JP2003324798A - Manufacturing method of ultrasonic wave probe and rear member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel structure for a rear member provided to a sparse array vibrator. <P>SOLUTION: A plurality of front side contacts 72 are arranged to the front joining end face 58 of a wiring layer 52 at the same pitch as the layout pitch of vibration elements of a vibration element array 56 configuring the sparse array vibrator. A plurality of wave transmission contacts 32 and wave reception contacts 34 are arranged to an FPC joining end face 60 respectively. A lead main body 78 from the front side contact 72 to the transmission contact 32 corresponding to a transmission element 66 is arranged on a first wiring face 74 of the wire layer 52 and the lead main body 78 from the front side contact 72 to the reception contact 34 corresponding to a reception element 68 is arranged on a second wiring face 76. The wire layers 52 are formed for each vibration element array 56, they are layered alternately with an insulation plate to form a second rear member configuring the rear member. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe including a back member provided on the back surface of an array transducer and a method for manufacturing the back member.

[0002]

2. Description of the Related Art A two-dimensional array oscillator in which an extremely large number of vibrating elements are two-dimensionally arranged has been put into practical use. Also, 2
As a two-dimensional array transducer, a sparse two-dimensional array transducer (sparse array transducer) that transmits and receives ultrasonic waves by means of effective elements (other than that are ineffective elements) scattered two-dimensionally Is being studied. The effective element includes, for example, an effective element for transmitting ultrasonic waves and an effective element for receiving ultrasonic waves.

By the way, in general, signal electrodes of the respective vibrating elements are arranged on the back surface of the array vibrator (including the sparse array vibrator), and a back member is joined to the back surface. . The back member has a structure in which a plurality of linear leads pass through a base material made of a material that absorbs unnecessary ultrasonic waves emitted from the back surface. Here, in the base material,
A bonding surface (first surface) with the array transducer is formed, and a second surface, which will be described later, is formed on the opposite side of the first surface. One end of each lead is arranged on the first surface in a pattern corresponding to the arrangement position of the vibrating elements, each lead linearly penetrates the base material, and each of the other ends thereof is formed on the first surface. The same pattern as the above pattern is arranged on the second surface. The other ends of these are respectively connected to a plurality of signal lines used for transmitting signals to the vibration element.

[0004]

In the above structure, the other ends for transmitting a plurality of waves and for receiving a plurality of waves are intermingled on the second surface. Thus, in the past,
Since there was no concept of classifying the other end by function, connection work between each of these other ends and the signal line for wave transmission or the signal line for wave reception, or after connection work Work such as product inspection becomes complicated.

The present invention has been made in view of the above problems, and an object thereof is to provide a new structure of a back member.

[0006]

(1) In order to solve the above problems, the present invention has an array transducer having a plurality of vibrating elements, and a plurality of groups are set for the plurality of vibrating elements. And a back surface member provided on the back surface side of the array transducer, wherein the back surface member has a first surface facing the back surface side of the array transducer and a second surface to which a plurality of signal lines are connected. And a plurality of leads for signal transmission penetrating the inside of the base material from the first surface to the second surface, one end of the plurality of leads being the first A first pattern corresponding to the array of the plurality of vibrating elements is arranged on the surface, and the other ends of the leads are arranged on the second surface in a second pattern distributed according to the plurality of groups. And within the substrate Lead is characterized in that it constitutes a pattern conversion matrix to the second surface from the first surface.

According to the above structure, a back member having a structure in which a plurality of leads penetrate the base material is provided on the back surface side of the array vibrator including a plurality of vibrating elements. The rear surface member is provided with a first surface and faces the rear surface side. One end of each of the plurality of leads is arranged on the first surface at a position corresponding to the arrangement of the respective vibrating elements.
Forming a pattern. One end of each lead is directly or indirectly connected to each vibrating element. On the other hand, the rear surface is provided with the second surface.

Here, a plurality of groups are set for the plurality of vibrating elements, and the other ends of the plurality of leads are arranged on the second surface in accordance with the group of each vibrating element to be connected (preferably for each group). The second pattern is formed by being separated and arranged above. That is, in the base material, wiring for converting the arrangement position of each lead from the first pattern to the second pattern is formed to form a pattern conversion matrix.

