JP2007130385A - Ultrasonic probe and backing for use in the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the size of each pad which is formed on the undersurface of backing with a built-in lead array. <P>SOLUTION: A lead lower-end array is formed on the undersurface of the backing, and a plurality of lead lower-end sub-arrays 34 are set for the lead lower-end array. The sub-array 34 is composed of at least two lead lower-end rows 26. In each of the sub-arrays 34, a lower end of a lead is positioned in such a manner that only one lower end of the lead exists in each Y-direction section. Thus, the X-direction size of each section can be increased. When a pitch between the lower end of the leads is increased, the Y-direction size of each section can also be increased. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an ultrasonic probe and a backing used therefor, and more particularly to a configuration of a lead array embedded in the backing.

  The ultrasonic probe is provided with an array transducer, a matching layer, a backing, and the like. As the array transducer, a 1D array transducer and a 2D array transducer are known, and a sparse array transducer is also known as a kind of the latter 2D array transducer. A general 2D array transducer is composed of a large number of vibration elements arranged two-dimensionally. The sparse array transducer is used to reduce the number of channels and the number of signal lines, and transmits and receives ultrasonic waves using a plurality of effective vibration elements set in a distributed manner. The effective vibration element functions as a transmission vibration element, a reception vibration element, or a transmission / reception vibration element.

  In order to connect a signal line to each of a plurality of vibration elements constituting the 2D array vibration element, a backing with a built-in lead array is used. That is, the signal line is connected from the lower surface side (non-biological side) of each vibration element. In order to embed a lead array in a backing, a plurality of backing internal wiring flexible circuit (FPC) substrates or other substrates (hereinafter referred to as internal wiring substrates) are generally provided in the backing at predetermined intervals (hereinafter referred to as the following patents). Reference 1). Each internal wiring board has a lead row composed of a plurality of leads. In this type of ultrasonic probe, a lead array is constituted by a plurality of lead rows.

  On the lower surface side of the backing, generally, a flexible circuit (FPC) substrate for external wiring or another substrate (hereinafter referred to as an external wiring substrate) is connected to the lead array. Therefore, a pad (electrode) array is formed on the lower surface of the backing, and a pad array is also formed on the connection substrate side. That is, the signal line is connected to each lead by the contact of two pads. In addition to the conduction line, an amplifier, a switching circuit, and the like may be mounted on the external wiring board.

  In 2D array transducers, element miniaturization is progressing. The element pitch is, for example, 0.1 to 0.2 mm. When the plurality of leads constituting the lead array extend straight and are in parallel with each other, the lead-to-lead pitch is very small in both the upper end portion and the lower end portion of the lead array, similar to the inter-element pitch. As a result, the individual pad arrays must be made very small on the underside of the backing. For this reason, when the pad array and the external wiring board are electrically connected, high-precision positioning is required, and the operation is difficult.

  In particular, when using a double-sided board (a board with a conductive pattern formed on both sides), a multilayer board (a board with one or more conductive patterns formed inside) as the external wiring board, the board. Although through-holes are formed together with pads at necessary places in the circuit board, there is a limit to reducing the size of the through-holes, so it is difficult to reduce the size of each pad on the substrate. By making the size of the through hole very small and positioning it with high precision, it is possible to make each pad on the external wiring board finer, but the connection work is still difficult, and the element is fine. There is a desire to secure a certain size of each pad formed on the external wiring substrate even in the process of the process.

  Patent Document 1 discloses a 2D array transducer and a backing, and a plurality of aligned flexible substrates are provided in the backing. Patent Document 2 discloses a backing with a built-in lead array. Here, the lead array has a form extending to the lower surface side (non-biological side). Patent Document 3 discloses a backing with a built-in lead array. In this backing as well, the lead array has a form spreading to the lower surface side.

JP 2001-309493 A JP 2002-345094 A JP 2003-265476 A

  In the configuration described in Patent Document 1, since a plurality of flexible boards are arranged in parallel, and since no special device has been applied to form a lead row between the flexible boards, it is formed on the lower surface of the backing. It is difficult to increase the size of each pad. In the configurations described in Patent Documents 2 and 3, the size of each pad formed on the lower surface of the backing can be increased by the radially extending lead array. However, those patent documents do not describe increasing the size of the pad as a result of adjusting the lead row patterns for a plurality of lead rows.

