JPH02100334U - - Google Patents
Info
- Publication number
- JPH02100334U JPH02100334U JP773889U JP773889U JPH02100334U JP H02100334 U JPH02100334 U JP H02100334U JP 773889 U JP773889 U JP 773889U JP 773889 U JP773889 U JP 773889U JP H02100334 U JPH02100334 U JP H02100334U
- Authority
- JP
- Japan
- Prior art keywords
- element plate
- solder
- electrodes
- apply
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図乃至第４図はこの考案の圧電部品の製造
工程を示す正面図、第５図、第６図は従来品の内
部の各状態を示すため、コーテイングを透視した
正面図である。
１１……素子板、１２…振動電極、１５…リー
ド端子、１６…半田、１８…インク状エポキシ樹
脂、１９…ワツクス、２０…コーテイング。
1 to 4 are front views showing the manufacturing process of the piezoelectric component of this invention, and FIGS. 5 and 6 are front views looking through the coating to show various internal states of the conventional product. DESCRIPTION OF SYMBOLS 11...Element plate, 12...Vibration electrode, 15...Lead terminal, 16...Solder, 18...Ink-like epoxy resin, 19...Wax, 20...Coating.
Claims (1)
けし、半田取り付け部を含む素子板全体にインク
状のエポキシ系樹脂でコーテイングし、更に空洞
成形用のワツクスを塗布し、その上に樹脂コーテ
イングを施したことを特徴とする圧電部品。 Solder the electrodes of the element plate with the vibrating electrodes to the terminals, coat the entire element plate including the solder attachment part with ink-like epoxy resin, apply wax for cavity molding, and apply resin coating on top of that. A piezoelectric component characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP773889U JPH02100334U (en) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP773889U JPH02100334U (en) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02100334U true JPH02100334U (en) | 1990-08-09 |
Family
ID=31213006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP773889U Pending JPH02100334U (en) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02100334U (en) |
-
1989
- 1989-01-26 JP JP773889U patent/JPH02100334U/ja active Pending