In a preferred aspect of the present invention, the plurality of groups include an ultrasonic wave transmitting group and an ultrasonic wave receiving group.

In a preferred aspect of the present invention, the array transducer is a sparse array in which effective elements as vibrating elements used for at least one of transmitting and receiving ultrasonic waves are two-dimensionally arranged. It is characterized in that it is a two-dimensional array transducer of the type.

In a preferred aspect of the present invention, in the array vibrator, a vibrating element array extending in the X direction is orthogonal to the X direction.
The plurality of wirings are arranged in a direction, the base material has a plurality of wiring layers provided for each of the vibrating element rows, and one wiring surface of each of the wiring layers has a corresponding Leads connected to the vibrating elements belonging to the first group are provided, and the other wiring surface of each wiring layer is connected to the vibrating elements belonging to the second group in the corresponding vibrating element row. A lead is provided.

According to the above structure, the back member has a wiring layer provided for each vibrating element array, and the leads are distributed in units of this wiring layer.

In a preferred aspect of the present invention, a shield layer is provided between the wiring layers.

Here, the shield layer has, for example, a function of maintaining electrical insulation between leads on two adjacent wiring layers by the shield layer, a function of blocking an electromagnetic effect between the wiring layers, and the like. .

(2) In order to solve the above problem, the present invention provides a back surface provided on the back surface side of a two-dimensional array transducer including a plurality of vibrating elements in which a first element group and a second element group are set. In the method of manufacturing a member, a plurality of substrates having a first end surface facing the back surface and a second end surface provided on the side opposite to the first end surface and connected to a plurality of signal lines are provided with a plurality of substrates. A wiring plate producing step of producing a wiring plate by arranging leads; and a laminating step of producing a back member by laminating and adhering the plurality of wiring plates with an insulating plate interposed therebetween, The wiring plate manufacturing step includes a first wiring step of arranging the leads for the first element group from the first end surface to the second end surface on one wiring surface of each substrate, and the other wiring of each substrate. On the surface Characterized in that it comprises a second wiring step to dispose up to the second end surface of the lead for the second element group from the first end surface.

According to the above structure, the one wiring surface and the other wiring surface on the wiring plate are used to connect the lead connected to the vibration element of the first element group and the lead connected to the vibration element of the second element group. Reed is distributed. By laminating and bonding the sorted wiring plates through the space plate, a pattern-converted back member is manufactured. The space plate is a plate that forms a separated state between two adjacent wiring plates that are stacked. The space plate has a function of preventing a short circuit between leads between adjacent wiring plates and the like.

In a preferred aspect of the present invention, a step of producing the plurality of substrates is included prior to the step of producing the wiring plate, and the step of producing the substrate comprises: A first array producing step of producing a first contact member array by arranging a plurality of first contact members extending in the Y direction in an X direction orthogonal to the Y direction; and a Y direction on the second end face constituting surface of the base block. A second array manufacturing step of manufacturing a second contact member array by arranging a plurality of second contact members extending in the X direction in the X direction;
A slicing step of slicing the base material block on which the contact member array and the second contact member array are manufactured in the X direction to manufacture the plurality of substrates, each of the first end faces of the respective substrates has a A first contact row forming one end of a lead is formed, and a second contact row forming the other end of each lead is formed on the second end surface of each substrate.

According to the above structure, the first and second contact rows are not individually formed on the substrate according to each wiring plate to be manufactured, but can be commonly used for manufacturing a plurality of wiring plates. Plural substrates having the first and second contact rows can be produced.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings. FIG. 1 shows a main part of an ultrasonic probe according to the present invention. Specifically, a sparse array transducer 1 is shown.
0, the matching layer array 12 and the back member 14 are shown schematically.