  An object of the present invention is to increase the pitch between leads on the lower surface of the backing.

  Another object of the present invention is to increase the pitch between leads in the first direction on the lower surface of the backing and also increase the pitch between leads in the second direction.

(1) The present invention is an array transducer having a plurality of transducer elements, a backing provided on the lower surface side of the array transducer and arranged in the X direction, and formed on the lower surface of the backing. Each of the substrates is formed with a lead array composed of a plurality of leads arranged in the Y direction, thereby forming a lead array composed of a plurality of lead arrays in the backing, Each of the lead rows has a lower lead row that appears on the lower surface of the backing, whereby a lower lead array comprising a plurality of lower lead rows is formed on the lower surface of the backing. , N is an integer of 2 or more) For each lead lower end sub-array consisting of a number of lead lower end rows, a shift relationship in which the lead lower end positions are different in the Y direction is formed. And, wherein the pad array is connected to said lead lower array has a plurality of pads having a size that spans the X direction into n substrate, characterized in that.

  According to the above configuration, in the lead lower end array (a plurality of lead lower end rows aligned in the X direction) configured on the lower surface of the backing, a plurality of lead lower end sub-arrays with n lead lower end rows as a unit are set. . In each lead lower end sub-array, the position of each lead lower end in the Y direction is determined so that a predetermined shift relationship is established in the Y direction orthogonal to the X direction. That is, in each lead lower end sub-array, basically, only one of the lower ends of the leads is allowed to exist at each position in the Y direction, and a plurality of lower ends of the leads are not allowed to exist at the same position at the same time. (In this case, there may be a position where the lower end of the lead does not exist). If the position of the lower end of each lead is determined according to such conditions, a pad row is formed across n substrates in units of n substrates. The pad row is composed of a plurality of pads arranged in the Y direction, and each pad is basically electrically connected to one lower end of the lead (in this case, a dummy is placed in the Y direction position where none of the lower ends of the leads exists). Pad may be provided).

  When the same transmission signal is supplied in parallel to the lead lower end subarray (in the case of branching), or when a plurality of reception signals are fed into the common signal line (in the case of merging), in the lead lower end subarray, It is also possible to set a plurality of lower ends of the leads at the same Y direction position. That is, in such a case, it is not necessary to electrically separate specific lower ends of the leads. The predetermined shift relationship is a condition applied to a plurality of leads (a plurality of lower ends of the leads) that need to be handled electrically separated from each other.

  According to the above configuration, the pad pitch in the Y direction can be increased more than the inter-substrate pitch. For example, when a plurality of substrates are arranged in parallel, the pad pitch can be n times the pitch between the substrates. If the thickness of each substrate (or the size between each substrate) is increased from the top to the bottom, the pitch between the substrates in the Y direction can be further increased. On the other hand, if each substrate is in the form of a flat plate, the manufacture becomes easy. Also in the Y direction, the pad pitch can be increased as described below. The above method is preferably applied to a backing for a sparse array type array transducer, but can also be applied to a backing for a normal 2D array transducer.

  Preferably, a lead upper end array including a plurality of lead upper end rows corresponding to the plurality of lead rows is formed on the upper surface of the backing, and a minimum pitch in the X direction of the lead upper end array is equal to X in the array transducer. The minimum pitch in the X direction in the lead lower end array corresponds to n times the basic pitch in the X direction in the array transducer. The basic pitch in the X direction corresponds to the inter-element pitch in the case of a normal 2D array transducer, and corresponds to the minimum inter-element pitch in the case of a sparse array type 2D array transducer.

  Preferably, each lead row has a form extending in the Y direction from the lead upper end row toward the lead lower end row, and the minimum pitch in the Y direction in the lead upper end array is the basic in the Y direction in the array transducer. The minimum pitch in the Y direction in the lead lower end array is greater than the basic pitch in the Y direction in the array transducer. According to this configuration, the pad pitch can be increased in the X direction, and at the same time, the pad pitch can be increased in the Y direction.

