JPS6373939A - Production of ultrasonic probe - Google Patents
Production of ultrasonic probeInfo
- Publication number
- JPS6373939A JPS6373939A JP21834686A JP21834686A JPS6373939A JP S6373939 A JPS6373939 A JP S6373939A JP 21834686 A JP21834686 A JP 21834686A JP 21834686 A JP21834686 A JP 21834686A JP S6373939 A JPS6373939 A JP S6373939A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- flexible printed
- printed board
- metal foil
- sound wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000011888 foil Substances 0.000 claims description 21
- 239000006096 absorbing agent Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 3
- 239000012778 molding material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000002604 ultrasonography Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
所定のパターンを有するフレキシブルプリント板を圧電
素子の一方の面（背面）に接合したる後に音波吸収体を
形成し、圧電素子の反対側（前面）に金属箔を接合し、
更に金属箔及びフレキシブルプリント板を音波吸収体の
側面に固定するように圧電素子の上に整合層を形成した
る後、カッターでフレキシブルプリント板のパターンに
沿って圧電素子を所定数に分割して振動子を構成するよ
うにしたもので、高品質の製品を歩留まり良く製造出来
るようにした。[Detailed Description of the Invention] [Summary] After bonding a flexible printed board having a predetermined pattern to one side (back side) of a piezoelectric element, a sound wave absorber is formed, and a sound wave absorber is formed on the other side (front side) of the piezoelectric element. Join metal foil,
Furthermore, after forming a matching layer on the piezoelectric element so as to fix the metal foil and flexible printed board to the side surface of the sound wave absorber, the piezoelectric element is divided into a predetermined number of pieces using a cutter along the pattern of the flexible printed board. It is designed to form a vibrator, making it possible to manufacture high-quality products with a high yield.
本発明は超音波診断装置に係り、特に超音波探触子の製
造方法に関する。The present invention relates to an ultrasonic diagnostic apparatus, and particularly to a method for manufacturing an ultrasonic probe.
近来医療技術の進歩は目覚ましく、超音波診断装置も被
検者に苦痛や悪影容を与えずに手軽に確度の高い検査が
行えることから需要が高まっている。Medical technology has made remarkable progress in recent years, and demand for ultrasonic diagnostic equipment is increasing because it can easily perform highly accurate examinations without causing pain or adverse effects to patients.
又、超音波探触子は微細化される傾向にあり、機械的強
度の高い高品質のものを要望されている。Further, as ultrasonic probes tend to be miniaturized, there is a demand for high quality probes with high mechanical strength.
超音波診断装置は、超音波パルスをごく短時間だけ体内
に放射させ、超音波パルスが伝播する途中で次々に反射
する反射エコーを検出し、表示装置に表示させ、表示さ
れたパターンから組織内に存在する異常の有無、及びそ
の位置を診断するもので、超音波探触子を被検者に接触
させて使用する。Ultrasonic diagnostic equipment emits ultrasonic pulses into the body for a very short period of time, detects reflected echoes that are reflected one after another as the ultrasonic pulses propagate, and displays them on a display device. The ultrasound probe is used to diagnose the presence or absence of an abnormality in the body and its location, and is used by bringing an ultrasound probe into contact with the subject.
第２図の斜視図に示す如く、超音波探触子（以下探触子
と称す）は、音波吸収体１の上に数１０木乃至数百本の
棒状の振動子２を横方向に近接して配列したもので、各
振動子２の夫々には別々の導線３が接続されており、隣
り合う数本〜数十本の振動子２を同時に駆動して、それ
ら振動子群の前方に超音波ビームを形成し、図示省略し
た電子スイッチに依り同時使用する振動子群を順次切替
えて走査を行うようにしている。As shown in the perspective view of FIG. 2, an ultrasonic probe (hereinafter referred to as a probe) consists of several tens to hundreds of rod-shaped transducers 2 placed on a sound wave absorber 1 in the horizontal direction. A separate conducting wire 3 is connected to each vibrator 2, and several to dozens of adjacent vibrators 2 are simultaneously driven and a wire is placed in front of the vibrator group. An ultrasonic beam is formed, and scanning is performed by sequentially switching the groups of transducers used simultaneously using an electronic switch (not shown).