The sparse array oscillator 10 is a two-dimensional array oscillator in which a plurality of vibrating elements 16 are two-dimensionally arranged in the XY directions in the drawing. That is, the sparse array oscillator 10 has a configuration in which a plurality of rows of the vibration elements 16 (vibration element rows) extending in the X direction are arranged in the Y direction. In the sparse array oscillator 10 of the present embodiment, about 500 of the approximately 1,600 vibrating elements 16 are effective elements, and these effective elements are arranged two-dimensionally. The remaining about 900 are ineffective elements. The effective element of this embodiment is roughly classified into either a wave transmitting element that transmits an ultrasonic wave or a wave receiving element that is used to receive an ultrasonic wave. On the back surface of the sparse array vibrator 10, signal electrodes (not shown) of the respective vibration elements 16 are arranged. A plurality of ground electrodes 18 extending in the X direction are formed on the front surface of each vibrating element for each vibrating element row.

A matching layer array 12 including a plurality of matching layers 20 is bonded to the front surface of the sparse array vibrator 10. Each matching layer 20 is bonded to each vibration element. The matching layer 20 has a function of acoustically matching the subject to be inspected by ultrasonic inspection and the vibration element.

A back member 14 is provided on the back surface of the sparse array vibrator 10. In the present embodiment, the back surface member 14 is composed of a first back surface member 22 joined to the back surface of the sparse array oscillator 10 and a second back surface member 24 connected to the first back surface member 22.

In the present embodiment, the first back member 22 has a function as a backing and has a rectangular parallelepiped shape. The first back surface member 22 has a structure in which a plurality of first leads (not shown) having electrical conductivity penetrate through a rectangular parallelepiped first base material 26 formed of a material that absorbs ultrasonic waves. Each of the first leads is electrically connected to each effective element.

In the present embodiment, the second back surface member 24 has a plurality of second conductive leads (not shown) on a second rectangular parallelepiped base material 28 formed of an electrically insulating material. It has a penetrating structure. Second back member 24
Is a plurality of wiring layers 52 on which a plurality of second leads are arranged.
Is laminated with a spacer layer 54 interposed therebetween. The wiring layer 52 and the spacer layer 54 will be described in detail later.

Each of the plurality of second leads is connected to each of the first leads, and is electrically connected to each effective element via the first lead. Second back member 24
The FPC bonding surface 30 is formed on the. This FPC
The bonding surface 30 has a second electrode electrically connected to the transmitting element.
Lead contact, that is, wave transmission contact 32
And the contact of the second lead electrically connected to the wave receiving element, that is, the wave receiving contact 34, are arranged so as to be distributed to each other. That is, each wave transmission contact 32 forms a wave transmission contact group 36, and
Each wave receiving contact 34 forms a wave receiving contact group 38. The wave transmitting contact 32 and the wave receiving contact 34 are formed on the wiring layer 52.

A flexible printed circuit board (FPC) (not shown) is bonded to the FPC bonding surface 30. This F
The PC has a plurality of transmitting signal lines and a plurality of receiving signal lines formed therein, and each transmitting signal line serves as a transmitting circuit for supplying a transmitting signal to the transmitting element. The wave receiving signal lines are connected to each other, and each wave receiving signal line is connected to a wave receiving circuit for processing the wave receiving signal connected from the wave receiving element.

FIG. 2 is a side view of this main part. First
The back surface member 22 has a vibrator bonding surface 40 bonded to the sparse array vibrator 10 and a rear bonding surface 42 bonded to the second back surface member 24. The rear joint surface 42 is formed on the opposite side of the transducer joint surface 40. First lead 44
The front electrode 46 at one end of the front electrode 46 is arranged on the vibrator bonding surface 40 in the same pattern as the signal electrode arrangement pattern of the vibrating element 16, and each front electrode 46 is connected to the corresponding signal electrode. ing. These first leads 44 have a linear shape, and are arranged in the first base material 26 so as to extend in the Z direction. The rear electrode 48 on the other end of the first lead 44 is
The front electrodes 46 are arranged in the same pattern.

The second back member 24 includes the first back member 22.
A front joint surface 50 that joins with is formed on the opposite side of the FPC joint surface 30. The wiring layer 52 has a front joint end face 58 that constitutes the front joint face 50 and an FPC joint end face 60 that constitutes the FPC joint face 30.