  Preferably, the backing has a rectangular parallelepiped shape, and a margin region is formed on the upper surface of the backing as a region other than the lead upper end array. Although the shape of the backing can be a pyramid shape that is enlarged from the top to the bottom, if the above configuration is adopted, the shape of the backing is simple, so that it can be easily formed.

  Preferably, the array transducer is a sparse 2D array transducer. In the case of the sparse type, effective vibration elements are set in a distributed manner, and conversely, the gap tends to increase. Therefore, it is easy to establish the above shift relationship. That is, excessive enlargement in the Y direction can be prevented for the backing. Note that the sparse 2D array transducer includes, for example, a plurality of effective elements and a plurality of reactive vibration elements (dummy vibration elements), but the latter need not be provided. Preferably, the n is 2. Of course, n can be an integer of 3 or more.

  Preferably, the ultrasonic probe is a body cavity insertion type ultrasonic probe. Of course, the present invention can also be applied to an ultrasonic probe used in contact with the body surface and other ultrasonic probes.

(2) In the ultrasonic probe backing provided on the lower surface side of the array transducer according to the present invention, the backing has a built-in lead array including a plurality of lead rows arranged in the X direction. Is composed of a plurality of leads arranged in the Y direction, and the lead array includes a lead upper end array composed of a plurality of upper end leads arranged on the upper surface of the backing and a plurality of leads constituted on the lower surface of the backing. A lead lower end array comprising a lower end row, wherein the lead lower end array is divided into a plurality of lead lower end subarrays arranged in the X direction, and each lead lower end subarray is n (where n is an integer of 2 or more) ) Each lead lower end row, and in each lead lower end sub-array, each lead lower end position in the Y direction between the n lead lower end rows. Shift relationship is established that offset from one another so as not aligned, characterized in that.

  Preferably, the backing has a plurality of substrates aligned at a first pitch in the X direction, a lead row is formed on each substrate, and a second pitch as a minimum pitch in the X direction in the lead lower end array is The pitch is n times the first pitch.

(3) The backing can be configured by, for example, stacking a plurality of substrates (for example, flexible circuit substrates) and a plurality of spacer plates alternately in the X direction to form a stacked body. Alternatively, instead of using such a lamination method, a lead array (or a plurality of substrates) may be arranged in the mold, and the backing material may be poured into the mold to be cured. . Moreover, a laminated body can also be comprised by forming a some slit in backing material and inserting a board | substrate in each slit. When a plurality of substrates are used in the backing for a sparse 2D array transducer, a lead array is formed with a predetermined pattern for each substrate. At the time of backing assembly, the substrates are positioned in the proper order.

  When the backing is formed in a rectangular parallelepiped, the size in the Y direction (minimum size) on the lower surface thereof is the maximum number of leads (corresponding to the maximum number of vibration elements) included in the lead lower end subarray (n lead columns). It can be calculated as a value obtained by multiplying the pitch between pads in the Y direction. In general, if n is increased, the size of the backing in the Y direction increases under the assumption that the pitch between pads is constant.

  As described above, according to the present invention, the pitch between leads can be increased on the lower surface of the backing.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.

  FIG. 1 shows a preferred embodiment of a vibrator assembly according to the present invention, and FIG. 1 is a perspective view thereof. As will be described later, this transducer assembly is incorporated in an ultrasonic probe. The ultrasonic probe is connected to an ultrasonic diagnostic apparatus body that performs ultrasonic diagnosis on a living body to form an ultrasonic image.

  In FIG. 1, an array transducer 10 is a 2D array transducer, and in this embodiment, a sparse 2D array transducer is used as the 2D array transducer. As will be described later with reference to FIG. 2, the sparse type 2D array transducer includes a plurality of vibration elements aligned in the X direction and the Y direction, and the vibration elements include a plurality of effective vibration elements and a plurality of ineffective vibrations. It is comprised by an element (dummy vibration element). Each effective vibration element is a transmission vibration element or a reception vibration element in this embodiment. Of course, a transmitting / receiving vibration element may be used. In FIG. 1, one effective vibration element is illustrated by reference numeral 11. Note that the ineffective vibration element may be excluded from the 2D array transducer.

  One or a plurality of matching layers are provided on the upper surface side of the array transducer 10. Each matching layer includes a plurality of matching elements provided corresponding to the plurality of vibration elements. They are not shown in the figure. The transducer assembly is disposed in a probe case (not shown), but the probe case is not shown in FIG.

  A backing 12 is provided on the lower surface side of the 2D array transducer 10 to scatter and absorb ultrasonic waves emitted backward. In the example shown in FIG. 1, the backing 12 is composed of a plurality of substrates (AH in the figure) and a plurality of spacers 14, which are arranged alternately. The arrangement direction is the X direction. Incidentally, the Y direction is a horizontal direction orthogonal to the X direction. Furthermore, the Z direction is defined as a direction orthogonal to the X direction and the Y direction. The spacer 14 is made of a backing material.

  A lead row 20 is formed on each substrate (AH). The lead row 20 includes a plurality of leads 20 provided side by side in the Y direction. The upper end portion of the lead row 20 constitutes a lead upper end row 24 composed of a plurality of lead upper ends. The lower end portion of the lead row 20 constitutes a lead lower end row 26 constituted by a plurality of lead lower ends 22b. Each lead upper end 22a appears on the upper surface 12A of the backing 12, and each lead lower end 22b appears on the lower surface 12B of the backing 12. In the lead row 20, the upper end portions gather near the center in the Y direction, and the lower end portions spread in the Y direction. That is, the lead row 20 has a divergent shape that spreads from the top to the bottom. As described in detail below, the array pattern of the lead rows 20 (particularly the arrangement of the lead lower end rows 26) on each substrate is determined so that a predetermined shift relationship is established for each substrate.

  In FIG. 1, an area indicated by reference numeral 100 on the upper surface 12 </ b> A of the backing 12 is an area where the 2D array transducer 10 is joined. Margin regions 102 and 104 are formed on both sides of the region 100 in the Y direction. The backing 12 has a rectangular parallelepiped shape as shown in FIG. As a modification, the backing 12 may be widened in the Y direction from the top to the bottom without providing the margin regions 102 and 104. In that case, each substrate (A-H) is formed in a trapezoidal shape. By making the backing 12 in the form of a rectangular parallelepiped, the manufacture of each substrate and each spacer 14 can be simplified. Each substrate and each spacer 14 have the same form in the YZ plane.

  As described above, since the lead upper end row 24 and the lead lower end row 26 are formed for each substrate, a lead upper end array formed of a plurality of lead upper end rows is formed on the upper surface 12A of the backing 12, On the lower surface 12B of the backing 12, a lead lower end array constituted by a plurality of lead lower end rows 26 is formed. The lead upper end array is electrically connected to a plurality of effective elements in the 2D array transducer 10. On the other hand, the lead lower end array is electrically connected to a pad array formed on a predetermined external wiring substrate not shown in FIG. Prior to that, a pad array having a predetermined arrangement is formed on the lower surface 12B of the backing 12. That is, the pad array in the backing 12 and the pad array on the external wiring board are electrically connected.

  Each board | substrate is comprised by the flexible circuit board (FPC) in this embodiment. That is, the base layer 18 having a film-like insulating property and the lead row 20 formed on one surface of the base layer 18 are configured. The lead row 20 is formed in a predetermined pattern by etching or other methods. In FIG. 1, each substrate is drawn with a certain degree of thickness, and each lead 22 is drawn with a certain degree of thickness, but in actuality these thicknesses are extremely small. It is desirable to form a pad array also on the upper surface 12A of the backing 12. Such a pad array can be easily formed by forming an electrode layer having a uniform thickness by vapor deposition or sputtering, and then performing cutting or etching using a dicing saw.

