JPH0556737B2 - - Google Patents
Info
- Publication number
- JPH0556737B2 JPH0556737B2 JP61218346A JP21834686A JPH0556737B2 JP H0556737 B2 JPH0556737 B2 JP H0556737B2 JP 61218346 A JP61218346 A JP 61218346A JP 21834686 A JP21834686 A JP 21834686A JP H0556737 B2 JPH0556737 B2 JP H0556737B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed board
- piezoelectric element
- matching layer
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 24
- 239000000523 sample Substances 0.000 claims description 20
- 239000006096 absorbing agent Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 description 9
- 238000005429 filling process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
〔概要〕
所定のパターンを有するフレキシブルプリント
板を圧電素子の一方の面（背面）に接合したる後
に音波吸収体を形成し、圧電素子の反対側（前
面）に金属箔を接合し、更に金属箔及びフレキシ
ブルプリント板を音波吸収体の側面に固定するよ
うに圧電素子の上に整合層を形成したる後、カツ
ターでフレキシブルプリント板のパターンに沿つ
て圧電素子を所定数に分割して振動子を構成する
ようにしたもので、高品質の製品を歩留まり良く
製造出来るようにした。[Detailed Description of the Invention] [Summary] After bonding a flexible printed board with a predetermined pattern to one side (back side) of a piezoelectric element, a sound wave absorber is formed, and a metal is bonded to the opposite side (front side) of the piezoelectric element. After bonding the foils and forming a matching layer on the piezoelectric element so as to fix the metal foil and flexible printed board to the sides of the sound wave absorber, use a cutter to position the piezoelectric element along the pattern of the flexible printed board. The vibrator is constructed by dividing it into several parts, allowing high-quality products to be manufactured at a high yield.
本発明は超音波診断装置に係り、特に超音波探
触子の製造方法に関する。
The present invention relates to an ultrasonic diagnostic apparatus, and particularly to a method for manufacturing an ultrasonic probe.
近来医療技術の進歩は目覚ましく、超音波診断
装置も被検者に苦痛や悪影響を与えずに手軽に確
度の高い検査が行えることから需要が高まつてい
る。 Medical technology has made remarkable progress in recent years, and the demand for ultrasonic diagnostic equipment is increasing because it can easily perform highly accurate tests without causing pain or adverse effects on patients.
又、超音波探触子の微細化される傾向にあり、
機械的強度の高い高品質のものを要望されてい
る。 In addition, there is a trend toward miniaturization of ultrasonic probes,
There is a demand for high quality products with high mechanical strength.
超音波診断装置は、超音波パルスをごく短時間
だけ体内に放射させ、超音波パルスが伝播する途
中で次々に反射する反射エコーを検出し、表示装
置に表示させ、表示されたパターンから組織内に
存在する異常の有無、及びその位置を診断するも
ので、超音波探触子を被検者に接触させて使用す
る。
Ultrasonic diagnostic equipment emits ultrasonic pulses into the body for a very short period of time, detects reflected echoes that are reflected one after another as the ultrasonic pulses propagate, and displays them on a display device. The ultrasound probe is used to diagnose the presence or absence of an abnormality in the body and its location, and is used by bringing an ultrasound probe into contact with the subject.
第２図斜視図に示す如く、超音波探触子（以下
探触子と称す）は、音波吸収体１の上に数10本乃
至数百本の棒状の振動子２を横方向に近接して配
列したもので、各振動子２の夫々には別々の導線
３が接続されており、隣り合う数本〜数十本の振
動子２を同時に駆動して、それら振動子群の前方
に超音波ビームを形成し、図示省略した電子スイ
ツチに依り同時使用する振動子群を順次切替えて
走査を行うようにしている。 As shown in the perspective view of FIG. 2, an ultrasonic probe (hereinafter referred to as a probe) has several tens to hundreds of rod-shaped transducers 2 placed horizontally close to each other on a sound wave absorber 1. A separate conducting wire 3 is connected to each vibrator 2, and several to dozens of adjacent vibrators 2 are simultaneously driven to generate an ultraviolet light in front of the group of vibrators. A sound wave beam is formed, and scanning is performed by sequentially switching the groups of transducers used simultaneously using an electronic switch (not shown).
