JPH0199535A - Ultrasonic probe - Google Patents
Ultrasonic probeInfo
- Publication number
- JPH0199535A JPH0199535A JP62258870A JP25887087A JPH0199535A JP H0199535 A JPH0199535 A JP H0199535A JP 62258870 A JP62258870 A JP 62258870A JP 25887087 A JP25887087 A JP 25887087A JP H0199535 A JPH0199535 A JP H0199535A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic transducer
- array
- ultrasonic
- adhered
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000002390 adhesive tape Substances 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 206010040844 Skin exfoliation Diseases 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、医療用超音波診断装置等に用いられるコンベ
ックス型の超音波探触子に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a convex type ultrasound probe used in medical ultrasound diagnostic equipment and the like.
従来の技術
近年、超音波診断装置は、医療の分野等で、盛んに利用
されている。中でも、コンベックス型の超音波探触子に
よる診断は、小さな接触面から広角度の視野と高精度な
画像が得られることから急速に普及しつつある。以下、
第２図（ａ）、 （ｂｌを参照しながら従来のコンベッ
クス型の超音波探触子について説明する。2. Description of the Related Art In recent years, ultrasonic diagnostic apparatuses have been widely used in the medical field and the like. Among these, diagnosis using convex-type ultrasound probes is rapidly becoming popular because it allows a wide-angle field of view and high-precision images to be obtained from a small contact surface. below,
A conventional convex type ultrasonic probe will be explained with reference to FIGS. 2(a) and 2(bl).
第２図（ａ）に示すように電気信号を機械的振動に変換
する超音波振動子（実際には圧電素子の両側に電極が設
けられているが簡略化して示している）５１の底面に背
面負荷材５２が形成され、この背面負荷材５２をベース
として、超音波振動子５１がスライシングマシン等によ
り短冊状に切断されて分割され、超音波振動子アレイが
形成される。そして、第２図（ｂ）に示すように背面負
荷材５２と共に湾曲され、支持体５３にあらかじめ加さ
れた曲面５４に接着され、コンベックス型（凸型）の超
音波振動子アレイが構成される。As shown in FIG. 2(a), the bottom surface of an ultrasonic vibrator 51 (actually, electrodes are provided on both sides of the piezoelectric element, but the illustration is simplified) converts electrical signals into mechanical vibrations. A back loading material 52 is formed, and using this back loading material 52 as a base, the ultrasonic transducer 51 is cut into strips by a slicing machine or the like and divided into strips to form an ultrasonic transducer array. Then, as shown in FIG. 2(b), it is curved together with the back load material 52 and adhered to the curved surface 54 applied in advance to the support 53, thereby forming a convex type (convex type) ultrasonic transducer array. .
このコンベックス型の超音波振動子アレイの前面に整響
整合層等が形成され、コンベックス型の超音波振動子ア
レイの電極に電気信号を印加する導体が接続される。A resonant matching layer or the like is formed on the front surface of this convex-type ultrasonic transducer array, and a conductor for applying an electric signal is connected to the electrodes of the convex-type ultrasonic transducer array.
そして、このコンベックス型の超音波振動子アレイによ
り放射状に広がる超音波ビームを発生させることができ
る。This convex type ultrasonic transducer array can generate ultrasonic beams that spread radially.
発明が解決しようとする問題点
しかしながら、以上のような従来の構成において、背面
負荷材５２の厚さは一般的には、数ｍ〜士十数である。Problems to be Solved by the Invention However, in the conventional configuration as described above, the thickness of the back load material 52 is generally from several meters to several tens of meters.
一方、スライシングマシンによって背面負荷材５２を切
断できるのは数百岬が限度である。このようにコンベッ
クス型超音波振動子アレイ側の一部【切り込みが形成さ
れただけである背面負荷材５２を湾曲させるには、かな
りの力が必要である。仮に背面負荷材５２を湾曲させ、
支持体５３の曲面５４に沿って接着したとしても、その
内部に持った応力は非常に大きなものであり、診断作業
を行なっている間にこの応力によって背面負荷材５２と
支持体５３との接着の剥離および曲率の変化等が発生す
るおそれがあシ、製品としての信頼性に問題がある。ま
た、背面負荷材５２は湾曲させるだめ、適度な柔軟性が
要求され、使用する背面負荷材５２の材質が制限される
。更には、コンベックス型の超音波振動子アレイの曲率
が十数ｍと小さな探触子を製造しようとする場合におい
ては、上記のような問題はますます大きくなる。On the other hand, the back load material 52 that can be cut by a slicing machine is limited to several hundred capes. In this way, a considerable force is required to bend the back load material 52, in which only a portion of the notch is formed on the convex type ultrasonic transducer array side. If the back load material 52 is temporarily curved,
Even if the adhesive is bonded along the curved surface 54 of the support 53, the stress inside it is very large, and during diagnostic work, this stress may cause the bonding between the back load material 52 and the support 53 to fail. There is a risk of peeling off and changes in curvature, etc., and there is a problem with the reliability of the product. In addition, the back load material 52 is required to have appropriate flexibility in order to be curved, and the material of the back load material 52 to be used is limited. Furthermore, when attempting to manufacture a probe with a convex type ultrasonic transducer array having a curvature as small as 10-odd meters, the above-mentioned problems become even more serious.