  FIG. 2 shows a top view of the vibrator assembly shown in FIG. As described above, the 2D array vibrator 10 includes a plurality of vibration elements arranged in the X direction and the Y direction. The vibration elements include a plurality of effective vibration elements 11a indicated by hatching in the drawing and the other elements. And a plurality of reactive vibration elements 11b. The plurality of effective vibration elements 11a are arranged randomly or dispersively as shown in the figure. In FIG. 2, reference numeral 100 represents an area where the 2D array transducer 10 is joined, and reference numerals 102 and 104 represent other margin areas.

  FIG. 3 shows the state of the lower surface of the backing 12. However, for convenience of explanation of the invention, FIG. 3 shows the state of the lower surface seen through from above.

  As described above, a lead lower end array corresponding to the lead array appears on the lower surface of the backing. The lead lower end array is constituted by a plurality of lead lower end rows 26, which are aligned in the X direction. Each lead lower end row 26 includes a plurality of lead lower ends arranged in a predetermined pattern in the Y direction.

  In the present embodiment, a plurality of lower lead sub-arrays 34 are virtually set with respect to the lower lead array in units of n lower lead rows. In this embodiment, n is 2, that is, the lead lower end sub-array 34 is set for every two lead lower end rows 26 in the Y direction. The lead lower end arrays in the two lead lower end rows are determined so that a predetermined shift relationship is established for each lead lower end sub-array 26. This will be described in detail below. Reference numeral 200 denotes a substrate sub-array composed of n substrates. It corresponds to the lead bottom subarray.

  In FIG. 3, reference numeral 30 is a line representing a plurality of sections virtually set on the lower surface of the backing (corresponding to an interpad separation groove), and each section corresponds to one pad. For example, paying attention to one lead lower end sub-array 34, a plurality of sections arranged in a line in the Y direction are set, and each section is set across two substrates. In each lead lower end sub-array, basically only one lower end of the lead is allowed for each position in the Y direction, that is, for each section. For example, when attention is paid to the partition 40, only the lower lead 42 on the substrate A is included in the two substrates A and B, and when attention is paid to the partition 44, only the lower lead 46 of the substrate A is included in the two substrates A and B. In view of the section 48, only the lower end 50 of the lead on the substrate B exists between the two substrates A and B. The same applies to the other sections. The width W3 in the X direction in one section corresponds to twice the substrate pitch (inter-element pitch) in the present embodiment, and the width W2 in the Y direction in the section can be arbitrarily set. In this embodiment, W2 is defined as twice the pitch between elements. Thus, conventionally, the size of each pad in the X direction and the Y direction is the same as the inter-element pitch. However, according to the present embodiment, these sizes can be double the inter-element pitch. . Of course, if n defining one lead lower end sub-array is increased, the width W3 can be increased, and W2 can be freely set as described above. In general, it is desirable to set W3 and W2 to the same value. In this way, a square pad can be formed.

  As described above, the lead lower end array is determined so that a predetermined shift relationship is established for each lead lower end sub-array 34. Therefore, when attention is paid to one lead lower end sub-array 34, each lead lower end sub-array 34 is basically determined for each position in the Y direction. Therefore, only one lower end of the lead is associated. Therefore, the size W1 in the Y direction in the backing can be obtained as a result of multiplying the maximum value of the number of leads included in one lead lower end sub-array 34 by W2. Of course, the size of the backing in the Y direction may be further increased. In each lead lower end sub-array 34, the number of lead lower ends included in the lead lower end sub-array 34 may not be constant. Therefore, a lead lower end sub-array having the largest number of lead lower ends is specified, and the above-mentioned W1 is determined with the maximum value of the number of lead lower ends. May be calculated. In the lead lower end subarray, there may be one or a plurality of empty sections in a plurality of positions in the Y direction, that is, a plurality of sections. That is, there may be a section where one lower end of the lead does not exist. When a plurality of vibration elements are driven simultaneously, or when a plurality of reception signals from a plurality of vibration elements are added together by connection, there are exceptionally a plurality of signals for one section, that is, one pad. The lower ends of the leads may be associated with each other.

  In the present embodiment, the inter-element pitch is, for example, 0.15 mm × 0.15 mm, but the pad pitch on the lower surface side of the backing can be 0.3 mm × 0.3 mm. In this case, for example, if the number of pads in the Y direction is 8, the size of W1 can be calculated as 0.3 mm × 8 = 2.4 mm. Of course, each numerical value given above is only an example.

  In this embodiment, in particular, even if a pad is formed across a plurality of substrates in the X direction, the number of leads connected to the pad can be limited to one. There is an advantage that the size of the pad in the X direction can be increased while associating the pad. In this embodiment, n is 2. However, if n is 3, it is possible to increase the size three times, and n can be set to a desired value. The method according to the present embodiment need not be applied to the entire region on the lower surface side of the backing, and may be partially applied to a part of the region. When forming a plurality of pads on the lower surface side of the backing, as described above, first, an electrode layer having a certain thickness is formed on the lower surface of the backing using vapor deposition or sputtering, and dicing is performed on the electrode layer. The pad array can be easily formed by forming the cutting groove along the line 30 described above with a saw or by performing etching along the line 30. The shape of the pad is preferably a square, but other shapes may be used.

  4 to 11 show the pattern of the lead row 20 on each substrate. Reference numeral 18 represents a base layer of each substrate, and reference numeral 20 represents a lead row formed on each substrate. Moreover, the figure shown under the board | substrate 18 has shown typically the pad row | line | column matched with each board | substrate.

  4 and 5 show the substrates A and B. FIG. In the pad row 52AB, a part of the plurality of pads included therein is used for the substrate A, and the rest is used for the substrate B. The same applies to the pad row 52CD shown in FIGS. 6 and 7, the same applies to the pad row 52EF shown in FIGS. 8 and 9, and the pad row 52GH shown in FIGS. It is the same.

  12 and 13 show an ultrasonic probe in which the above-described transducer assembly is incorporated. Specifically, FIG. 12 and FIG. 13 show the structure of the distal end portion of an intracavity type ultrasonic probe. FIG. 12 shows a cross-sectional view seen from above, and FIG. 13 shows a cross-sectional view seen from the side.

  In this embodiment, the intracavitary ultrasonic probe is inserted into the esophagus or the rectum, and the distal end portion 54 of the insertion portion is shown in FIGS. 12 and 13. A transducer assembly 58 is provided in the probe case 56. The vibrator assembly 58 has the 2D array vibrator 10 as described above, and the matching layer 64 is provided on the upper surface side thereof. An acoustic window (protective layer) 67 forming a part of the probe case is provided on the upper surface side of the matching layer 64. A backing 12 is disposed on the lower side of the 2D array transducer 10, and a plurality of two-dimensionally arranged pad arrays 66 are formed on the lower surface thereof.

  On the other hand, a substrate 60 for external wiring is provided on the lower side of the vibrator assembly, and a two-dimensionally arranged pad array 68 is formed on the upper surface thereof. The pad array 66 and the pad array 68 are electrically connected to each other through their physical contacts. A plurality of signal lines (cables) 62 are connected to one end of the substrate 60.

  As shown in the figure, the vibrator assembly has a rectangular parallelepiped shape extending in the Y direction due to the presence of the two margin regions 102 and 104, and the vibrator is made to match the longitudinal direction with respect to the central axis at the tip 54. The assembly is stowed. Therefore, even if the margin regions 102 and 104 exist, no particular problem occurs due to their enlarged portions. Rather, since the backing 12 has a sufficient spread, there is an advantage that the backing effect can be sufficiently exhibited. It is also possible to provide an electric circuit in the substrate 60. In addition, the vibrator assembly may be rotationally driven within the distal end portion 54. Furthermore, it is also possible to incorporate the above-described vibrator assembly into a probe used in contact with the body surface. In this case, it is also possible to configure the trapezoidal or pyramid type transducer assembly by cutting off the margin regions 102 and 104 described above obliquely, and in this way, the subject contact portion of the probe is tapered. Is possible.