振動子群の前面には、例えば金属粉入りエポキシ樹脂で
作った１７４波長の厚さの所謂１７４波長板４が接着さ
れており、更にその前面には例えばシリコンゴム等の音
響レンズ５が接着されている。A so-called 174-wavelength plate 4 made of, for example, epoxy resin containing metal powder and having a thickness of 174 wavelengths is bonded to the front surface of the vibrator group, and an acoustic lens 5 made of, for example, silicone rubber is bonded to the front surface of the 174-wavelength plate 4. ing.
１７４波長板４は、超音波パルスを短くして距１離分解
能を向上させると共に、探触子の感度を高くするための
ものである。The 174 wavelength plate 4 is used to shorten the ultrasonic pulse to improve the distance resolution and to increase the sensitivity of the probe.
音響レンズ５は、超音波ビームを集束して断層面（走査
面）に直角方向の所謂横方向分解能を向上させる為に用
いられる。The acoustic lens 5 is used to focus the ultrasound beam and improve the so-called lateral resolution in the direction perpendicular to the tomographic plane (scanning plane).
又、音波吸収体１は振動子２の背面に放射する超音波を
吸収して減衰するもので、−ｍにはエポキシ樹脂が用い
られている。Further, the sound wave absorber 1 absorbs and attenuates the ultrasonic waves emitted to the back surface of the vibrator 2, and epoxy resin is used for -m.
以下に第３図の斜視図を参照して超音波探触子の製造方
法を説明する。A method of manufacturing an ultrasonic probe will be described below with reference to the perspective view of FIG.
先ず圧電素子６の一方の面（背面）に圧電素子を分割し
て形成する振動子のリード（導体）９ａを構成するパタ
ーンを設けたフレキシブルプリント板９を、半田付は或
いは導電ペーストで接合し、フレキシブルプリント板９
と共に圧電素子６の背面に音波吸収体１を形成する。First, a flexible printed board 9 provided with a pattern constituting a lead (conductor) 9a of a vibrator formed by dividing the piezoelectric element 6 is bonded to one side (back side) of the piezoelectric element 6 by soldering or with a conductive paste. , flexible printed board 9
At the same time, a sound wave absorber 1 is formed on the back surface of the piezoelectric element 6.
次に、圧電素子６のフレキシブルプリント板９が接合さ
れている反対側（前面）の所定位置（両側）に銀等の材
料から成る金属箔８を半田付は或いは導電ペーストで電
気的導通がとれるように接続する。 そして、更に金属
箔８を取付けた圧電素子６の上に１７４波長板４をエポ
キシ樹脂系の接着剤で接着する。Next, electrical continuity is established by soldering a metal foil 8 made of a material such as silver to a predetermined position (both sides) on the opposite side (front side) of the piezoelectric element 6 to which the flexible printed board 9 is bonded, or by using a conductive paste. Connect like this. Then, the 174 wavelength plate 4 is further bonded onto the piezoelectric element 6 to which the metal foil 8 is attached using an epoxy resin adhesive.
然る後、１７４波長板４及び金属箔８と共に圧電素子６
をカッター（５０μｍ程度の細い切溝で加工物をカット
することが出来る例えばグイレンズソウ： Ｄｉｃｅｉ
ｎｇ Ｓａｗ ）を使用して、フレキシブルプリント板
９のパターンに沿って所定数に分割して振動子２を形成
し探触子を完成する。After that, the piezoelectric element 6 is attached together with the 174 wavelength plate 4 and the metal foil 8.
A cutter (for example, a cutter that can cut the workpiece with a thin groove of about 50 μm: Dicei)
ng Saw) is used to divide the transducer into a predetermined number of pieces along the pattern of the flexible printed board 9 to form the transducer 2 and complete the probe.
斯かる製造方法に依って、振動子２と共に各振動子のり
−ド９ａを一度に形成することが出来る。By using such a manufacturing method, each vibrator board 9a can be formed together with the vibrator 2 at the same time.
尚、図示省略したが音響レンズは必要に応じて１７４波
長板４の上に接着する。Although not shown, the acoustic lens is bonded onto the 174-wavelength plate 4 if necessary.
