JPH02104628U - - Google Patents

Info

Publication number
JPH02104628U
JPH02104628U JP1329589U JP1329589U JPH02104628U JP H02104628 U JPH02104628 U JP H02104628U JP 1329589 U JP1329589 U JP 1329589U JP 1329589 U JP1329589 U JP 1329589U JP H02104628 U JPH02104628 U JP H02104628U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
hot plate
semiconductor
baking
heats
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1329589U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1329589U priority Critical patent/JPH02104628U/ja
Publication of JPH02104628U publication Critical patent/JPH02104628U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の実施例1を示す構成図、第2
図は本考案の実施例2を示す構成図、第3図は従
来のウエハのベーキング装置を示す構成図である
。 1……ウエハ、2……ホツトプレート、3……
温度制御手段、4……ウエハリフタ、5……モー
タ、6……ウエハリフタ制御手段、7……ウエハ
温度検知手段。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板をホツトプレート上に水平に保持し
    て、半導体基板を所望の温度に加熱する半導体基
    板のベーキング装置において、半導体基板とホツ
    トプレート表面との距離及び昇降速度を制御する
    手段を設けたことを特徴とする半導体基板のベー
    キング装置。
JP1329589U 1989-02-07 1989-02-07 Pending JPH02104628U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1329589U JPH02104628U (ja) 1989-02-07 1989-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1329589U JPH02104628U (ja) 1989-02-07 1989-02-07

Publications (1)

Publication Number Publication Date
JPH02104628U true JPH02104628U (ja) 1990-08-20

Family

ID=31223478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1329589U Pending JPH02104628U (ja) 1989-02-07 1989-02-07

Country Status (1)

Country Link
JP (1) JPH02104628U (ja)

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