そこで、本発明は、曲率の小さなコンベックス型の超音
波振動子アレイであっても、容易に製造することができ
、また、信頼性の向上を図ることができ、更には、背面
負荷材の材質を自由に選択することができるようにした
超音波探触子を提供しようとするものである。Therefore, the present invention makes it possible to easily manufacture even a convex type ultrasonic transducer array with a small curvature, improve reliability, and further improve the material of the back load material. The aim is to provide an ultrasonic probe that allows the user to freely select the
問題点を解決するための手段
そして、上記問題点を解決する本発明の技術的手段は、
電気信号を機械的振動に変換する超音波振動子がアレイ
状に配列され、かつ各ギャップに柔軟性物質が充填され
、この超音波振動子アレイが湾曲されて背面負荷材の曲
面に接着されたものである。Means for solving the problems and the technical means of the present invention for solving the above problems are:
Ultrasonic transducers that convert electrical signals into mechanical vibrations were arranged in an array, each gap was filled with a flexible material, and this ultrasonic transducer array was curved and bonded to the curved surface of the back load material. It is something.
作用 この技術的手段による作用は次のようになる。action The effect of this technical means is as follows.
すなわち、超音波振動子アレイの厚さは薄く、しかも各
ギャップに柔軟性物質が充填されて高いフレキシビリテ
ィ−が得られるので、この超音波振動子アレイを背面負
荷材にあらかじめ加工した・曲面に接着する作業は容易
となる。また、超音波振動子アレイは上記のようにフレ
キシビリティが高いので、曲率が小さい場合でも、接着
後の応力が小さくなシ、剥離、曲率の変化等のおそれは
なくなる。In other words, the thickness of the ultrasonic transducer array is thin, and each gap is filled with a flexible material to provide high flexibility. The work of gluing becomes easier. Further, since the ultrasonic transducer array has high flexibility as described above, even if the curvature is small, there is no risk of low stress after adhesion, peeling, or change in curvature.
実施例 以下、本発明の実施例を添付図面に基づいて説明する。Example Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図（ａ）、 （ｂ）は本発明の一実施例における超
音波探触子を示し、第１図（ａ）は超音波振動子アレイ
の製造途中の概略側面図、第１図（ｂ）は製造完成状態
の要部の概略側面図である。1(a) and 1(b) show an ultrasonic probe in an embodiment of the present invention, FIG. 1(a) is a schematic side view of an ultrasonic transducer array in the middle of manufacturing, and FIG. b) is a schematic side view of the main part in the completed state of manufacture.
第１図（ａ）に示すようにまず、超音波振動子（実際に
は圧電素子の両側に電極が設けられているが、簡略化し
て示している）１の底面を粘着テープ２に接着する。次
にこの粘着テープ２をペースとして、超音波振動子１を
スライシングマシン等によシ短冊状に切断して分割する
。次に分割された超音波振動子１の上面にも粘着テープ
３を接着し、超音波振動子１の上面と底面をマスキング
する。As shown in FIG. 1(a), first, the bottom surface of the ultrasonic vibrator 1 (actually electrodes are provided on both sides of the piezoelectric element, but this is shown in a simplified manner) is adhered to the adhesive tape 2. . Next, using the adhesive tape 2 as a paste, the ultrasonic transducer 1 is cut into strips using a slicing machine or the like. Next, adhesive tape 3 is also adhered to the upper surface of the divided ultrasonic transducer 1 to mask the top and bottom surfaces of the ultrasonic transducer 1.
次に上記のように分割された超音波振動子１の各ギャッ
プ４に柔軟性を有する物質６、例えば柔軟性エポキシ樹
脂、ウレタン樹脂、シリコーン樹脂およびゴム系の材料
で伸び率が、１００％を越える物質を必要があれば、真
空減圧して充填し、硬化させ、または加硫を行う。その
後、粘着テープ２．３を剥離することにより、フレキシ
ビリティ−の非常に高い超音波振動子アレイ６を得るこ
とができる。この超音波振動子アレイ６を第１図（ｂ）
に示すように背面負荷材７にあらかじめ加工しである曲
面８に沿って湾曲させて接着し、超音波振動子アレイ６
をコンベックス型に形成する。このコンベックス型の超
音波振動子アレイ６の前面に音響整合層（図示省略）を
形成し、背面負荷材７を支持体９に接着し、超音波振動
子アレイ６の各電極に電気信号を印加する導体を接続す
る。Next, in each gap 4 of the ultrasonic transducer 1 divided as described above, a flexible material 6 such as a flexible epoxy resin, urethane resin, silicone resin, or rubber-based material is applied so that the elongation rate is 100%. If it is necessary to use a material exceeding the amount of material, it is filled under reduced pressure and cured or vulcanized. Thereafter, by peeling off the adhesive tape 2.3, an ultrasonic transducer array 6 with very high flexibility can be obtained. This ultrasonic transducer array 6 is shown in FIG. 1(b).
As shown in the figure, the ultrasonic transducer array 6 is bonded to the back load material 7 by being curved along the curved surface 8 that has been processed in advance.
is formed into a convex shape. An acoustic matching layer (not shown) is formed on the front surface of this convex type ultrasonic transducer array 6, a back load material 7 is adhered to the support 9, and an electric signal is applied to each electrode of the ultrasonic transducer array 6. Connect the conductors.
本実施例において、従来例のように背面負荷材７を曲げ
る必要がなく、コンベックス型の超音波振動子アレイ６
を形成するために湾曲させる厚さは、超音波振動子１の
厚さ分のみとなり、分割された超音波振動子１の各ギャ
ップ４には柔軟性を有する物質５を充填しているため、
非常にフレキシビリティ−が高く、湾曲させるための力
および湾曲させた後の応力も非常だ小さくなる。したが
って、背面負荷材７の材質て左右されることなく、小さ
な曲率のコンベックス型の超音波振動子を容易に製造す
ることができ、しかも、信頼性の向上を図ることができ
る。In this embodiment, unlike the conventional example, there is no need to bend the back load member 7, and the convex type ultrasonic transducer array 6
The thickness to be curved to form the ultrasonic transducer 1 is only the thickness of the ultrasonic transducer 1, and each gap 4 of the divided ultrasonic transducer 1 is filled with a flexible substance 5.
It has very high flexibility, and the force for bending and the stress after bending are also very small. Therefore, a convex-type ultrasonic transducer with a small curvature can be easily manufactured without being affected by the material of the backside load material 7, and reliability can be improved.
本実施例において、超音波振動子１の厚さを −２００
μｍ、アレイピッチを１５０μｍ以下の条件とし、ギャ
ップ４に柔軟性物質５として、シリコーンゴムを充填し
た場合、コンベックス型の超音波振動子アレイ６の曲率
半径は５ｍｍ以下に脱走することが可能である。In this example, the thickness of the ultrasonic transducer 1 is -200
μm, the array pitch is 150 μm or less, and when the gap 4 is filled with silicone rubber as the flexible material 5, the radius of curvature of the convex type ultrasonic transducer array 6 can be reduced to 5 mm or less. .
なお、上記実施例においては、音響整合層をコンベック
ス型超音波振動子アレイ６を形成した後に形成するよう
に説明したが、超音波振動子１を分割する前に超音波振
動子上に音響整合層を形成しておき、これら音響整合層
と超音波振動子を共に切断して上記と同様に製造した場
合においても、上記と同様の効果を得ることができる。In the above embodiment, the acoustic matching layer is formed after forming the convex type ultrasonic transducer array 6, but the acoustic matching layer is formed on the ultrasonic transducer before dividing the ultrasonic transducer 1. Even in the case where the acoustic matching layer and the ultrasonic transducer are manufactured in the same manner as described above by forming layers and cutting both the acoustic matching layer and the ultrasonic transducer, the same effect as described above can be obtained.
発明の効果
以上述べたように本発明によれば、超音波振動子をアレ
イ状に配して各ギャップに柔軟性物質を充填し、このフ
レキシビリティの高い超音波振動子アレイを背面負荷材
の曲面に沿うように湾曲させて接着しているので、曲率
半径の小さなコンベックス型の超音波振動子アレイを容
易に製造することができ、また、超音波振動子アレイの
応力が小さいので、背面負荷材に対する剥離、曲率の変
化等を防止することができ、信頼性を向上させることが
できる。更に背面負荷材は曲げる必要がないので、背面
負荷材の材料を自由に選択することができる。Effects of the Invention As described above, according to the present invention, ultrasonic transducers are arranged in an array, each gap is filled with a flexible material, and this highly flexible ultrasonic transducer array is used as a backing material. Since it is curved and bonded along a curved surface, it is possible to easily manufacture a convex-type ultrasonic transducer array with a small radius of curvature. Also, since the stress on the ultrasonic transducer array is small, there is no back load. Peeling from the material, changes in curvature, etc. can be prevented, and reliability can be improved. Furthermore, since the back loading material does not need to be bent, the material of the back loading material can be freely selected.
