JPH01121927U - - Google Patents
Info
- Publication number
- JPH01121927U JPH01121927U JP1711888U JP1711888U JPH01121927U JP H01121927 U JPH01121927 U JP H01121927U JP 1711888 U JP1711888 U JP 1711888U JP 1711888 U JP1711888 U JP 1711888U JP H01121927 U JPH01121927 U JP H01121927U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- semiconductor device
- temperature sensor
- heater block
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の加熱治具の断面図
、第２図は従来の加熱治具の断面図である。 １……半導体装置、２……ケース、３……押え
部品、４……温度センサ、５……ヒータブロツク
、６……ヒータ、７……断熱材。
、第２図は従来の加熱治具の断面図である。 １……半導体装置、２……ケース、３……押え
部品、４……温度センサ、５……ヒータブロツク
、６……ヒータ、７……断熱材。
Claims (1)
- ヒータブロツク上に載置されて加熱される半導
体装置の上部を押え、かつその内部に温度センサ
が取付けられていることを特徴とする加熱治具。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017118U JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017118U JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121927U true JPH01121927U (ja) | 1989-08-18 |
| JPH0727624Y2 JPH0727624Y2 (ja) | 1995-06-21 |
Family
ID=31230617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017118U Expired - Lifetime JPH0727624Y2 (ja) | 1988-02-12 | 1988-02-12 | 加熱治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727624Y2 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9061797B2 (en) | 2006-10-28 | 2015-06-23 | Medea Inc. | Bottle for alcoholic or non alcoholic beverages |
| US9152968B2 (en) | 2007-06-22 | 2015-10-06 | Medea Inc. | System for and method of acting on beverage bottles |
| US9376235B2 (en) | 2009-11-02 | 2016-06-28 | Medea Inc. | Container for beverages |
| US9216844B2 (en) | 2012-06-01 | 2015-12-22 | Medea Inc. | Container for beverages |
| US8989673B2 (en) | 2012-09-28 | 2015-03-24 | Medea Inc. | System for delivering data to users |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS5987825A (ja) * | 1982-11-11 | 1984-05-21 | Toshiba Corp | ダイ・ボンデイング方法 |
| JPS6116536A (ja) * | 1985-06-21 | 1986-01-24 | Hitachi Ltd | ペレツトボンデイング装置 |
-
1988
- 1988-02-12 JP JP1988017118U patent/JPH0727624Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS5987825A (ja) * | 1982-11-11 | 1984-05-21 | Toshiba Corp | ダイ・ボンデイング方法 |
| JPS6116536A (ja) * | 1985-06-21 | 1986-01-24 | Hitachi Ltd | ペレツトボンデイング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727624Y2 (ja) | 1995-06-21 |