振動子群の前面には、例えば金属粉入りエポキ
シ樹脂で作つた1/4波長の厚さの所謂1/4波長板４
が接着されており、更にその前面には例えばシリ
コンゴム等の音響レンズ５が接着されている。 In front of the transducer group, there is a so-called 1/4 wavelength plate 4 made of epoxy resin containing metal powder and having a thickness of 1/4 wavelength.
is adhered thereto, and an acoustic lens 5 made of, for example, silicone rubber is further adhered to the front surface thereof.
1/4波長板４は、超音波パルスを短くして距離
分解能を向上させると共に、探触子の感度を高く
するためのものである。 The quarter-wave plate 4 is used to shorten the ultrasonic pulse to improve distance resolution and to increase the sensitivity of the probe.
音響レンズ５は、超音波ビームを集束して断層
面（走査面）に直角方向の所謂横方向分解能を向
上させる為に用いられる。 The acoustic lens 5 is used to focus the ultrasound beam and improve the so-called lateral resolution in the direction perpendicular to the tomographic plane (scanning plane).
又、音波吸収体１は振動子２の背面に放射する
超音波を吸収して減衰するもので、一般にはエポ
キシ樹脂が用いられている。 The sound wave absorber 1 absorbs and attenuates the ultrasonic waves radiated to the back surface of the vibrator 2, and is generally made of epoxy resin.
以下に第３図斜視図を参照して超音波探触子の
製造方法を説明する。 A method of manufacturing an ultrasonic probe will be described below with reference to the perspective view of FIG.
先ず圧電素子６の一方の面（背面）に圧電素子
を分割して形成する振動子のリード（導体）９ａ
を構成するパターンを設けたフレキシブルプリン
ト板９を、半田付け或いは導電ペーストで接合
し、フレキシブルプリント板９と共に圧電素子６
の背面に音波吸収体１を形成する。 First, a vibrator lead (conductor) 9a is formed by dividing the piezoelectric element on one side (back side) of the piezoelectric element 6.
A flexible printed board 9 provided with a pattern constituting the piezoelectric element 6 is joined together with the flexible printed board 9 by soldering or with conductive paste.
A sound wave absorber 1 is formed on the back surface of the device.
次に、圧電素子６のフレキシブルプリント板９
が接合されている反対側（前面）の所定位置（両
側）に銀等の材料から成る金属箔８を半田付け或
いは導電ペーストで電気的導通がとれるように接
続する。そして、更に金属箔８を取付けた圧電素
子６の上に1/4波帳板４をエポキシ樹脂系の接着
剤で接着する。 Next, the flexible printed board 9 of the piezoelectric element 6
A metal foil 8 made of a material such as silver is connected to a predetermined position (both sides) on the opposite side (front side) to which the metal foils 8 are bonded by soldering or conductive paste so as to establish electrical continuity. Then, on top of the piezoelectric element 6 to which the metal foil 8 is attached, the 1/4 wave board 4 is bonded using an epoxy resin adhesive.
然る後、1/4波長板４及び金属箔８と共に圧電
素子６をカツター（50μｍ程度の細い切溝で加工
物をカツトすることが出来る例えばダイシングソ
ウ：Diceing Saw）を使用して、フレキシブル
プリント板９のパターンに沿つて所定数に分割し
て振動子２を形成し探触子を完成する。 After that, the piezoelectric element 6 together with the 1/4 wavelength plate 4 and the metal foil 8 is flexible printed using a cutter (for example, a dicing saw that can cut the workpiece with a thin groove of about 50 μm). The transducer 2 is formed by dividing the plate 9 into a predetermined number of pieces along the pattern to complete the probe.
斯かる製造方法に依つて、振動子２と共に各振
動子のリード９ａを一度に形成することが出来
る。 By using such a manufacturing method, the leads 9a of each vibrator can be formed together with the vibrator 2 at the same time.
尚、図示省略したが音響レンズは必要に応じて
１／４波長板４の上に接着する。 Although not shown, the acoustic lens is bonded onto the quarter-wave plate 4 if necessary.
