JP4071084B2 - Manufacturing method of two-dimensional array ultrasonic probe - Google Patents

Manufacturing method of two-dimensional array ultrasonic probe Download PDF

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Publication number
JP4071084B2
JP4071084B2 JP2002306011A JP2002306011A JP4071084B2 JP 4071084 B2 JP4071084 B2 JP 4071084B2 JP 2002306011 A JP2002306011 A JP 2002306011A JP 2002306011 A JP2002306011 A JP 2002306011A JP 4071084 B2 JP4071084 B2 JP 4071084B2
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Prior art keywords
piezoelectric vibrator
lower electrode
electrode
piezoelectric
plate
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JP2002306011A
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JP2004140762A (en
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則廣 西尾
茂正 大矢
俊彦 宮下
崇 伊沢
徹 鋤柄
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Ueda Japan Radio Co Ltd
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Ueda Japan Radio Co Ltd
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Description

【0001】
本発明は、二次元アレイ超音波探触子の製造方法に関する。
【発明の属する技術分野】
【0002】
【従来の技術】
医療用超音波診断装置に用いる超音波探触子として、上下に電極を備えた板状圧電体からなる圧電振動子を二次元方向に分割して、複数個の圧電振動子片とした構成の二次元アレイ超音波探触子が知られている。この二次元アレイ超音波探触子は、圧電振動子を一次元方向に分割した構成の一次元アレイ超音波探触子と比べて、立体的な超音波画像を容易に得ることができる、あるいは超音波ビームのフォーカスを電子的に調整できるなどの特徴がある。なお、超音波ビームのフォーカスを電子的に調整することを目的とする二次元アレイ超音波探触子を、特に1.5次元(1.5D)アレイ超音波探触子ということもあるが、本明細書では、圧電振動子を二次元方向に分割した構成のアレイ超音波探触子は全て、二次元アレイ超音波探触子という。
【0003】
二次元アレイ超音波探触子では、各圧電振動子片の上下電極を電気的に外部に接続しなければならない。この電極を外部に接続する方法としては、次に述べるような方法が知られている。
【0004】
特許文献1には、二次元状に配列された電極孔(スルーホール)と、その電極孔に接続する導通路を一方の表面に有する配線基板を用いて、圧電振動子片の下側電極を外部に接続することが開示されている。この特許文献1では、配線基板の導通路側の反対側の面に圧電振動子の下側電極を固着し、次いで圧電振動子の上側電極から配線基板に達するまで切り込みを入れて、圧電振動子を複数個の圧電振動子片に分割した後、圧電振動子片の下側電極を電極孔により導通路側の面に導出して圧電振動子片の下側電極を外部に接続している。なお、一方の圧電振動子片の上側電極は、その上に形成された共通電極を介して外部に接続できるようにしている。
【0005】
特許文献2の図1には、スルーホールが設けられているリジッド部と、引き出し配線パータンを有するフレキシブル部とからなる配線基板を用いて、圧電振動子片の下側電極(第1の電極)を外部に接続した二次元アレイ超音波探触子が開示されている。この図に開示された二次元アレイ超音波探触子でも、圧電振動子片の上側電極(第2の電極)の上に共通電極が形成されている。
【0006】
上記特許文献2の図4及び図5にはさらに、圧電振動子片と配線基板との間に、柱状導電体を配列した異方性導電層を設けて、圧電振動子片の下側電極と配線基板を接続した二次元アレイ超音波探触子が開示されている。これらの図に開示された二次元アレイ超音波探触子では、圧電振動子片の上側電極は共通電極となっているように見えるが、明細書の記載を考慮すると、共通電極は圧電振動子片の上側電極の上に形成されていると考えられる。
【0007】
上記特許文献2の図7には、圧電振動子片の下側電極を、その圧電振動子片の配列数が少ない方向の両端に設けられた引き出し用パッドを介して外部に接続した二次元アレイ超音波探触子が開示されている。この図に開示された二次元アレイ超音波探触子でも、圧電振動子片の上側電極は共通電極となっているように見えるが、明細書の記載を考慮すると、共通電極は圧電振動子片の上側電極の上に形成されていると考えられる。
【0008】
【特許文献1】
特許第2948610号公報
【特許文献2】
特許第3288815号公報
【0009】
【発明が解決しようとする課題】
二次元アレイ超音波探触子では、各圧電振動子片の超音波送受信特性がそれぞれ互いに高度な均質性を示すことが望ましい。しかしながら、これまでに知られている二次元アレイ超音波探触子のように、圧電振動子片の上側電極の上に共通電極を形成すると、その共通電極の厚さが不均一になりやすく、超音波送受信特性の均質性の低下をもたらすことがある。従って、本発明の課題は、各圧電振動子片の超音波送受信特性が高度な均質性を有する二次元アレイ超音波探触子の製造方法を提供することにある。
【0010】
【課題を解決するための手段】
本発明は、下記の工程からなる二次元アレイ超音波探触子の製造方法にある。
(1)上下に電極を備えた板状圧電体からなる圧電振動子の上側電極の表面に音響整合層を形成する工程。
(2)圧電振動子の下側電極の表面に対して、その二次元方向に、下側電極の表面から上側電極に向かって、板状圧電体の厚さの80〜95%の深さにまで延びる切り込みを入れて、下側電極と板状圧電体を複数個の細分化された下側電極片と板状圧電振動子片に分割する工程。
(3)別に用意した、圧電振動子の下側電極片に対応する電極端子と、該電極端子に接続する電気配線とを有する配線基板の電極端子を、圧電振動子の下側電極片のそれぞれにリード線を介して電気的に接続する工程。
(4)圧電振動子の下側電極片の表面に、硬化性樹脂材料を硬化させることにより吸音層を形成する工程。
(5)音響整合層の圧電振動子側とは反対側の表面から圧電振動子の手前まで、圧電振動子に形成されている切り込みに対応する位置にて切り込みを入れ、その切り込みに樹脂を充填する工程。
【0011】
本発明の二次元アレイ超音波探触子の製造方法の好ましい態様を下記に示す。
(1)圧電振動子の切り込みに樹脂材料を充填する工程を含む。
【0012】
本発明はまた、上下に電極を備えた板状圧電体からなり、下側電極の表面対して、その二次元方向に形成された、下側電極からの表面から上側電極に向かって、板状圧電体の厚さの80〜95%の深さにまで延びる切り込みにより、下側電極と板状圧電体が複数個の細分化された下側電極片と板状圧電体片とに分割されている圧電振動子、圧電振動子の下側電極片のそれぞれにリード線を介して電気的に接続する電極端子と該電極端子のそれぞれに接続する電気配線とを有する配線基板、圧電振動子の下側電極片の表面に形成された吸音層、そして圧電振動子の上側電極の表面上に形成された音響整合層からなる二次元アレイ超音波探触子にもある。
【0013】
【発明の実施の形態】
本発明の二次元アレイ超音波探触子の製造方法について、添付図面を参照しながら説明する。
【0014】
先ず初めに、図1に示すように、上下に電極1、2を備えた板状圧電体3からなる圧電振動子4の上側電極1の表面に、第一音響整合層5と第二音響整合層6とからなる音響整合層7を形成する。図1に示す例では、圧電振動子4の上側電極1を外部に取り出すためのスペースを確保するために、音響整合層7のサイズが、圧電振動子4のサイズよりも大きくなっているが、音響整合層7のサイズには特に制限はなく、圧電振動子4のサイズと同一であってもよい。
【0015】
本発明において、圧電振動子4及び音響整合層7の材料には特に制限はなく、通常の超音波探触子に用いられている各種の材料を用いることができる。圧電振動子4の上下の電極1、2の材料の例としては、金、及び銀などの金属を挙げることができる。板状圧電体3の材料の例としては、チタン酸ジルコン酸鉛(PZT)などの圧電セラミックスを挙げることができる。音響整合層7の材料の例としては、エポキシ樹脂、及びウレタン樹脂などの樹脂材料を挙げることができる。なお、音響整合層7は、必ずしも二層である必要はなく、一層であってもよいし、三層以上であってもよい。
【0016】
音響整合層7の形成方法としては、上側電極1の上に未硬化の硬化性樹脂材料を流し込んだ後、硬化させる方法、あるいはシート状に形成した樹脂材料シートをあらかじめ用意して、これを上側電極1の上に接着剤(例:エポキシ樹脂系接着剤)にて貼り付ける方法などの公知の方法を採用することができる。
【0017】
次に、図2(a)に示すように、圧電振動子4の上下を反対にし、圧電振動子4を、超音波を送受信させるための音響整合層が形成されている部分(超音波送受信部分)4aと、上側電極を外部に接続し易くするスペースを確保するための音響整合層が形成されていない部分(上側電極接続部分)4bとに分けるために、下側電極2の表面から上側電極1に向かって、音響整合層7のサイズに対応する切り込み8aを入れる。なお、切り込み8aを入れる変わりに、上側電極接続部分4bの下側電極を削り取ってもよい。
【0018】
続いて、図2(b)に示すように、圧電振動子4の下側電極2の表面に対して、その二次元方向(図2(b)においてX方向とY方向)に、下側電極2の表面から上側電極1に向かって切り込み8bを入れて、下側電極2と板状圧電体3を複数個の細分化された下側電極片2aと板状圧電体片3aに分割する。すなわち、切り込み8bを入れて、圧電振動子4の超音波送受信部分4aを複数個の圧電振動子片4a’に、上側電極接続部分4bを複数個の上側電極接続部片4b’に分割する。なお、図2(b)においては、超音波送受信部分4aは、X方向とY方向のそれぞれに5個の圧電振動子片4a’に分割されているが、圧電振動子片への分割数には特に制限はない。
【0019】
圧電振動子4に入れる切り込み8a、8bは、ダイシングソーなどの公知の切断装置を用いて形成することができる。切り込み8aを形成する際には、その深さが圧電振動子4の板状圧電体3の厚さの95%を超えないように設定することが好ましい。板状圧電体の厚さを95%を超えるように設定すると、誤って上側電極1まで切断することがある。切り込み8bを形成する際には、切り込み8aと同様に、その深さが圧電振動子4の板状圧電体3の厚さの95%以下で、かつ板状圧電体3の厚さの80%以上となるように設定する。切り込み8bの深さが板状圧電体の厚さの80%未満となると、圧電振動子片同士のクロストークが起こり易くなる。
【0020】
次に、図3に示すように、圧電振動子片同士のクロストークをさらに低減するために、切り込み8a、8bに樹脂9を充填する。樹脂9としては、エポキシ樹脂、ウレタン樹脂、及びシリコーン樹脂を用いることができる。
【0021】
次に、図4に示すように、別に用意した、圧電振動子4の下側電極片2aに対応する電極端子10と、その電極端子10に接続する電気配線11とを有する配線基板12の電極端子10を、圧電振動子4の下側電極片2aのそれぞれにリード線13を介して電気的に接続する。
【0022】
リード線13の材料には、アルミニウムもしくは金を用いることができる。特に、金が好ましい。リード線13の形成方法としては、ワイヤボンディング法を用いることができる。
【0023】
配線基板12には、フレキシブルプリント配線基板などの通常の超音波探触子に用いられる配線基板と同じものを用いることができる。
【0024】
圧電振動子の下側電極片2aと配線基板12との接続パターンは、二次元アレイ超音波探触子の使用目的に応じて適宜設置することができる。以下、添付図面の図5〜図7を用いて、圧電振動子の下側電極片と配線基板との接続パターンについて説明する。
【0025】
図5は、圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を圧電振動子を下側電極側から見た一例の平面図である。図5において、配線基板は、二個の電極端子10a、10bを有する電極基板12aと、三個の電極端子10c、10d、10eを有する配線基板12bとからなる。圧電振動子4の5個の下側電極片のうち、下側電極片2a1はリード線13aにより電極端子10aに接続し、下側電極片2a2はリード線13bにより電極端子10bに接続し、下側電極片2a3はリード線13eにより電極端子10e接続し、下側電極片2a5はリード線13dにより電極端子10dに接続している。この接続パターンを有する二次元アレイ超音波探触子では、各下側電極2a1、2a2、2a3、2a4、2a5にそれぞれ独立して電気エネルギーを供給することができる。従って、この接続パターンは、主に立体的な超音波画像を得ることを目的とする二次元アレイ超音波探触子に用いられる。
【0026】
図6は、圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を圧電振動子を下側電極側から見た別の一例の平面図である。図6において、配線基板は、二個の電極端子10a、10bを有する電極基板12aと、同じく二個の電極端子10c、10dを有する配線基板12bとからなる。圧電振動子4の5個の下側電極片のうち、下側電極片2a1はリード線13aにより電極端子10aに接続し、下側電極片2a2はリード線13bにより電極端子10bに接続し、下側電極片2a3はリード線13cにより電極端子10c接続し、下側電極片2a5はリード線13dにより下側電極片2a2に接続してリード線13bにより電極端子10bに接続し、下側電極片2a5はリード線13eにより電極端子10eに接続している。この接続パターンを有する二次元アレイ超音波探触子では、下側電極片2a2と下側電極片2a4とに同時に電気エネルギーを供給することができる。従って、この接続パターンは、主に超音波ビームのフォーカスを電子的に調製することを目的とする二次元アレイ超音波探触子に用いられる。
【0027】