1 is a perspective view showing a preferred embodiment of a vibrator assembly according to the present invention. FIG. 2 is a schematic top view of the vibrator assembly shown in FIG. 1. FIG. 2 is a view seen from above the configuration of the lower surface side of the vibrator assembly shown in FIG. 1. FIG. 4 is a diagram showing a lead row for a substrate A. FIG. 6 is a diagram showing a lead row for a substrate B. 5 is a view showing a lead row for a substrate C. FIG. FIG. 4 is a diagram showing a lead row for a substrate D. FIG. 5 is a diagram showing a lead row for a substrate E. FIG. 6 is a diagram showing a lead row for a substrate F. FIG. 6 is a diagram showing a lead row for a substrate G. FIG. 6 is a diagram showing a lead row for a substrate H. It is a horizontal sectional view of a probe incorporating a vibrator assembly. It is a vertical sectional view of a probe in which a vibrator assembly is incorporated.

Explanation of symbols

  10 2D array transducer, 12 backing, 14 spacer, 16 substrate row, 18 base layer, 20 lead row, 22 lead, 24 lead top row, 26 lead bottom row, 34 lead bottom sub-array, 102, 104 margin area, 200 substrate set.

Claims (9)

An array vibrator having a plurality of vibration elements;
A backing having a plurality of substrates arranged on the lower surface side of the array transducer and arranged in the X direction;
A pad array formed on the lower surface of the backing;
Including
Each of the substrates is formed with a lead array made up of a plurality of leads arranged in the Y direction, thereby forming a lead array made up of a plurality of lead arrays in the backing,
Each lead row has a lead lower end row that appears on the lower surface of the backing, thereby forming a lower end array of leads consisting of a plurality of lower lead rows on the lower surface of the backing,
For each lead lower end sub-array consisting of n (where n is an integer of 2 or more) lead lower end rows in the lead lower end array, a shift relationship is established in which the lead lower end positions are different from each other in the Y direction.
The pad array has a plurality of pads connected to the lower end array of leads and having a size straddling n substrates in the X direction.
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 1,
On the upper surface of the backing, a lead upper end array comprising a plurality of lead upper end rows corresponding to the plurality of lead rows is configured,
The minimum pitch in the X direction in the lead upper end array matches the basic pitch in the X direction in the array transducer,
The minimum pitch in the X direction in the lead lower end array corresponds to n times the basic pitch in the X direction in the array transducer.
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 2,
Each lead row has a form extending in the Y direction from the lead upper end row toward the lead lower end row,
The minimum pitch in the Y direction in the lead upper end array matches the basic pitch in the Y direction in the array transducer,
The minimum pitch in the Y direction in the lead lower end array is larger than the basic pitch in the Y direction in the array transducer,
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 3,
The backing has a rectangular parallelepiped shape,
On the upper surface of the backing, a margin region was formed as a region other than the lead upper end array,
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 1,
The ultrasonic transducer according to claim 1, wherein the array transducer is a sparse 2D array transducer. The ultrasonic probe according to claim 1,
The ultrasonic probe according to claim 1, wherein n is 2. The ultrasonic probe according to claim 1,
The ultrasonic probe is an intra-body cavity insertion type ultrasonic probe. In the backing for an ultrasonic probe provided on the lower surface side of the array transducer,
The backing contains a lead array consisting of a plurality of lead rows arranged in the X direction,
Each lead row is composed of a plurality of leads arranged in the Y direction,
The lead array has a lead upper end array composed of a plurality of lead upper end rows configured on the upper surface of the backing, and a lead lower end array composed of a plurality of lead lower end rows configured on the lower surface of the backing,
The lead lower end array is divided into a plurality of lead lower end sub-arrays arranged in the X direction,
Each of the lead lower end subarrays is composed of n (where n is an integer of 2 or more) lead lower end rows.
In each of the lead lower end sub-arrays, a shift relationship is established that is shifted from each other so that the lead lower end positions in the Y direction are not aligned between the n lead lower end rows.
This is a backing for an ultrasonic probe. The backing for an ultrasonic probe according to claim 8,
The backing has a plurality of substrates aligned at a first pitch in the X direction, and a lead row is formed on each substrate,
The second pitch as the minimum pitch in the X direction in the lead lower end array is a pitch n times the first pitch.
This is a backing for an ultrasonic probe.

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