Here, the wiring layer 52 will be described with reference to FIG. FIG. 3 shows a structure 62 obtained by cutting out a main part of the ultrasonic probe shown in FIG. 2 with a B plane and a C plane parallel to the ZX plane. The structure 62 includes a wiring layer 52 and a vibrating element array 56 corresponding to the wiring layer 52. The vibrating element array 56 includes an ineffective element 64, a wave transmitting element 66, and a wave receiving element 68. Here, the first lead 44 is not arranged on the back surface of the ineffective element 64 in the drawing.

The wiring layer 52 has a first wiring surface 74, and a second wiring surface 76 on the surface opposite to the first wiring surface 74.

The lead in the wiring layer 52 has a structure in which the front side contact 72 and the wave transmitting contact 32 are connected by a lead body 78, or the lead body between the front side contact 72 and the wave receiving contact 34. It has a structure connected by 78. In FIG. 3, the front contact 72, the wave transmitting contact 32, and the wave receiving contact 3
4 is shaded.

Each front contact 72 has a rectangular parallelepiped shape and is embedded in the wiring layer 52 with one surface thereof exposed on the front joint end surface 58.
The plurality of front contacts 72 are arranged at the arrangement pitch of the vibrating elements 16 in the vibrating element array 56, that is, the first leads 44.
The rear electrodes 48 are arranged at the same arrangement pitch. The lateral width (width in the X direction) and vertical width (width in the Z direction) of each front contact 72 are, for example, 0.2 mm and 0.5 mm, respectively.

On the other hand, the wave-transmitting contact 32 and the wave-receiving contact 34 have a rectangular parallelepiped shape, and one surface thereof is F-shaped.
Each of the wiring layers 52 is embedded in the wiring layer 52 while being exposed on the PC bonding end surface 60. In addition, the wave transmission contact 32
The horizontal width (width in the X direction) and vertical width (width in the Z direction) of the wave receiving contact 34 are all 0.5 mm, for example.

Here, on the first wiring surface 74, a lead body 78 is extended from the front side contact 72 electrically connected to each wave transmitting element 66 to the wave transmitting contact 32. Further, on the second wiring surface 76, a lead body 78 is extended from the front side contact 72 electrically connected to each wave receiving element 68 to the wave receiving contact 34.

As described above, in the present embodiment, the transmission element 66 and the reception element 68 in the vibrating element array 56 are distributed by the wiring layer 52 corresponding to each vibrating element array 56.
Done by Therefore, in the inside of the second back surface member 24 (see FIG. 2) in which these wiring layers 52 are laminated and adhered via the spacer layer 54, the arrangement pattern of the front side contacts 72 on the front joint surface 50 is set to the FPC. Bonding surface 3
0 wave transmitting contact 32 and wave receiving contact 34
The pattern conversion matrix for converting into the arrangement pattern is formed.

Next, a method of manufacturing the second back member 24 shown in FIG. 1 will be described. Each step of manufacturing the second back surface member 24 is shown in FIG. In manufacturing the second back surface member 24 in the present embodiment, the wiring layer 52 and the spacer layer 54 having an insulating function are manufactured. The wiring layer 52 is manufactured through a substrate manufacturing process for manufacturing a substrate and a wiring manufacturing process for providing wiring on the substrate.

In the substrate manufacturing process, first, a matrix block 88 indicated by a chain double-dashed line in FIG. 5, which is a matrix of the substrate, is formed. In forming the mother block 88, first,
A plurality of first metal wires 90 and a plurality of second metal wires 92 each having a linear shape are arranged in a frame for forming the mold (S200).

Here, the arrangement pitch of the first metal wires 90 is the same as the arrangement pitch of the rear electrodes 46 of the first leads 44. The number of the first metal wires 90 is the same as the number of the first leads 44 provided. The lateral width (width in the X direction) of the first metal wire 90 in the present embodiment is 0.2 mm,
The vertical width (width in the Z direction) is 0.5 mm. The length (Y direction) is 13 mm.

Next, a plurality of second metal wires 92 are attached to the first metal wires 90 at a predetermined interval E, and a plurality of second metal wires 92 are connected to each other.
Arrange in the direction. In this embodiment, the same number of second metal wires 92 as the first metal wires 90, each having a width of 0.5 mm and a length of 0.5 mm and a length of 13 mm, are used. Here, in the present embodiment, the second metal wires 92 are divided into halves, each of which is referred to as a wave transmission wire group 94 and a wave reception wire group 96. When arranging the above-mentioned second metal wires 92, the wave transmission wire group 94 is arranged on one side,
The wave receiving wire group 96 is arranged on the other side, and the wire groups 94 and 96 are spaced apart from each other with a space F therebetween. Then, in each of the wave sending wire group 94 and the wave receiving wire group 96, the respective second metal wires 92 constituting the respective wires are arranged at the same predetermined pitch G.

With the first metal wire 90 and the second metal wire 92 formed in the frame body, a liquid synthetic resin is poured into the frame body (S202). Here, the synthetic resin in the present embodiment has electrical insulation when solidified, and is an epoxy resin mixed with SiC, silicon rubber particles, or the like. This synthetic resin is solidified by heating or the like to mold the mother block 88.

The substrate block 102 is manufactured by removing a predetermined region of the mother block 88 (S204). That is, in the mother block 88, the first removal region 98 shown by the broken line in the drawing is removed by cutting or the like to expose the surface of each first metal wire 90. Further, in the mother block 88, the second removal region 100 indicated by the broken line in the drawing is removed by cutting or the like to expose the surface of each second metal wire 82. In this way, the substrate building block 102 shown in FIG. 6A is manufactured.

The substrate block 102 includes a base material 104.
A plurality of first metal wires 90 and a plurality of second metal wires 92, a plurality of first metal wires 90 are arranged on one end face, and a plurality of first metal wires 90 are arranged on the other end face opposite to the one end face. The second metal wires 92 are arranged.

Next, the substrate block 102 is sliced in the X direction to manufacture a plurality of substrates 110 shown in FIG. 6B (S206). The thickness of the substrate 110 (width in the Y direction) is 0.17 mm, for example.

Next, the process goes to the wiring manufacturing step, and the wiring layer 52 shown in FIG. 7 is manufactured from these substrates 110. That is, the lead body 78 is wired on the first wiring surface 74 of each substrate 110 from the contact corresponding to the wave receiving element 68 of the front side contact 72 to the wave transmitting contact 32 so as to be electrically conductive (S208). , Each substrate 110
Of the front contacts 72 on the second wiring surface 76 of
The lead body 78 is arranged from the contact corresponding to the wave receiving element 68 to the wave receiving contact 34 (S210).
These lead bodies 78 are formed on the substrate 110 by using, for example, vapor deposition or photo etching.

Next, as shown in FIG.
And the insulating plate 118 having electric insulation are alternately laminated and adhered (S214). At this time, the wiring layer 52
Requires that the surfaces having the front contacts 72 be aligned and stacked in a predetermined order.

The insulating plate 118 has a function of preventing a short circuit between the lead bodies 70 in the two adjacent wiring layers 52. The horizontal width and the vertical width of the insulating plate 118 are the same as those of the wiring layer 52, and the thickness (width in the Y direction) thereof is 0.15 mm, for example. This insulating plate 118
Is a substrate block 102 shown in FIG. 6A, which is made of, for example, a synthetic resin having electric insulation when solidified.
A block having the same size as is molded by the above-described molding technique, and this block is sliced in the X direction in the same manner as in S206 described above (S212).

As described above, the second back member 24 having a complicated pattern conversion matrix can be manufactured by alternately laminating and bonding the wiring layers 52 and the insulating plates 118. The position of the rear electrode 48 on the rear joint surface 42 of the first rear surface member 22 shown in FIG. 2 and the position of the front contact 72 on the front joint surface 50 of the second rear surface member 24 are aligned to form the first rear surface. If the member 22 and the second back member 24 are pressure-bonded or bonded, the back member 14
(See FIG. 1) can be manufactured.

In this embodiment, the wave transmitting contact 32 and the wave receiving contact 34 are separately arranged on the left and right sides of the FPC joint surface 30 of the second back member 24. 32 may be arranged in the center of the FPC bonding surface 30 in the X direction, and the wave receiving contacts 34 may be arranged on both sides thereof.

Next, in addition to the ineffective element 64, the wave transmitting element 66 and the wave receiving element 68, the sparse array oscillator 10 is used as a wave transmitting / receiving element used for both transmission and reception of ultrasonic waves. An embodiment of the second back surface member in the case of being constituted by will be described. The second back member in this embodiment corresponds to the back member 24 (see FIG.
Similarly to the above), a wave transmission contact group 36 having an FPC joint surface 30 and composed of a plurality of wave transmission contacts 32,
A wave receiving contact group 38 including a plurality of wave receiving contacts 34 is distributed. Further, it has a structure in which the wiring layers 52 and the spacer layers 54 are alternately laminated. Here, the wiring layer in this embodiment is shown in FIG. The wiring layer 54a has a second lead 70 electrically connected to the wave transmitting / receiving element. In the second lead 70, a single front side contact 72 and the wave transmission contact 32 are connected by a lead body 78 on the first wiring surface 74, and the front side on the second wiring surface 76. The side contact 72 and the wave receiving contact 34 form the lead body 7
It has a structure connected by 8. As a result, even when the wave transmitting / receiving element is used, as in the case of the second back surface member 24 of the above-described embodiment, the arrangement including the wave transmitting contact 32 and the wave receiving contact 34 on the FPC joint surface 30. A pattern can be formed.

Next, another embodiment of the second back member will be described with reference to FIG. FIG. 10 (A) shows the FPC bonding surface 30a of the second back surface member 24a. In the second back surface member 24a, the plurality of wiring layers 52 in the above-described embodiment has the blocking plate 12 as a spacer layer.
It has a structure in which the layers are stacked with 0 in between. In the second back surface member 24a, the spacer layer 5 located at the end in the Y direction is located.
Although the insulating plate 118 is used as 4, the blocking plate 120 may be used.

The blocking plate 120 will be described with reference to FIG. The blocking plate 120 has a sandwich structure in which a ground plane 124 is sandwiched between two insulating planes 122. The thickness of the blocking plate 120 is the same as the thickness of the insulating plate 118 described above.
Here, the insulation plane 122 and the ground plane 12
4 has a thin plate shape, and the horizontal width and the vertical width thereof are the same as those of the insulating plate 118. Insulation plane 122
Has an electrical insulating property, and is made of, for example, the same material as the insulating plate 118. Also, the ground plane 1
24 is formed of a material having electrical conductivity such as metal. The ground plane 124 is connected to the ground line formed on the FPC when the FPC (not shown) is bonded to the second back surface member 24a, and is dropped to the ground.

In the second back member 24a, the wiring layer 52
Electromagnetic influence between the wiring layers 52 is blocked by the blocking plate 120, and electrical crosstalk between the wiring layers 52 is prevented.

[0053]

According to the present invention, a back member having a new structure can be provided.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing a sparse array transducer, a matching layer array, and a back member as main parts of an ultrasonic probe according to the present invention.

FIG. 2 is a side view of the main part shown in FIG.

FIG. 3 is a diagram showing a structure obtained by cutting out the main part shown in FIG. 2 in a B plane and a C plane.

FIG. 4 is a diagram showing each step in manufacturing the second back member.

FIG. 5 is a diagram illustrating a manufacturing process of a mother block necessary for manufacturing a second back member.

FIG. 6 is a view showing a substrate block and a substrate formed in a manufacturing process of a second back member.

FIG. 7 is a diagram showing a wiring layer formed in a manufacturing process of a second back surface member.

FIG. 8 is a diagram illustrating a laminating and bonding step in the method for manufacturing the second back surface member.

FIG. 9 is a diagram illustrating a second lead of a second back surface member used for the wave transmitting / receiving element.

FIG. 10 is a view showing a second back member and a blocking plate constituting the second back member according to another embodiment.

[Explanation of symbols]

10 Sparse Array Transducer, 14 Back Member, 16
Vibrating element, 22 first back member, 24 second back member,
32 wave contact, 34 wave contact, 5
2 wiring layers, 54 spacer layers, 66 wave transmitting elements, 6
8 Wave Receiving Element, 70 Second Lead, 72 Front Contact, 74 First Wiring Surface, 76 Second Wiring Surface, 78
Lead body, 118 insulating plate.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2G047 CA01 EA14 EA19 GB02 GB17                       GB21 GB23                 4C301 EE15 EE17 GA02 GA03 GB10                       GB18 GB20 GB33                 4C601 EE12 EE14 GA01 GA02 GA03                       GB01 GB03 GB06 GB19 GB20                       GB41                 5D019 AA26 BB18 BB26 BB28 BB29                       EE02 HH01

Claims (7)

[Claims] 1. An array transducer having a plurality of vibrating elements, wherein a plurality of groups are set for the plurality of vibrating elements; and a back member provided on the back side of the array transducer, The back surface member includes a base material having a first surface facing the back surface side of the array transducer, and a second surface to which a plurality of signal lines are connected, and the first surface to the second surface. A plurality of leads for signal transmission penetrating the inside of the base material; and one end of the plurality of leads having a first pattern corresponding to the array of the plurality of vibrating elements on the first surface. The other ends of the plurality of leads are arranged with a second pattern distributed according to the plurality of groups on the second surface, and the plurality of leads are arranged in the base material from the first surface to the first surface. Pattern conversion machine to two sides An ultrasonic probe characterized by constituting a trick. 2. The ultrasonic probe according to claim 1, wherein the plurality of groups include an ultrasonic wave transmission group,
An ultrasonic probe comprising: a group for receiving ultrasonic waves. 3. The ultrasonic probe according to claim 1, wherein in the array transducer, an effective element as a vibrating element used for at least one of transmitting and receiving ultrasonic waves is two-dimensionally arranged. An ultrasonic probe characterized by being sparse two-dimensional array transducers arranged in a scattered manner. 4. The ultrasonic probe according to claim 1, wherein the array transducer is formed by arranging a plurality of transducer elements extending in the X direction in a Y direction orthogonal to the X direction. Has a plurality of wiring layers provided for each of the vibrating element rows, and one wiring surface of each of the wiring layers is connected to a vibrating element belonging to a first group in the corresponding vibrating element row. And a lead connected to a vibrating element belonging to a second group in the corresponding vibrating element row is disposed on the other wiring surface of each wiring layer. Ultrasonic probe. 5. The ultrasonic probe according to claim 4, wherein a shield layer is provided between each of the wiring layers. 6. A method for manufacturing a back member provided on the back surface side of a two-dimensional array transducer including a plurality of vibrating elements in which a first element group and a second element group are set, comprising: A wiring plate for producing a wiring plate by disposing a plurality of leads on a plurality of substrates having one end surface and a second end surface provided on the side opposite to the first end surface and connected to a plurality of signal lines. A manufacturing step, and a stacking step of stacking and adhering the plurality of wiring plates with a space plate interposed therebetween to manufacture the back member, wherein the wiring plate manufacturing step includes one wiring surface of each substrate. A first wiring step of disposing the leads for the first element group from the first end surface to the second end surface, and a lead for the second element group on the other wiring surface of each substrate. A second wiring step of arranging from the first end surface to the second end surface. 7. The method for manufacturing a back member according to claim 6, further comprising a substrate manufacturing step of manufacturing the plurality of substrates prior to the wiring plate manufacturing step, wherein the substrate manufacturing step includes a first step of the base block. A first array production step of producing a first contact member array by arranging a plurality of first contact members extending in the Y direction in the X direction orthogonal to the Y direction on the end face configuration surface; and a second end face configuration of the base block. A second array production step of producing a second contact member array by arranging a plurality of second contact members extending in the Y direction on the surface in the X direction; and producing the first contact member array and the second contact member array. A slicing step of slicing the substrate block to produce a substrate, and a first contact forming one end of each lead on the first end face of each substrate. Column is formed, the second of said each substrate
A method of manufacturing a back member, wherein a second contact row forming the other end of each lead is formed on the end surface.