図7は、圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を圧電振動子を下側電極側から見たさらに別の一例の平面図である。図7において、配線基板は、二個の電極端子10a、10bを有する電極基板12aと、一個の電極端子10cを有する配線基板12bとからなる。圧電振動子4の5個の下側電極片のうち、下側電極片2a1はリード線13aにより電極端子10aに接続し、下側電極片2a2はリード線13bにより電極端子10bに接続し、下側電極片2a3はリード線13cにより電極端子10c接続し、下側電極片2a4はリード線13dにより電極端子10dに接続して、下側電極片2a2とともにリード線13bにより電極端子10bに接続し、下側電極片2a5はリード線13eより下側電極片2a2と接続してリード線13bにより電極端子10bに接続している。このような接続パターンを有する二次元アレイ超音波探触子は、特に超音波ビームのフォーカスを電子的に調製することを目的とする場合に有利に用いられる。この接続パターンを有する二次元アレイ超音波探触子では、下側電極片2a2と下側電極片2a4、及び下側電極片2a1と下側電極片2a5に同時に電気エネルギーを供給することができる。従って、この接続パターンは、主に超音波ビームのフォーカスを電子的に調製することを目的とする二次元アレイ超音波探触子に用いられる。
【0028】
上記のように、圧電振動子の下側電極片に配線基板の電極端子を接続したら、図8に示すように、圧電振動子の下側電極片の表面に、未硬化の硬化性樹脂材料を硬化させることにより吸音層14を形成し、次いで、圧電振動子4の上下を元に戻し、音響整合層7の圧電振動子4側とは反対側の表面から圧電振動子の手前まで、圧電振動子に形成されている切り込み8bに対応する位置にて切り込み15を入れ、その切り込み15に樹脂16を充填する。
【0029】
吸音層形成用の硬化性樹脂としては、エポキシ樹脂を用いることができる。
【0030】
音響整合層7の切り込み15は、前記圧電振動子の切り込み8bと同様に、音響整合層7の厚さの80〜95%の深さとすることが好ましい。
【0031】
上記のようにして製造された二次元アレイ超音波探触子の一例の切り欠き斜視図を図9に示す。図9において、二次元アレイ超音波探触子は、上下に電極1、2を備えた板状圧電体3からなり、下側電極2の表面の対して、その二次元方向に形成された、下側電極2からの表面から上側電極1に向かって、板状圧電体3の厚さの80〜95%の深さにまで延びる切り込み8a、8bにより、下側電極2と板状圧電体3が複数個の細分化された下側電極片2aと板状圧電体片3aとに分割されている(すなわち、圧電振動子4が、複数個の圧電振動子片4a’と上側電極接続部片4b’に分割されている)圧電振動子4、圧電振動子4の下側電極片2aのそれぞれにリード線13を介して電気的に接続する電極端子10と該電極端子のそれぞれに接続する電気配線11とを有する配線基板12、圧電振動子の下側電極片2aの表面に形成された吸音層14、そして圧電振動子の上側電極1の表面上に形成された第一音響整合層5と第二音響整合層6とからなる音響整合層7から構成されている。
【0032】
切り込み8a、8bには、圧電振動子片同士のクロストークを低減するために、樹脂9が充填されている。さらに、音響整合層7には、切り込み15が形成され、その切り込み15にも樹脂16が充填されている。
【0033】
【発明の効果】
本発明の二次元アレイ超音波探触子の製造方法では、圧電振動子の上側電極を切断しないので、圧電振動子片の上側電極に共通電極を形成する必要がない。従って、本発明の方法により製造された二次元アレイ超音波探触子は、各圧電振動子片の超音波送受信特性が高度な均質性を有する。また、本発明の製造方法では、従来の製造方法では必要であった共通電極を形成する工程を省略できるので、二次元アレイ超音波探触子の生産性も高くなる。
【図面の簡単な説明】
【図1】本発明の二次元アレイ超音波探触子の製造方法に従い、上側電極の表面に音響整合層を形成した圧電振動子の一例の断面図である。
【図2】本発明の二次元アレイ超音波探触子の製造方法に従い、図1の圧電振動子に切り込みを入れた状態を示す圧電振動子の斜視図である。
【図3】本発明の二次元アレイ超音波探触子の製造方法に従い、図2の圧電振動子の切り込みに樹脂を充填した状態を示す圧電振動子の断面図である。
【図4】本発明の二次元アレイ超音波探触子の製造方法に従い、図3の圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を示す圧電振動子の断面図である。
【図5】本発明の二次元アレイ超音波探触子の製造方法に従い、圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を圧電振動子を下側電極側から見た一例の平面図である。
【図6】本発明の二次元アレイ超音波探触子の製造方法に従い、圧電振動子の下側電極片と配線基板とをリード線にて接続した状態を圧電振動子を下側電極側から見た別の一例の平面図である。
【図7】本発明の二次元アレイ超音波探触子の製造方法に従い、配線基板と圧電振動子の下側電極片とをリード線にて接続した状態を圧電振動子を下側電極側から見たさらに別の一例の平面図である。
【図8】本発明の二次元アレイ超音波探触子の製造方法に従い、図4の圧電振動子の下側電極片の表面に吸音層を形成し、音響整合層に切り込みを入れ、その切り込みを樹脂を充填した状態を示す圧電振動子の断面図である。
【図9】本発明の二次元アレイ超音波探触子の製造方法に従って製造された二次元アレイ超音波探触子の一例の切り欠き斜視図である。
【符号の説明】
1 上側電極
2 下側電極
2a、2a1、2a2、2a3、2a4、2a5 下側電極片
3 板状圧電体
3a 板状圧電体片
4 圧電振動子
4a 超音波送受信部分
4a’ 圧電振動子片
4b 上側電極接続部分
4b’ 上側電極接続部片
5 第一音響整合層
6 第二音響整合層
7 響整合層
8a、8b 切り込み
9 樹脂
10、10a、10b、10c、10d、10e 電極端子
11 電気配線
12 配線基板
13、13a、13b、13c、13d、13e リード線
14 吸音層
15 切り込み
16 樹脂
[0001]
The present invention relates to a method for manufacturing a two-dimensional array ultrasonic probe.
BACKGROUND OF THE INVENTION
[0002]
[Prior art]
As an ultrasonic probe used in a medical ultrasonic diagnostic apparatus, a piezoelectric vibrator composed of a plate-like piezoelectric body having electrodes on the upper and lower sides is divided into two-dimensional directions to form a plurality of piezoelectric vibrator pieces. Two-dimensional array ultrasound probes are known. This two-dimensional array ultrasonic probe can easily obtain a three-dimensional ultrasonic image as compared with a one-dimensional array ultrasonic probe configured by dividing a piezoelectric vibrator in a one-dimensional direction, or There is a feature that the focus of the ultrasonic beam can be adjusted electronically. Note that a two-dimensional array ultrasonic probe for the purpose of electronically adjusting the focus of the ultrasonic beam may be referred to as a 1.5-dimensional (1.5D) array ultrasonic probe. In this specification, all array ultrasonic probes having a structure in which a piezoelectric vibrator is divided in a two-dimensional direction are all referred to as a two-dimensional array ultrasonic probe.