以上説明したようにして探触子は作られるが、カッター
に依る圧電素子の分割の際に、金属箔が振動して第４図
の斜視図に示す如り１７４波長板が剥離し易いと言う問
題点があった。The probe is made as explained above, but when the piezoelectric element is divided by the cutter, the metal foil vibrates and the 174-wavelength plate tends to peel off, as shown in the perspective view of Figure 4. There was a problem.
第１図ｆａｔは本発明の超音波探触子の製造方法を説明
する斜視図である。FIG. 1 is a perspective view illustrating a method of manufacturing an ultrasound probe according to the present invention.
本発明に於いては、所定のパターンを存するフレキシブ
ルプリント板９を圧電素子６の一方の面（背面）に接合
し、圧電素子６の背面に音波吸収体１を形成し、圧電素
子６０反対側の所定位置（両側）に金ア箔８を接合し、
更に圧電素子６の上に金属箔８及びフレキシブルプリン
ト板９を音波吸収体１の両側面に口状に固定する整合層
７を成形したる後、カッターでフレキシブルプリント板
９のパターンに沿って整合層７及び金属箔８と共に圧電
素子６を所定数に分割し、振動子２を構成するようにし
たものであって、金属′４８及びフレキシブルプリント
板９には整合層７の成形材料が流入する複数の貫通孔１
０ａ 、１０ｂを設けるようにしたものである。In the present invention, a flexible printed board 9 having a predetermined pattern is bonded to one side (back side) of the piezoelectric element 6, a sound wave absorber 1 is formed on the back side of the piezoelectric element 6, and a A gold foil 8 is bonded to a predetermined position (both sides) of the
Furthermore, a matching layer 7 is formed on the piezoelectric element 6 to fix the metal foil 8 and the flexible printed board 9 in the shape of a mouth on both sides of the sound wave absorber 1, and then aligned along the pattern of the flexible printed board 9 using a cutter. The piezoelectric element 6 is divided into a predetermined number together with the layer 7 and the metal foil 8 to constitute the vibrator 2, and the molding material of the matching layer 7 flows into the metal 48 and the flexible printed board 9. Multiple through holes 1
0a and 10b are provided.
整合層で固定される為に、カッターに依る切断時にフレ
キシブルプリント板と、金属箔に振動の発生が抑制され
る。Since it is fixed by the matching layer, vibrations are suppressed in the flexible printed board and the metal foil when cutting with a cutter.
第１図（ａｌ及び（ｂｌは本発明の一実施例である。 FIG. 1 (al and (bl) are one embodiment of the present invention.
企図を通じて同一部分には同一符号を付して示した。Identical parts are designated by the same reference numerals throughout the design.
第１図（ａ）の斜視図に示す如く本発明に於いては、従
来技術同様に圧電素子６の一方の面（背面）に振動子２
のリード９ａを構成するパターンを有するフレキシブル
プリント板９を接合して、フレキシブルプリント板９と
共に圧電素子６の背面に音波吸収体１を形成し、圧電素
子６の反対側の所定位置（両側）に金属箔８を接続する
。As shown in the perspective view of FIG. 1(a), in the present invention, a vibrator 2 is attached to one surface (back surface) of the piezoelectric element 6 as in the prior art.
A flexible printed board 9 having a pattern constituting the lead 9a is bonded to form a sound wave absorber 1 on the back surface of the piezoelectric element 6 together with the flexible printed board 9, and at a predetermined position (both sides) on the opposite side of the piezoelectric element 6. Connect the metal foil 8.
そして更に、圧電素子６の上に金属箔８及びフレキシブ
ルプリント板９を音波吸収体１の両側面に口状に固定す
る形状に１７４波長板４に相当する整合層７を成形する
。Furthermore, a matching layer 7 corresponding to a 174-wavelength plate 4 is formed on the piezoelectric element 6 in a shape in which a metal foil 8 and a flexible printed board 9 are fixed in a mouth shape on both sides of the sound wave absorber 1.
整合層７の成形は、図示省略した型枠内に圧電素子６の
金属箔８を取付けた面が上向きになるように挿入し、例
えば粘液状の金属粉入りのエポキシ樹脂を型枠内に注入
し硬化させた後、整合層７の厚さく矢印Ｔ）が所定寸法
内に入るように研磨する。The matching layer 7 is formed by inserting the piezoelectric element 6 into a mold (not shown) with the surface on which the metal foil 8 is attached facing upward, and injecting, for example, epoxy resin containing slimy metal powder into the mold. After hardening, polishing is performed so that the thickness of the matching layer 7 (arrow T) falls within a predetermined dimension.
この時、樹脂が金属箔８の裏面や、フレキシブルプリン
ト板９の裏面に均一に注入されるように、同図（ｂ）に
示す如く金属箔８及びフレキシブルプリント板９には複
数個の貫通孔１０ａ及び１０ｂが設けである。At this time, a plurality of through holes are formed in the metal foil 8 and the flexible printed board 9 as shown in FIG. 10a and 10b are provided.
然る後、カッターでフレキシブルプリント板９のパター
ンに沿って整合層７及び金属箔８と共に圧電素子６を所
定数に分割し、振動子２を構成するようにしたものであ
る。Thereafter, the piezoelectric element 6 is divided into a predetermined number along with the matching layer 7 and the metal foil 8 along the pattern of the flexible printed board 9 using a cutter, thereby forming the vibrator 2.
斯くの如く、金属箔８及びフレキシブルプリント板９を
固定することで、カッターに依る切断時に金属箔８やフ
レキシブルプリント板９の振動を抑制して整合層７を剥
離するようなことが無くなる。By fixing the metal foil 8 and the flexible printed board 9 in this way, the vibrations of the metal foil 8 and the flexible printed board 9 are suppressed during cutting with a cutter, thereby eliminating the possibility of peeling off the matching layer 7.
尚、図示省略したが音響レンズは必要に応じて整合層７
の上に接着される。Although not shown, the acoustic lens may be provided with a matching layer 7 if necessary.
is glued on top.
以上説明したように、本発明の超音波探触子の製造方法
で超音波探触子を製造することに依り、高品質の製品が
歩留まり良く製造出来る等経済上及び産業上に多大の効
果を奏する。As explained above, by manufacturing an ultrasonic probe using the method of manufacturing an ultrasonic probe of the present invention, there are great economic and industrial effects such as the ability to manufacture high-quality products with a high yield. play.
第１図（ａ）及び（ｂｌは本発明の超音波探触子の製造
方法を説明する斜視図、
第２図は超音波探触子を示す斜視図、
第３図は従来の超音波探触子の製造方法を説明する斜視
図、
第４図はカットに依り１７４波長板が剥離した状態を示
す斜視図である。
図に於いて、
１は音波吸収体、 ２は振動子、
３は導体、 ４は１７４波長板、５は音響
レンズ、 ６は圧電素子、７は整合層、
８は金属箔、９はフレキシブルプリント板、
１０は貫通孔である。
（ｂ）
＄３ｇFigures 1 (a) and (bl) are perspective views illustrating the manufacturing method of the ultrasonic probe of the present invention, Figure 2 is a perspective view showing the ultrasonic probe, and Figure 3 is a conventional ultrasonic probe. Fig. 4 is a perspective view illustrating the method of manufacturing the tentacle, and Fig. 4 is a perspective view showing the state in which the 174-wavelength plate has been peeled off due to cutting. In the figure, 1 is a sound wave absorber, 2 is a vibrator, and 3 is a Conductor, 4 is a 174 wavelength plate, 5 is an acoustic lens, 6 is a piezoelectric element, 7 is a matching layer,
8 is a metal foil, 9 is a flexible printed board, and 10 is a through hole. (b) $3g
Claims (2)
設けて成る超音波探触子の製造方法であって、所定のパ
ターンを有するフレキシブルプリント板（９）を圧電素
子（６）の一方の面に接合し、前記圧電素子（６）の前
記フレキシブルプリント板（９）を設けた面に前記音波
吸収体（１）を形成し、前記圧電素子（６）の反対側の
面の所定位置に金属箔（８）を接合し、 更に圧電素子（６）の上に金属箔（８）及びフレキシブ
ルプリント板（９）を音波吸収体（１）の両側面に■状
に固定する整合層を成形したる後、カッターで前記フレ
キシブルプリント板（９）のパターンに沿って前記整合
層（７）及び前記金属箔（８）と共に前記圧電素子（６
）を所定数に分割し、振動子（２）を構成したことを特
徴とする超音波探触子の製造方法。(1) A method for manufacturing an ultrasonic probe in which a predetermined number of transducers (2) are provided on a sound wave absorber (1), in which a flexible printed board (9) having a predetermined pattern is used as a piezoelectric element. (6), the sound wave absorber (1) is formed on the surface of the piezoelectric element (6) on which the flexible printed board (9) is provided, and the sound wave absorber (1) is formed on the opposite side of the piezoelectric element (6). A metal foil (8) is bonded to a predetermined position on the surface of the piezoelectric element (6), and a metal foil (8) and a flexible printed board (9) are placed on both sides of the sound wave absorber (1) in a ■ shape. After forming the matching layer to be fixed, cut the piezoelectric element (6) together with the matching layer (7) and the metal foil (8) along the pattern of the flexible printed board (9) using a cutter.