第１図（ａ）、 （ｈ）は本発明の一実施例における超
音波探触子を示し、第１図（ａ）は超音波振動子アレイ
の製造途中の概略側面図、第１図（ｂ）は製造完成状態
の要部の概略側面図、第２図（ａ）、 （ｂ）は従来の
超音波探触子を示し、第２図（ａ）は製造途中の超音波
振動子プレイと背面負荷材の概略側面図、第２図（ｂ）
は製造完成状態の要部の概略側面図である。
１・・・超音波振動子、２，３・・・粘着テープ、４・
・・ギャップ、５・・・柔軟性物質、６・・・超音波振
動子アレイ、７・・・背面負荷材、９・・・支持体。
代理人の氏名 弁理士 中 尾 敏 男ほか１多筒 １
図FIGS. 1(a) and 1(h) show an ultrasonic probe in an embodiment of the present invention, FIG. 1(a) is a schematic side view of an ultrasonic transducer array in the middle of manufacturing, and FIG. b) is a schematic side view of the main parts in the completed manufacturing state, Figures 2(a) and (b) show the conventional ultrasonic probe, and Figure 2(a) shows the ultrasonic transducer play during manufacture. and a schematic side view of the back load material, Fig. 2(b)
FIG. 2 is a schematic side view of the main parts in a fully manufactured state. 1... Ultrasonic vibrator, 2, 3... Adhesive tape, 4.
... Gap, 5... Flexible material, 6... Ultrasonic transducer array, 7... Back load material, 9... Support body. Name of agent: Patent attorney Satoshi Nakao et al. 1 Tatsutsu 1
figure
Claims (1)
イ状に配列され、かつ各ギャップに柔軟性物質が充填さ
れ、この超音波振動子アレイが湾曲されて背面負荷材の
曲面に接着されていることを特徴とする超音波探触子。Ultrasonic transducers that convert electrical signals into mechanical vibrations are arranged in an array, each gap is filled with a flexible material, and this ultrasonic transducer array is curved and bonded to the curved surface of the back load material. An ultrasonic probe characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62258870A JPH0199535A (en) | 1987-10-14 | 1987-10-14 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62258870A JPH0199535A (en) | 1987-10-14 | 1987-10-14 | Ultrasonic probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0199535A true JPH0199535A (en) | 1989-04-18 |
Family
ID=17326182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62258870A Pending JPH0199535A (en) | 1987-10-14 | 1987-10-14 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0199535A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005210710A (en) * | 2003-12-31 | 2005-08-04 | General Electric Co <Ge> | Curved micromachined ultrasonic transducer array and related manufacturing method |
| JP2009504057A (en) * | 2005-08-05 | 2009-01-29 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Bent two-dimensional array transducer |
| JP2011200332A (en) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | Two-dimensional-array ultrasonic probe and probe diagnostic apparatus |
| GB2479930A (en) * | 2010-04-29 | 2011-11-02 | Neorad As | Coupling an ultrasound probe to the skin |
| CN103536314A (en) * | 2012-07-12 | 2014-01-29 | 三星电子株式会社 | Transducer module, ultrasonic probe, and method of producing curved surface frame |
| KR102145768B1 (en) * | 2019-02-12 | 2020-08-19 | 문지환 | Flexible transducer manufacturing apparatus for measuring a biological signal and size and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121400A (en) * | 1981-01-20 | 1982-07-28 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
-
1987
- 1987-10-14 JP JP62258870A patent/JPH0199535A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121400A (en) * | 1981-01-20 | 1982-07-28 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005210710A (en) * | 2003-12-31 | 2005-08-04 | General Electric Co <Ge> | Curved micromachined ultrasonic transducer array and related manufacturing method |
| JP2009504057A (en) * | 2005-08-05 | 2009-01-29 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Bent two-dimensional array transducer |
| JP2011200332A (en) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | Two-dimensional-array ultrasonic probe and probe diagnostic apparatus |
| GB2479930A (en) * | 2010-04-29 | 2011-11-02 | Neorad As | Coupling an ultrasound probe to the skin |
| GB2479930B (en) * | 2010-04-29 | 2017-12-06 | Respinor As | Coupling an ultrasound probe to the skin |
| CN103536314A (en) * | 2012-07-12 | 2014-01-29 | 三星电子株式会社 | Transducer module, ultrasonic probe, and method of producing curved surface frame |
| EP2685255A3 (en) * | 2012-07-12 | 2014-08-13 | Samsung Electronics Co., Ltd | Transducer module including curved surface frame, ultrasonic probe including transducer module, and method of producing curved surface frame |
| CN103536314B (en) * | 2012-07-12 | 2017-06-30 | 三星电子株式会社 | The method of transducer module, ultrasonic probe and production curved surface framework |
| KR102145768B1 (en) * | 2019-02-12 | 2020-08-19 | 문지환 | Flexible transducer manufacturing apparatus for measuring a biological signal and size and manufacturing method thereof |
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