[0003]
In the two-dimensional array ultrasonic probe, the upper and lower electrodes of each piezoelectric vibrator piece must be electrically connected to the outside. As a method of connecting this electrode to the outside, the following method is known.
[0004]
In Patent Document 1, a lower electrode of a piezoelectric vibrator piece is formed by using a wiring board having a conductive path connected to an electrode hole (through hole) arranged in a two-dimensional shape on one surface. An external connection is disclosed. In this patent document 1, the lower electrode of the piezoelectric vibrator is fixed to the surface opposite to the conduction path side of the wiring board, and then a cut is made from the upper electrode of the piezoelectric vibrator until reaching the wiring board. After being divided into a plurality of piezoelectric vibrator pieces, the lower electrode of the piezoelectric vibrator piece is led out to the surface on the conduction path side through an electrode hole, and the lower electrode of the piezoelectric vibrator piece is connected to the outside. Note that the upper electrode of one piezoelectric vibrator piece can be connected to the outside through a common electrode formed thereon.
[0005]
FIG. 1 of Patent Document 2 shows a lower electrode (first electrode) of a piezoelectric vibrator piece using a wiring board including a rigid part provided with a through hole and a flexible part having a lead wiring pattern. A two-dimensional array ultrasonic probe in which is connected to the outside is disclosed. In the two-dimensional array ultrasonic probe disclosed in this figure, a common electrode is formed on the upper electrode (second electrode) of the piezoelectric vibrator piece.
[0006]
4 and 5 of Patent Document 2 further include an anisotropic conductive layer in which columnar conductors are arranged between the piezoelectric vibrator piece and the wiring board, and a lower electrode of the piezoelectric vibrator piece and A two-dimensional array ultrasonic probe connected to a wiring board is disclosed. In the two-dimensional array ultrasonic probe disclosed in these drawings, the upper electrode of the piezoelectric vibrator piece seems to be a common electrode. However, in consideration of the description in the specification, the common electrode is a piezoelectric vibrator. It is thought that it is formed on the upper electrode of the piece.
[0007]
FIG. 7 of Patent Document 2 shows a two-dimensional array in which the lower electrodes of the piezoelectric vibrator pieces are connected to the outside via lead-out pads provided at both ends in the direction in which the number of piezoelectric vibrator pieces is arranged. An ultrasound probe is disclosed. Even in the two-dimensional array ultrasonic probe disclosed in this figure, the upper electrode of the piezoelectric vibrator piece seems to be a common electrode. However, in consideration of the description, the common electrode is a piezoelectric vibrator piece. It is thought that it is formed on the upper electrode.
[0008]
[Patent Document 1]
Japanese Patent No. 2948610 [Patent Document 2]
Japanese Patent No. 3288815 [0009]
[Problems to be solved by the invention]
In the two-dimensional array ultrasonic probe, it is desirable that the ultrasonic transmission / reception characteristics of the piezoelectric vibrator pieces exhibit a high degree of homogeneity. However, when the common electrode is formed on the upper electrode of the piezoelectric vibrator piece like the two-dimensional array ultrasonic probe known so far, the thickness of the common electrode tends to be non-uniform, The uniformity of ultrasonic transmission / reception characteristics may be reduced. Accordingly, an object of the present invention is to provide a method for manufacturing a two-dimensional array ultrasonic probe in which ultrasonic transmission / reception characteristics of each piezoelectric vibrator piece have high homogeneity.
[0010]
[Means for Solving the Problems]
This invention exists in the manufacturing method of the two-dimensional array ultrasonic probe which consists of the following processes.
(1) A step of forming an acoustic matching layer on the surface of the upper electrode of the piezoelectric vibrator made of a plate-like piezoelectric body having electrodes on the upper and lower sides.
(2) With respect to the surface of the lower electrode of the piezoelectric vibrator, in a two-dimensional direction, from the surface of the lower electrode toward the upper electrode, the depth is 80 to 95% of the thickness of the plate-like piezoelectric body. A step of dividing the lower electrode and the plate-like piezoelectric body into a plurality of subdivided lower electrode pieces and plate-like piezoelectric vibrator pieces.
(3) Separately prepared electrode terminals of a wiring board having an electrode terminal corresponding to the lower electrode piece of the piezoelectric vibrator and an electric wiring connected to the electrode terminal are respectively connected to the lower electrode piece of the piezoelectric vibrator. Electrically connecting to the lead wire.
(4) A step of forming a sound absorbing layer by curing a curable resin material on the surface of the lower electrode piece of the piezoelectric vibrator.
(5) From the surface of the acoustic matching layer opposite to the piezoelectric vibrator side to the front of the piezoelectric vibrator, a cut is made at a position corresponding to the cut formed in the piezoelectric vibrator, and the cut is filled with resin. Process.
[0011]
A preferred embodiment of the method for producing the two-dimensional array ultrasonic probe of the present invention is shown below.
(1) A step of filling a resin material into the cut of the piezoelectric vibrator is included.
[0012]
The present invention also relates to a plate-like piezoelectric element having electrodes on top and bottom, for the surface of the lower electrode, formed on the two-dimensional directions, toward the upper electrode from the surface of the lower electrode, the plate The lower electrode and the plate-like piezoelectric body are divided into a plurality of subdivided lower electrode pieces and plate-like piezoelectric pieces by a cut extending to a depth of 80 to 95% of the thickness of the piezoelectric member. A piezoelectric substrate, a wiring board having an electrode terminal electrically connected to each of the lower electrode pieces of the piezoelectric vibrator via lead wires, and an electric wiring connected to each of the electrode terminals, There is also a two-dimensional array ultrasonic probe including a sound absorbing layer formed on the surface of the lower electrode piece and an acoustic matching layer formed on the surface of the upper electrode of the piezoelectric vibrator.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
A method for manufacturing a two-dimensional array ultrasonic probe of the present invention will be described with reference to the accompanying drawings.
[0014]
First, as shown in FIG. 1, the first acoustic matching layer 5 and the second acoustic matching are formed on the surface of the upper electrode 1 of the piezoelectric vibrator 4 composed of the plate-like piezoelectric body 3 having the electrodes 1 and 2 on the upper and lower sides. An acoustic matching layer 7 composed of the layer 6 is formed. In the example shown in FIG. 1, the size of the acoustic matching layer 7 is larger than the size of the piezoelectric vibrator 4 in order to secure a space for taking out the upper electrode 1 of the piezoelectric vibrator 4 to the outside. The size of the acoustic matching layer 7 is not particularly limited and may be the same as the size of the piezoelectric vibrator 4.
[0015]
In the present invention, the material of the piezoelectric vibrator 4 and the acoustic matching layer 7 is not particularly limited, and various materials used for ordinary ultrasonic probes can be used. Examples of the material of the upper and lower electrodes 1 and 2 of the piezoelectric vibrator 4 include metals such as gold and silver. Examples of the material of the plate-like piezoelectric body 3 include piezoelectric ceramics such as lead zirconate titanate (PZT). Examples of the material of the acoustic matching layer 7 include resin materials such as epoxy resin and urethane resin. The acoustic matching layer 7 does not necessarily have to be two layers, and may be a single layer or three or more layers.
[0016]
As a method for forming the acoustic matching layer 7, a method of pouring an uncured curable resin material on the upper electrode 1 and then curing it, or preparing a resin material sheet formed in a sheet shape in advance is used. A known method such as a method of adhering to the electrode 1 with an adhesive (eg, an epoxy resin adhesive) can be employed.
[0017]
Next, as shown in FIG. 2 (a), the piezoelectric vibrator 4 is turned upside down, and the piezoelectric vibrator 4 is formed with an acoustic matching layer for transmitting / receiving ultrasonic waves (ultrasonic transmission / reception part). ) In order to divide into 4a and the part (upper electrode connection part) 4b in which the acoustic matching layer for ensuring the space which makes it easy to connect an upper electrode outside is not formed (upper electrode connection part) 4b, it is an upper electrode from the surface of the lower electrode 2 A cut 8 a corresponding to the size of the acoustic matching layer 7 is made toward 1. Instead of making the cut 8a, the lower electrode of the upper electrode connection portion 4b may be scraped off.
[0018]
Subsequently, as shown in FIG. 2B, the lower electrode in the two-dimensional direction (X direction and Y direction in FIG. 2B) with respect to the surface of the lower electrode 2 of the piezoelectric vibrator 4. A notch 8b is made from the surface of 2 toward the upper electrode 1 to divide the lower electrode 2 and the plate-like piezoelectric body 3 into a plurality of subdivided lower electrode pieces 2a and plate-like piezoelectric piece 3a. That is, the notch 8b is inserted to divide the ultrasonic wave transmitting / receiving portion 4a of the piezoelectric vibrator 4 into a plurality of piezoelectric vibrator pieces 4a ′ and the upper electrode connection portion 4b into a plurality of upper electrode connection piece 4b ′. In FIG. 2B, the ultrasonic transmission / reception portion 4a is divided into five piezoelectric vibrator pieces 4a ′ in each of the X direction and the Y direction. There are no particular restrictions.