) into a predetermined number of parts to form a transducer (2).
板（９）に前記整合層（７）の成形材料が流入する複数
の貫通孔（１０ａ、１０ｂ）を設けたことを特徴とする
特許請求の範囲第１項記載の超音波探触子の製造方法。(2) The metal foil (8) and the flexible printed board (9) are provided with a plurality of through holes (10a, 10b) into which the molding material of the matching layer (7) flows. A method for manufacturing an ultrasonic probe according to scope 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21834686A JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21834686A JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373939A true JPS6373939A (en) | 1988-04-04 |
| JPH0556737B2 JPH0556737B2 (en) | 1993-08-20 |
Family
ID=16718431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21834686A Granted JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373939A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009505468A (en) * | 2005-08-08 | 2009-02-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Broadband matrix transducer with polyethylene third matching layer |
| JP2011163798A (en) * | 2010-02-05 | 2011-08-25 | Ryoden Shonan Electronics Kk | Bolt inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62231629A (en) * | 1986-04-01 | 1987-10-12 | 松下電器産業株式会社 | Production of ultrasonic probe |
-
1986
- 1986-09-17 JP JP21834686A patent/JPS6373939A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62231629A (en) * | 1986-04-01 | 1987-10-12 | 松下電器産業株式会社 | Production of ultrasonic probe |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009505468A (en) * | 2005-08-08 | 2009-02-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Broadband matrix transducer with polyethylene third matching layer |
| JP2011163798A (en) * | 2010-02-05 | 2011-08-25 | Ryoden Shonan Electronics Kk | Bolt inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0556737B2 (en) | 1993-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100299277B1 (en) | Ultrasonic Converter Array and Manufacturing Method | |
| US6640634B2 (en) | Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus | |
| US5764596A (en) | Two-dimensional acoustic array and method for the manufacture thereof | |
| US20110237952A1 (en) | Two-dimensional-array ultrasonic probe and ultrasonic diagnostic apparatus | |
| US7288069B2 (en) | Ultrasonic probe and method of manufacturing the same | |
| JPH0549288B2 (en) | ||
| JP2000166923A (en) | Ultrasonic transducer and its manufacture | |
| JP3450430B2 (en) | Ultrasonic transducer | |
| JPH0723500A (en) | Two-dimension array ultrasonic wave probe | |
| JPS5920240B2 (en) | Ultrasonic probe and method for manufacturing the ultrasonic probe | |
| JPS6373939A (en) | Production of ultrasonic probe | |
| JP2615517B2 (en) | Ultrasonic probe manufacturing method | |
| JP2002247696A (en) | Ultrasound probe | |
| JPS58118739A (en) | Ultasonic probe and production thereof | |
| JP2002232995A (en) | Ultrasonic wave probe and its manufacturing method | |
| JP4071084B2 (en) | Manufacturing method of two-dimensional array ultrasonic probe | |
| JPS6268400A (en) | Manufacture of ultrasonic probe | |
| JPH07131896A (en) | Ultrasonic probe and its production | |
| JPS6373938A (en) | Production of ultrasonic probe | |
| JP2694962B2 (en) | Ultrasonic probe and method of manufacturing the same | |
| JP2601503B2 (en) | Array type ultrasonic probe | |
| JP4071083B2 (en) | Manufacturing method of two-dimensional array ultrasonic probe | |
| JPS6058550A (en) | Ultrasonic probe and its preparation | |
| JPS5830361Y2 (en) | Ultrasonic transducer array | |
| JPH0712238B2 (en) | Ultrasonic probe and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |