液供給
口をウエハ径範囲内に散在させて設けたことを特
徴とする半導体ウエハポリシング装置。 A semiconductor wafer polishing apparatus for polishing each wafer mounted on a plurality of chuck tables, characterized in that a polishing plate is provided with a plurality of polishing liquid supply ports scattered within a wafer diameter range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1198989U JPH02104963U (en) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1198989U JPH02104963U (en) | 1989-02-03 | 1989-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104963U true JPH02104963U (en) | 1990-08-21 |
Family
ID=31221029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1198989U Pending JPH02104963U (en) | 1989-02-03 | 1989-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104963U (en) |
-
1989
- 1989-02-03 JP JP1198989U patent/JPH02104963U/ja active Pending