[0019]
The cuts 8a and 8b to be inserted into the piezoelectric vibrator 4 can be formed using a known cutting device such as a dicing saw. When forming the notch 8a, it is preferable to set the depth so that it does not exceed 95% of the thickness of the plate-like piezoelectric body 3 of the piezoelectric vibrator 4. If the thickness of the plate-like piezoelectric body is set to exceed 95%, the upper electrode 1 may be cut by mistake. When the cut 8b is formed, the depth is 95% or less of the thickness of the plate-like piezoelectric body 3 of the piezoelectric vibrator 4 and 80% of the thickness of the plate-like piezoelectric body 3 as in the case of the cut 8a. Set as above. When the depth of the cut 8b is less than 80% of the thickness of the plate-like piezoelectric body, crosstalk between the piezoelectric vibrator pieces tends to occur.
[0020]
Next, as shown in FIG. 3, in order to further reduce crosstalk between the piezoelectric vibrator pieces, the notches 8 a and 8 b are filled with a resin 9. As the resin 9, an epoxy resin, a urethane resin, and a silicone resin can be used.
[0021]
Next, as shown in FIG. 4, an electrode of a wiring board 12 that has a separately prepared electrode terminal 10 corresponding to the lower electrode piece 2 a of the piezoelectric vibrator 4 and an electric wiring 11 connected to the electrode terminal 10. The terminal 10 is electrically connected to each of the lower electrode pieces 2 a of the piezoelectric vibrator 4 via lead wires 13.
[0022]
Aluminum or gold can be used as the material of the lead wire 13. In particular, gold is preferable. As a method of forming the lead wire 13, a wire bonding method can be used.
[0023]
As the wiring board 12, the same wiring board as that used in a normal ultrasonic probe such as a flexible printed wiring board can be used.
[0024]
The connection pattern between the lower electrode piece 2a of the piezoelectric vibrator and the wiring board 12 can be appropriately set according to the purpose of use of the two-dimensional array ultrasonic probe. Hereinafter, the connection pattern between the lower electrode piece of the piezoelectric vibrator and the wiring board will be described with reference to FIGS.
[0025]
FIG. 5 is a plan view of an example in which the piezoelectric vibrator is viewed from the lower electrode side in a state in which the lower electrode piece of the piezoelectric vibrator and the wiring board are connected by a lead wire. In FIG. 5, the wiring board includes an electrode board 12a having two electrode terminals 10a and 10b, and a wiring board 12b having three electrode terminals 10c, 10d and 10e. Of the five lower electrode piece of the piezoelectric vibrator 4, the lower side electrode pieces 2a 1 is connected to the electrode terminals 10a by a lead wire 13a, the lower electrode strips 2a 2 connected to the electrode terminal 10b via a lead wire 13b The lower electrode piece 2a 3 is connected to the electrode terminal 10e by a lead wire 13e, and the lower electrode piece 2a 5 is connected to the electrode terminal 10d by a lead wire 13d. In the two-dimensional array ultrasonic probe having this connection pattern, electrical energy can be supplied to each of the lower electrodes 2a 1 , 2a 2 , 2a 3 , 2a 4 , 2a 5 independently. Therefore, this connection pattern is mainly used for a two-dimensional array ultrasonic probe for the purpose of obtaining a three-dimensional ultrasonic image.
[0026]
FIG. 6 is a plan view of another example in which the piezoelectric vibrator is viewed from the lower electrode side in a state in which the lower electrode piece of the piezoelectric vibrator and the wiring board are connected by lead wires. In FIG. 6, the wiring board is composed of an electrode board 12a having two electrode terminals 10a and 10b and a wiring board 12b having two electrode terminals 10c and 10d. Of the five lower electrode piece of the piezoelectric vibrator 4, the lower side electrode pieces 2a 1 is connected to the electrode terminals 10a by a lead wire 13a, the lower electrode strips 2a 2 connected to the electrode terminal 10b via a lead wire 13b , the lower electrode strip 2a 3 and the electrode terminal 10c connected by a lead wire 13c, the lower electrode strip 2a 5 connected to the electrode terminal 10b via a lead wire 13b connected to the lower electrode strips 2a 2 by a lead wire 13d, The lower electrode piece 2a 5 is connected to the electrode terminal 10e by a lead wire 13e. In the two-dimensional array ultrasonic probe having this connection pattern, electric energy can be simultaneously supplied to the lower electrode piece 2a 2 and the lower electrode piece 2a 4 . Therefore, this connection pattern is mainly used in a two-dimensional array ultrasonic probe for the purpose of electronically adjusting the focus of an ultrasonic beam.
[0027]
FIG. 7 is a plan view of still another example in which the piezoelectric vibrator is viewed from the lower electrode side in a state in which the lower electrode piece of the piezoelectric vibrator and the wiring board are connected by lead wires. In FIG. 7, the wiring board includes an electrode board 12a having two electrode terminals 10a and 10b, and a wiring board 12b having one electrode terminal 10c. Of the five lower electrode piece of the piezoelectric vibrator 4, the lower side electrode pieces 2a 1 is connected to the electrode terminals 10a by a lead wire 13a, the lower electrode strips 2a 2 connected to the electrode terminal 10b via a lead wire 13b The lower electrode piece 2a 3 is connected to the electrode terminal 10c by the lead wire 13c, the lower electrode piece 2a 4 is connected to the electrode terminal 10d by the lead wire 13d, and the electrode terminal is connected by the lead wire 13b together with the lower electrode piece 2a 2 connect to 10b, the lower electrode strip 2a 5 is connected to the electrode terminal 10b via a lead wire 13b connected to the lower side electrode pieces 2a 2 from the lead wire 13e. A two-dimensional array ultrasonic probe having such a connection pattern is advantageously used particularly when the focus is to electronically adjust the focus of the ultrasonic beam. In the two-dimensional array ultrasonic probe having this connection pattern, electric energy is simultaneously supplied to the lower electrode piece 2a 2 and the lower electrode piece 2a 4 , and the lower electrode piece 2a 1 and the lower electrode piece 2a 5. be able to. Therefore, this connection pattern is mainly used in a two-dimensional array ultrasonic probe for the purpose of electronically adjusting the focus of an ultrasonic beam.
[0028]
When the electrode terminal of the wiring board is connected to the lower electrode piece of the piezoelectric vibrator as described above, an uncured curable resin material is applied to the surface of the lower electrode piece of the piezoelectric vibrator as shown in FIG. The sound absorbing layer 14 is formed by curing, and then the upper and lower sides of the piezoelectric vibrator 4 are returned to the original, and the piezoelectric vibration from the surface opposite to the piezoelectric vibrator 4 side of the acoustic matching layer 7 to the front of the piezoelectric vibrator. A notch 15 is made at a position corresponding to the notch 8 b formed in the child, and the notch 15 is filled with the resin 16.
[0029]
An epoxy resin can be used as the curable resin for forming the sound absorbing layer.
[0030]
The cut 15 of the acoustic matching layer 7 is preferably set to a depth of 80 to 95% of the thickness of the acoustic matching layer 7, similarly to the cut 8 b of the piezoelectric vibrator.
[0031]
FIG. 9 shows a cutaway perspective view of an example of the two-dimensional array ultrasonic probe manufactured as described above. In FIG. 9, the two-dimensional array ultrasonic probe is composed of a plate-like piezoelectric body 3 having electrodes 1 and 2 on the upper and lower sides, and is formed in the two-dimensional direction with respect to the surface of the lower electrode 2. The lower electrode 2 and the plate-like piezoelectric body 3 are formed by notches 8 a and 8 b extending from the surface from the lower electrode 2 toward the upper electrode 1 to a depth of 80 to 95% of the thickness of the plate-like piezoelectric body 3. Is divided into a plurality of subdivided lower electrode pieces 2a and plate-like piezoelectric piece 3a (that is, the piezoelectric vibrator 4 has a plurality of piezoelectric vibrator pieces 4a 'and an upper electrode connecting piece. 4b ′) and the electrode terminal 10 electrically connected to each of the lower electrode piece 2a of the piezoelectric vibrator 4 and the piezoelectric vibrator 4 via the lead wire 13 and the electricity connected to each of the electrode terminals. A wiring board 12 having wiring 11 is formed on the surface of the lower electrode piece 2a of the piezoelectric vibrator. Sound absorbing layer 14, and is composed of an acoustic matching layer 7 of the first acoustic matching layer 5 formed on the surface of the upper electrode 1 of the piezoelectric vibrator second acoustic matching layer 6.
[0032]
The cuts 8a and 8b are filled with a resin 9 in order to reduce crosstalk between the piezoelectric vibrator pieces. Further, the acoustic matching layer 7 is formed with a cut 15, and the cut 15 is also filled with a resin 16.
[0033]
【The invention's effect】
In the method for manufacturing a two-dimensional array ultrasonic probe of the present invention, the upper electrode of the piezoelectric vibrator is not cut, so that it is not necessary to form a common electrode on the upper electrode of the piezoelectric vibrator piece. Therefore, in the two-dimensional array ultrasonic probe manufactured by the method of the present invention, the ultrasonic transmission / reception characteristics of each piezoelectric vibrator piece have a high degree of homogeneity. Further, in the manufacturing method of the present invention, the step of forming the common electrode that is necessary in the conventional manufacturing method can be omitted, and the productivity of the two-dimensional array ultrasonic probe is increased.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an example of a piezoelectric vibrator in which an acoustic matching layer is formed on the surface of an upper electrode in accordance with the method for manufacturing a two-dimensional array ultrasonic probe of the present invention.
FIG. 2 is a perspective view of a piezoelectric vibrator showing a state in which the piezoelectric vibrator of FIG. 1 has been cut in accordance with the method for manufacturing a two-dimensional array ultrasonic probe of the present invention.
3 is a cross-sectional view of a piezoelectric vibrator showing a state in which a resin is filled in the notch of the piezoelectric vibrator of FIG. 2 in accordance with the method for manufacturing a two-dimensional array ultrasonic probe of the present invention.
4 is a cross-sectional view of a piezoelectric vibrator showing a state in which the lower electrode piece of the piezoelectric vibrator of FIG. 3 and a wiring board are connected by a lead wire in accordance with the method for manufacturing a two-dimensional array ultrasonic probe of the present invention. FIG.
FIG. 5 shows a state in which the lower electrode piece of the piezoelectric vibrator and the wiring board are connected by a lead wire according to the method for manufacturing a two-dimensional array ultrasonic probe of the present invention. It is the top view of an example seen.
FIG. 6 shows a state in which the lower electrode piece of the piezoelectric vibrator and the wiring board are connected to each other by a lead wire according to the manufacturing method of the two-dimensional array ultrasonic probe of the present invention. It is a top view of another example seen.
FIG. 7 shows a state in which a wiring board and a lower electrode piece of a piezoelectric vibrator are connected by a lead wire from the lower electrode side according to the method for manufacturing a two-dimensional array ultrasonic probe of the present invention. It is the top view of another example seen.
8 is a diagram illustrating a method of manufacturing a two-dimensional array ultrasonic probe according to the present invention, in which a sound absorbing layer is formed on the surface of the lower electrode piece of the piezoelectric vibrator of FIG. It is sectional drawing of the piezoelectric vibrator which shows the state filled with resin.
FIG. 9 is a cutaway perspective view of an example of a two-dimensional array ultrasonic probe manufactured according to the method of manufacturing a two-dimensional array ultrasonic probe of the present invention.
[Explanation of symbols]
1 upper electrode 2 lower electrode 2a, 2a 1, 2a 2, 2a 3, 2a 4, 2a 5 lower electrode piece 3 piezoelectric plate 3a shaped piezoelectric member 4 piezoelectric vibrators 4a ultrasonic transmitting and receiving portion 4a 'piezoelectric Vibrator piece 4b Upper electrode connection portion 4b 'Upper electrode connection portion piece 5 First acoustic matching layer 6 Second acoustic matching layer 7 Acoustic matching layer 8a, 8b Notch 9 Resin 10, 10a, 10b, 10c, 10d, 10e Electrode terminal 11 Electrical wiring 12 Wiring boards 13, 13a, 13b, 13c, 13d, 13e Lead wire 14 Sound absorbing layer 15 Notch 16 Resin

Claims (3)

下記の工程からなる二次元アレイ超音波探触子の製造方法:
(1)上下に電極を備えた板状圧電体からなる圧電振動子の上側電極の表面に音響整合層を形成する工程;
(2)圧電振動子の下側電極の表面に対して、その二次元方向に、下側電極の表面から上側電極に向かって、板状圧電体の厚さの80〜95%の深さにまで延びる切り込みを入れて、下側電極と板状圧電体を複数個の細分化された下側電極片と板状圧電振動子片に分割する工程;
(3)別に用意した、圧電振動子の下側電極片に対応する電極端子と、該電極端子に接続する電気配線とを有する配線基板の電極端子を、圧電振動子の下側電極片のそれぞれにリード線を介して電気的に接続する工程
(4)圧電振動子の下側電極片の表面に、硬化性樹脂材料を硬化させることにより吸音層を形成する工程;そして、
(5)音響整合層の圧電振動子側とは反対側の表面から圧電振動子の手前まで、圧電振動子に形成されている切り込みに対応する位置にて切り込みを入れ、その切り込みに樹脂を充填する工程
A method for producing a two-dimensional array ultrasonic probe comprising the following steps:
(1) forming an acoustic matching layer on a surface of an upper electrode of a piezoelectric vibrator made of a plate-like piezoelectric body provided with electrodes on the upper and lower sides;
(2) With respect to the surface of the lower electrode of the piezoelectric vibrator, in a two-dimensional direction, from the surface of the lower electrode toward the upper electrode, the depth is 80 to 95% of the thickness of the plate-like piezoelectric body. A step of dividing the lower electrode and the plate-like piezoelectric body into a plurality of subdivided lower electrode pieces and plate-like piezoelectric vibrator pieces;
(3) Separately prepared electrode terminals of a wiring board having an electrode terminal corresponding to the lower electrode piece of the piezoelectric vibrator and an electric wiring connected to the electrode terminal are respectively connected to the lower electrode piece of the piezoelectric vibrator. Electrically connecting to the lead wire through a lead wire ;
(4) forming a sound absorbing layer by curing a curable resin material on the surface of the lower electrode piece of the piezoelectric vibrator ; and
(5) Cut from the surface of the acoustic matching layer opposite to the piezoelectric vibrator to the front of the piezoelectric vibrator at a position corresponding to the cut formed in the piezoelectric vibrator, and fill the cut with resin. Process .
圧電振動子の切り込みに樹脂材料を充填する工程を含むことを特徴とする請求項1に記載の二次元アレイ超音波探触子の製造方法。  The method for manufacturing a two-dimensional array ultrasonic probe according to claim 1, further comprising a step of filling a resin material into the notch of the piezoelectric vibrator. 上下に電極を備えた板状圧電体からなり、下側電極の表面に対して、その二次元方向に形成された、下側電極の表面から上側電極に向かって、板状圧電体の厚さの80〜95%の深さにまで延びる切り込みにより、下側電極と板状圧電体が複数個の細分化された下側電極片と板状圧電体片とに分割されている圧電振動子、圧電振動子の下側電極片のそれぞれにリード線を介して電気的に接続する電極端子と該電極端子のそれぞれに接続する電気配線とを有する配線基板、圧電振動子の下側電極片の表面に形成された吸音層、そして圧電振動子の上側電極の表面の上に形成された音響整合層からなる二次元アレイ超音波探触子。It consists of a plate-shaped piezoelectric body with electrodes on the top and bottom, and is formed in the two-dimensional direction with respect to the surface of the lower electrode, and the thickness of the plate-shaped piezoelectric body from the surface of the lower electrode toward the upper electrode A piezoelectric vibrator in which the lower electrode and the plate-like piezoelectric body are divided into a plurality of subdivided lower electrode pieces and plate-like piezoelectric pieces by a cut extending to a depth of 80 to 95% of A wiring board having an electrode terminal electrically connected to each of the lower electrode pieces of the piezoelectric vibrator via a lead wire and an electric wiring connected to each of the electrode terminals, and a surface of the lower electrode piece of the piezoelectric vibrator A two-dimensional array ultrasonic probe comprising a sound absorbing layer formed on the surface of the piezoelectric transducer and an acoustic matching layer formed on the surface of the upper electrode of the piezoelectric vibrator.
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US9532767B2 (en) 2012-04-25 2017-01-03 Samsung Electronics Co., Ltd. Ultrasonic probe apparatus and method of manufacturing ultrasonic probe apparatus

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JP5038865B2 (en) * 2007-11-22 2012-10-03 株式会社東芝 Ultrasonic probe, ultrasonic diagnostic apparatus, and method of manufacturing ultrasonic probe
KR101572118B1 (en) 2009-07-08 2015-11-26 삼성전자주식회사 Flip-chip bonding device used in contact condition
WO2017018307A1 (en) * 2015-07-24 2017-02-02 株式会社村田製作所 Vibrator array sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9532767B2 (en) 2012-04-25 2017-01-03 Samsung Electronics Co., Ltd. Ultrasonic probe apparatus and method of manufacturing ultrasonic probe apparatus

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