JPS63174454U - - Google Patents
Info
- Publication number
- JPS63174454U JPS63174454U JP3761887U JP3761887U JPS63174454U JP S63174454 U JPS63174454 U JP S63174454U JP 3761887 U JP3761887 U JP 3761887U JP 3761887 U JP3761887 U JP 3761887U JP S63174454 U JPS63174454 U JP S63174454U
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- square
- resin mold
- electrodes
- shapes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図はこの考案に係る電子部品に用いる丸形
チツプ電子部品の斜視図、第２図は同上を角形チ
ツプ化するモールド金型の斜視図、第３図は同上
の要部拡大断面図、第４図は完成した角形チツプ
電子部品の斜視図、第５図と第６図及び第７図は
従来の角形チツプ電子部品の組立順序を示す斜視
図、第８図は同上の電子部品を示す側面図である
。
１……セラミツクケース、５……金属キヤツプ
、１１……モールド金型、１２……樹脂モールド
。
FIG. 1 is a perspective view of a round chip electronic component used in the electronic component according to this invention, FIG. 2 is a perspective view of a mold for forming the same into a square chip, and FIG. 3 is an enlarged sectional view of the main part of the same. Figure 4 is a perspective view of a completed square chip electronic component, Figures 5, 6, and 7 are perspective views showing the assembly order of conventional square chip electronic components, and Figure 8 shows the same electronic component as above. FIG. 1... Ceramic case, 5... Metal cap, 11... Mold, 12... Resin mold.
Claims (1)
ツプをエレメントの電極と導通させて取付ける丸
形チツプケースの外周に、モールド金型を用いて
角形状の樹脂モールドを施し、丸形チツプケース
の外形を角形チツプ形状にした電子部品。 A square-shaped resin mold is applied to the outer periphery of the round chip case, which stores the element inside and attaches metal caps at both ends by connecting them to the electrodes of the element. Electronic parts shaped into shapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3761887U JPS63174454U (en) | 1987-03-13 | 1987-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3761887U JPS63174454U (en) | 1987-03-13 | 1987-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174454U true JPS63174454U (en) | 1988-11-11 |
Family
ID=30849107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3761887U Pending JPS63174454U (en) | 1987-03-13 | 1987-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174454U (en) |
-
1987
- 1987-03-13 JP JP3761887U patent/JPS63174454U/ja active Pending