以上説明したようにして探触子は作られるが、
カツターに依る圧電素子の分割の際に、金属箔が
振動して第４図の斜視図に示す如く1/4波長板が
剥離し易いと言う問題点があつた。
The probe is made as explained above, but
When dividing the piezoelectric element using a cutter, there was a problem in that the metal foil vibrated and the 1/4 wavelength plate was likely to peel off, as shown in the perspective view of FIG.
第１図ａは本発明の超音波探触子の製造方法を
説明する斜視図である。
FIG. 1a is a perspective view illustrating a method of manufacturing an ultrasound probe according to the present invention.
本発明に於いては、重ね合わせ工程の後に音波
吸収体１と、フレキシブルプリント板９との間
〓、および、該フレキシブルプリント板９と、金
属箔８との間〓を整合層７と同じ材質によつて充
填行う充填工程が行われるように、また、フレキ
シブルプリント板９と、金属箔８との所定箇所に
貫通孔１０を設けることで積層工程を行い、該積
層工程によつて音波吸収体１と、フレキシブルプ
リント板９との間〓、および、該フレキシブルプ
リント板９と、金属箔８との間〓を整合層７と同
じ材質によつて充填を行う充填工程が同時に行わ
れるように構成したものである。 In the present invention, after the overlapping process, the space between the sound wave absorber 1 and the flexible printed board 9 and the space between the flexible printed board 9 and the metal foil 8 are made of the same material as the matching layer 7. In order to carry out the filling process using 1 and the flexible printed board 9 and between the flexible printed board 9 and the metal foil 8 with the same material as the matching layer 7. This is what I did.
音波吸収体１と、フレキシブルプリント板９と
の間〓、および、フレキシブルプリント板９と、
金属箔８との間〓を整合層７と同じ材質によつて
充填を行う充填工程を行うことで、カツト工程に
際して、フレキシブルプリント板９、および、金
属箔８とが振動することのないようにすることが
行える。
Between the sound wave absorber 1 and the flexible printed board 9, and the flexible printed board 9,
By performing a filling process in which the space between the metal foil 8 and the matching layer 7 is filled with the same material, the flexible printed board 9 and the metal foil 8 can be prevented from vibrating during the cutting process. I can do things.
したがつて、前述のような整合層７の剥離が防
止され、品質の向上が図れることになる。 Therefore, peeling of the matching layer 7 as described above is prevented, and quality can be improved.
第１図ａ及びｂは本発明の一実施例である。全
図を通じて同一部分には同一符号を付して示し
た。
Figures 1a and 1b show an embodiment of the invention. Identical parts are designated by the same reference numerals throughout the figures.
第１図ａの斜視図に示す如く本発明に於いて
は、一面の背面側に振動子２のリード９ａとなる
パターンを有するフレキシブルプリント板９を接
続し、他面の表面側に金属箔８を接続した圧電素
子６を音波吸収体１に重ね合わせ、フレキシブル
プリント板９を音波吸収体１の所定面に固着させ
る重ね合わせ工程を行い、重ね合わせ工程後は、
音波吸収体１の側壁面と、フレキシブルプリント
板９との〓間、および、フレキシブルプリント板
９と、金属箔８との〓間に充填材を充填し、互い
を固着させる充填工程を行い、最後に、金属箔８
の上層には整合層７が積層されるよう積層工程を
行う。 In the present invention, as shown in the perspective view of FIG. The piezoelectric element 6 to which the
A filler is filled between the side wall surface of the sound wave absorber 1 and the flexible printed board 9 and between the flexible printed board 9 and the metal foil 8, and a filling process is performed to fix them to each other. , metal foil 8
A lamination process is performed so that the matching layer 7 is laminated on the upper layer.
整合層７を形成する積層工程では、図示省略し
た型枠内に圧電素子６の金属箔８を取付けた面が
上向きになるように挿入し、例えば粘液状の金属
粉入りのエポキシ樹脂を型枠内に注入し硬化させ
た後、整合層７の圧さ（矢印Ｔ）が所定寸法内に
入るように研磨することが行われる。 In the lamination step of forming the matching layer 7, the piezoelectric element 6 is inserted into a mold (not shown) with the surface on which the metal foil 8 is attached facing upward, and an epoxy resin containing, for example, a slimy metal powder is placed inside the mold. After injecting and hardening the matching layer 7, polishing is performed so that the pressure (arrow T) of the matching layer 7 is within a predetermined dimension.
この場合、積層工程に際して、第１図のｂに示
すように、フレキシブルプリント板９には貫通孔
１０ｂを設け、金属箔８には貫通孔１０ａを設け
るようにすると整合層７の積層時に、フレキシブ
ルプリント板９との〓間、および、フレキシブル
プリント板９と、金属箔８との〓間に整合層７を
積層する材料が貫通孔１０ａ，１０ｂによつて流
れ込み、それぞれの〓間が充填され、互いが固着
されることになり、整合層７の積層工程によつて
同時に前述の充填工程が行われることになる。 In this case, during the lamination process, as shown in FIG. The material for laminating the matching layer 7 between the printed board 9 and between the flexible printed board 9 and the metal foil 8 flows through the through holes 10a and 10b, filling the gaps between each. They will be fixed to each other, and the above-mentioned filling process will be performed at the same time as the matching layer 7 is laminated.
したがつて、貫通孔１０ａ，１０ｂを設けた場
合は、前述の重ね合わせ工程後、充填工程を行う
必要がない。 Therefore, when the through holes 10a and 10b are provided, there is no need to perform a filling process after the above-mentioned overlapping process.
然る後、カツターでフレキシブルプリント板９
のパターンに沿つて整合層７及び金属箔８と共に
圧電素子６を所定数に分割し、振動子２を構成す
るようにしたものである。 After that, cut out the flexible printed board 9 with a cutter.
The piezoelectric element 6 is divided into a predetermined number along with the matching layer 7 and the metal foil 8 along the pattern to form the vibrator 2.
斯くの如く、金属箔８及びフレキシブルプリン
ト板９を固定することで、カツターに依る切断時
に金属箔８やフレキシブルプリント板９の振動を
抑制して整合層７を剥離するようなことが無くな
る。 By fixing the metal foil 8 and the flexible printed board 9 in this manner, the vibrations of the metal foil 8 and the flexible printed board 9 are suppressed during cutting with a cutter, thereby eliminating the possibility of peeling off the matching layer 7.
尚、図示層略したが音響レンズは必要に応じて
整合層７の上に接着される。 Although the illustrated layers are omitted, an acoustic lens is bonded onto the matching layer 7 as necessary.
以上説明したように、本発明の超音波探触子の
製造方法で超音波探触子を製造することに依り、
高品質の製品が保留まり良く製造出来る等経済上
及び産業上に多大の効果を奏する。
As explained above, by manufacturing an ultrasound probe using the method of manufacturing an ultrasound probe of the present invention,
This has great economic and industrial effects, such as the ability to retain and manufacture high-quality products.
第１図ａ及びｂは本発明の超音波探触子の製造
方法を説明する斜視図、第２図は超音波探触子を
示す斜視図、第３図は従来の超音波探触子の製造
方法を説明する斜視図、第４図はカツトに依り1/
４波長板が剥離した状態を示す斜視図である。
図に於いて、１は音波吸収体、２は振動子、３
は導体、４は1/4波長板、５は音響レンズ、６は
圧電素子、７は整合層、８は金属箔、９はフレキ
シブルプリント板、１０は貫通孔である。
Figures 1a and b are perspective views illustrating the method of manufacturing an ultrasound probe of the present invention, Figure 2 is a perspective view showing an ultrasound probe, and Figure 3 is a perspective view of a conventional ultrasound probe. A perspective view explaining the manufacturing method, Fig. 4 is 1/1 depending on the cut.
FIG. 3 is a perspective view showing a state in which a four-wavelength plate is peeled off. In the figure, 1 is a sound wave absorber, 2 is a vibrator, and 3
4 is a conductor, 4 is a quarter wavelength plate, 5 is an acoustic lens, 6 is a piezoelectric element, 7 is a matching layer, 8 is a metal foil, 9 is a flexible printed board, and 10 is a through hole.
Claims (1)
プリント板９を音波吸収体１の所定面に重ね合わ
せる重ね合わせ工程と、該圧電素子６の他面に固
着された金属箔８の上層に整合層７を積層する積
層工程とを行い、最後に、該圧電素子６と、該整
合層７とを所定幅にカツトするカツト工程を行う
ことで形成される超音波探触子の製造方法であつ
て、 前記重ね合わせ工程の後に前記音波吸収体１
と、前記フレキシブルプリント板９との〓間、お
よび、該フレキシブルプリント板９と、前記金属
箔８との〓間を前記整合層７と同じ材質によつて
充填を行う充填工程が行われることを特徴とする
超音波探触子の製造方法。 ２ 圧電素子６の一面に固着されたフレキシブル
プリント板９を音波吸収体１の所定面に重ね合わ
せる重ね合わせ工程と、該圧電素子６の他面に固
着された金属箔８の上層に整合層７を積層する積
層工程とを行い、最後に、該圧電素子６と、該整
合層７とを所定幅にカツトするカツト工程を行う
ことで形成される超音波探触子の製造方法であつ
て、 前記フレキシブルプリント板９と、前記金属箔
８との所定箇所に貫通孔１０を設けることで前記
積層工程を行い、該積層工程によつて前記音波吸
収体１と、前記フレキシブルプリント板９との〓
間、および、該フレキシブルプリント板９と、前
記金属箔８との〓間に前記整合層７と同じ材質に
よつて充填を行う充填工程が同時に行われること
を特徴とする超音波探触子の製造方法。[Claims] 1. An overlapping step of overlapping a flexible printed board 9 fixed to one surface of the piezoelectric element 6 onto a predetermined surface of the sound wave absorber 1, and a metal foil 8 fixed to the other surface of the piezoelectric element 6. An ultrasonic probe is formed by performing a lamination step of laminating a matching layer 7 on the upper layer, and finally a cutting step of cutting the piezoelectric element 6 and the matching layer 7 to a predetermined width. In the manufacturing method, after the superposition step, the sound wave absorber 1 is
and the flexible printed board 9 and between the flexible printed board 9 and the metal foil 8 are filled with the same material as the matching layer 7. A manufacturing method for a featured ultrasonic probe. 2. An overlapping step of overlapping the flexible printed board 9 fixed to one surface of the piezoelectric element 6 on a predetermined surface of the sound wave absorber 1, and a matching layer 7 on the upper layer of the metal foil 8 fixed to the other surface of the piezoelectric element 6. A method for manufacturing an ultrasonic probe formed by performing a laminating step of laminating the piezoelectric element 6 and the matching layer 7, and finally a cutting step of cutting the piezoelectric element 6 and the matching layer 7 into a predetermined width, the method comprising: The lamination process is performed by providing through holes 10 at predetermined locations of the flexible printed board 9 and the metal foil 8, and the lamination process allows the sound wave absorber 1 and the flexible printed board 9 to be bonded.
An ultrasonic probe characterized in that a filling step of filling the space between the flexible printed board 9 and the metal foil 8 with the same material as the matching layer 7 is performed at the same time. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21834686A JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21834686A JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373939A JPS6373939A (en) | 1988-04-04 |
| JPH0556737B2 true JPH0556737B2 (en) | 1993-08-20 |
Family
ID=16718431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21834686A Granted JPS6373939A (en) | 1986-09-17 | 1986-09-17 | Production of ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373939A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1915753B1 (en) * | 2005-08-08 | 2019-04-10 | Koninklijke Philips N.V. | Wide-bandwidth matrix transducer with polyethylene third matching layer |
| JP2011163798A (en) * | 2010-02-05 | 2011-08-25 | Ryoden Shonan Electronics Kk | Bolt inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62231629A (en) * | 1986-04-01 | 1987-10-12 | 松下電器産業株式会社 | Production of ultrasonic probe |
-
1986
- 1986-09-17 JP JP21834686A patent/JPS6373939A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62231629A (en) * | 1986-04-01 | 1987-10-12 | 松下電器産業株式会社 | Production of ultrasonic probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6373939A (en) | 1988-04-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |