JP2009147365A - Flexible printed board, ultrasonic probe, and method for manufacturing ultrasonic probe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board having a predetermined space between a plurality of wiring patterns by cutting the flexible printed circuit board having a plurality of wiring patterns. <P>SOLUTION: A plurality of wiring patterns 30 are formed extending on the surface of a base insulating film 20. Each of the plurality of wiring patterns 30 is formed having a portion in which each space is formed decreased along the extending direction of the base film 20. The base film has a mark indicating the length along the extension of the plurality of wiring patterns 30. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a flexible printed board, an ultrasonic probe, and a method for manufacturing an ultrasonic probe.

  A flexible printed circuit board (hereinafter also referred to as an FPC) is used as an internal wiring of a device or a component mounting substrate as electronic devices become smaller and lighter and thinner. FPC is a complex circuit formed on a flexible electrical insulating film that can be bent, stacked, folded, wound, twisted, etc., enabling effective use of space and 3D wiring, etc. Used in car stereos, personal computers and printer heads.

  FPC is also used in the field of medical equipment. For example, in an ultrasonic probe that transmits and receives ultrasonic waves in an ultrasonic diagnostic apparatus, a wiring pattern in an FPC is connected to an ultrasonic transducer. By using the FPC, the space can be saved as described above, and three-dimensional wiring becomes possible. In particular, it is suitable for use in a curved array in which ultrasonic transducers are arranged on a curved surface.

  Here, the proper frequency of the ultrasonic waves used in the ultrasonic diagnostic apparatus differs depending on the diagnostic part of the subject. In general, when the size of the ultrasonic transducer is reduced, the frequency of ultrasonic waves that can be transmitted is increased. Therefore, the frequency of the ultrasonic wave transmitted from the ultrasonic transducer differs depending on the width of the ultrasonic transducer. Therefore, ultrasonic transducers with various widths are required in the ultrasonic probe. For example, the size of one ultrasonic transducer is about 0.2 to 0.6 mm (see, for example, Patent Document 1).

  A plurality of wiring patterns in the FPC used for the ultrasonic probe are formed in parallel. Therefore, it is necessary to form a plurality of wiring patterns on the base film in accordance with the intervals of the plurality of ultrasonic transducers (see, for example, Patent Document 2).

JP 2002-330963 A JP 2006-20297 A

  When an FPC is used for the ultrasonic probe, a plurality of wiring patterns in the FPC are connected to a plurality of ultrasonic transducers. Therefore, it is necessary to form a plurality of wiring patterns on the base film in accordance with the widths of the plurality of ultrasonic transducers. However, it takes time and effort to manufacture the FPC in accordance with the width of the ultrasonic probe.

  Accordingly, an object of the present invention is to cut a flexible printed circuit board having a plurality of wiring patterns, so that the interval between the plurality of wiring patterns becomes a desired distance, and an ultrasonic probe using the flexible printed circuit board. An object of the present invention is to provide a child manufacturing method and an ultrasonic probe manufactured by the manufacturing method.

  In order to achieve the above object, the flexible printed circuit board of the present invention is a flexible printed circuit board formed such that a plurality of wiring patterns extend on the surface of an electrically insulating substrate, each of the plurality of wiring patterns. Includes a portion formed such that a distance between each other is reduced along a direction in which the substrate extends.

  In order to achieve the above object, an ultrasonic probe manufacturing method according to the present invention includes a plurality of arranged ultrasonic transducers, and a plurality of ultrasonic transducers connected to the surface of an electrically insulating substrate. And a flexible printed circuit board having a plurality of wiring patterns arranged at intervals along an arrangement direction of the plurality of ultrasonic transducers, wherein the flexible printed circuit board The flexible printed circuit board used in the cutting step has the substrate extending in a direction different from the arrangement direction of the ultrasonic transducers, and a plurality of intervals between the wiring patterns. Includes a portion in which the plurality of wiring patterns extend so as to narrow along the extending direction of the substrate, and in the cutting step, the plurality of ultrasonic vibrations Sequence position and the positions of the plurality of the wiring pattern in the flexible printed circuit board so as to correspond to cut the flexible printed circuit board.

  In order to achieve the above object, an ultrasonic probe according to the present invention includes a plurality of ultrasonic transducers arranged and a plurality of ultrasonic transducers connected to the surface of an electrically insulating substrate. The wiring pattern is an ultrasonic probe having a flexible printed circuit board arranged at intervals along an arrangement direction of a plurality of ultrasonic transducers, wherein the flexible printed circuit board includes the substrate A portion that extends in a direction different from the arrangement direction of the ultrasonic transducers, and in which the plurality of wiring patterns extend such that intervals between the plurality of wiring patterns narrow along the extending direction of the substrate And cutting the flexible printed circuit board so that the arrangement positions of the plurality of ultrasonic transducers correspond to the positions of the plurality of wiring patterns on the flexible printed circuit board. It is produced.

  According to the present invention, by cutting a flexible printed circuit board having a plurality of wiring patterns, a flexible printed circuit board having a desired interval between the plurality of wiring patterns, and an ultrasonic probe using the flexible printed circuit board A manufacturing method and an ultrasonic probe manufactured by the manufacturing method can be provided.

FIG. 1 is a schematic view of an ultrasonic probe manufactured using a flexible printed circuit board according to this embodiment of the present invention. FIG. 2 is a diagram showing a wiring pattern shape of the flexible printed circuit board according to the present invention, and FIG. 2A is a diagram showing the flexible printed circuit board according to the first embodiment of the present invention. b) is a diagram showing a flexible printed circuit board according to a second embodiment of the present invention. FIG. 3 is a flowchart of a method for manufacturing an ultrasonic probe using the flexible printed circuit board according to this embodiment of the present invention. FIG. 4 is a view showing marks formed on the surface of the flexible printed circuit board along the extending direction of the flexible printed circuit board according to the present invention, and FIG. 4A is a third embodiment according to the present invention. FIG. 4B is a diagram showing a scale indicating the length of the flexible printed circuit board formed along the extending direction of the flexible printed circuit board, and FIG. 4B is a measurement according to the fourth embodiment of the present invention. It is a figure which shows the wiring pattern for grasping | ascertaining the length of the extending direction of a flexible printed circuit board from resistance value.

  Hereinafter, the present embodiment according to the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a schematic view of an ultrasonic probe manufactured using a flexible printed circuit board according to this embodiment of the present invention. FIG. 1A is a front view, and FIG. 1B is a perspective view.
FIG. 2 is a diagram showing a wiring pattern in the flexible printed circuit board according to the present invention. Fig.2 (a) is a figure which shows the flexible printed circuit board in 1st Embodiment concerning this invention. A and B in FIG. 2A are intervals between the plurality of wiring patterns 30. The position C is a position where the positions of the plurality of wiring patterns 30 coincide with the arrangement positions of the plurality of ultrasonic transducers 300.

  Hereinafter, each component will be sequentially described.

  As shown in FIG. 1A, the ultrasonic probe 1 according to the first embodiment of the present invention includes an FPC 10, a backing material 100, a solid electrode 200, an ultrasonic transducer 300, and a matching layer. 400, an acoustic lens 500, and a cover (not shown). Further, as shown in FIG. 2A, the FPC 10 includes a base film 20 and a wiring pattern 30.

The base film 20 is an electrically insulating film that serves as a base for the FPC 10.
The base film 20 is formed of, for example, a flexible electrical insulating film such as polyester, polyvinyl chloride, polyamide, or polyimide. The base film 20 is provided with an adhesive insulating layer having flexibility such as epoxy, urethane, polyacrylonitrile, polyester, etc., and a wiring pattern is formed on the adhesive insulating layer with a metal having high electrical conductivity such as copper or aluminum. 30 is formed. A flexible electrical insulating film is laminated thereon in order to prevent a short circuit between the wiring patterns 30 or a short circuit between the wiring pattern 30 and another.

The wiring pattern 30 is formed so as to extend on the surface of the base film 20. The wiring pattern 30 is formed of a metal having high electrical conductivity such as copper or aluminum.
Further, the wiring pattern 30 is formed on the base film by, for example, a subtracting method or an additive method.
The subtracting method is a method in which a metal foil such as copper or aluminum is adhered to the surface of the base film 20 with an adhesive, leaving the wiring pattern 30 and removing unnecessary portions. The additive method is a method of forming the wiring pattern 30 on the surface of the base film 20.

  As shown in FIG. 2A, in the wiring pattern 30 according to the first embodiment of the present invention, the interval between the plurality of wiring patterns 30 is continuously narrowed along the extending direction of the FPC 10. Is formed. For example, as shown in FIG. 2 (a), the interval A becomes narrower continuously and becomes the interval B. Therefore, by cutting the FPC 10 at the position C where the arrangement position of the plurality of ultrasonic transducers 300 and the position of the plurality of wiring patterns 30 in the FPC 10 coincide, the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 are plural. The FPC 10 that matches the array position of the ultrasonic transducers 300 can be obtained.

The backing material 100 is provided on the back surface of the solid electrode 200. The backing material 100 suppresses free vibration of the ultrasonic transducer 300 after transmitting the ultrasonic wave by vibrating the ultrasonic transducer 300. Thereby, the pulse width of an ultrasonic wave can be shortened. In addition, the backing material 100 suppresses unnecessary propagation of ultrasonic waves to the rear of the backing material 100.
As the backing material 100, a material having a large ultrasonic attenuation is used, and examples thereof include a material obtained by adding a tungsten powder to an epoxy resin or rubber. Moreover, the acoustic impedance of the backing material 100 in the present invention is preferably 2 × 10 ⁵ g / (cm ² · sec) to 10 × 10 ⁵ g / (cm ² · sec).

  The solid electrode 200 is provided over the entire surface between the ultrasonic transducer 300 and the backing material 100. The solid electrode 200 is formed by a method such as plating, sputtering, or vapor deposition. The solid electrode 200 is made of a metal having high electrical conductivity such as gold, silver, or copper.

  The ultrasonic transducer 300 is made of, for example, a piezoelectric material such as PZT (lead zirconate titanate) ceramics. By applying a voltage to the ultrasonic transducer 300 and causing it to vibrate, ultrasonic waves are transmitted from the ultrasonic transducer 300 to a subject (not shown), and reflected ultrasonic waves are received.

The matching layer 400 has an intermediate acoustic impedance between the subject and the ultrasonic transducer 300, and suppresses reflection of ultrasonic waves due to a difference in acoustic impedance between the subject and the ultrasonic transducer 300.
The acoustic lens 500 sets the focal point of the ultrasonic wave transmitted to the subject using the refraction of the ultrasonic wave.

  As shown in FIG. 1, the ultrasound probe 1 has a solid electrode 200 stacked on the front surface (a surface where the FPC 10 does not extend) of the backing material 100 sandwiching the FPC 10. The ultrasonic transducer 300, the matching layer 400, and the acoustic lens 500 are sequentially laminated on the front surface of the solid electrode 200 (the surface not in contact with the backing material 100).

  Below, the manufacturing method of the ultrasonic probe 1 in 1st Embodiment concerning this invention is demonstrated.

  FIG. 3 is a flowchart of a method for manufacturing an ultrasonic probe using the flexible printed circuit board according to this embodiment of the present invention.

  First, the FPC 10 is sandwiched between the backing materials 100 (ST10).

  The FPC 10 is sandwiched between the backing material 100 so as to include the positions of the wiring patterns 30 where the arrangement positions of the plurality of ultrasonic transducers 300 and the positions of the plurality of wiring patterns 30 in the FPC 10 coincide. A non-conductive adhesive is used for bonding the backing material 100 and the FPC 10.

  Next, the FPC 10 and the backing material 100 are cut (ST20).

  The FPC 10 and the backing material 100 are cut so that the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 coincide with the arrangement positions of the plurality of ultrasonic transducers 300. When the FPC 10 is sandwiched between the backing material 100 and then cut, the backing material 100 and the FPC 10 can be easily flushed with each other on the cut surface. By being flush, the solid electrode 200 can be easily formed in step ST30.

  When the FPC 10 and the backing material 100 are cut, a plurality of wirings at a position C (see FIG. 2A) where the positions of the plurality of wiring patterns 30 and the arrangement positions of the plurality of ultrasonic transducers 300 are matched in advance. The interval of each pattern 30 is measured. Then, while measuring the intervals between the plurality of wiring patterns 30 on the end face of the FPC 10, the FPC 10 is cut so that the intervals between the plurality of wiring patterns 30 become the intervals between the plurality of wiring patterns 30 at the position C.

  In the method for manufacturing the ultrasonic probe 1 according to the first embodiment of the present invention, the order of step ST10 and step ST20 may be reversed. In other words, the FPC 10 may be sandwiched between the backing materials 100 after the FPC 10 is cut so that the respective intervals between the plurality of wiring patterns 30 become desired intervals.

  Next, the solid electrode 200 is formed on the backing material 100 (ST30).

  A solid electrode 200 is formed on the front surface of the backing material 100 (the FPC 10 and the backing material 100 are flush with each other). The solid electrode 200 is provided on the entire surface of the backing material by a method such as plating, sputtering, or vapor deposition. In step ST20, since the backing material and the FPC 10 are flush with each other, the solid electrode 200 can be easily formed.

  Next, the ultrasonic transducer 300 and the like are stacked on the solid electrode 200 (ST40).

  The ultrasonic transducer 300, the matching layer 400, and the acoustic lens 500 are sequentially laminated on the front surface of the solid electrode 200 (the surface not bonded to the backing material 100). A conductive adhesive is used for bonding the solid electrode 200 and the ultrasonic transducer 300. A non-conductive adhesive is used for bonding the ultrasonic transducer 300 and the matching layer 400 and bonding the matching layer 400 and the acoustic lens 500.

  Next, the stacked ones are diced (ST50).

  The layers laminated in step ST40 are diced by a dicing apparatus so that the ultrasonic transducer 300 has a desired width. The dicing is performed to a depth at which the solid electrode 200 is reliably separated.

  As described above, in the present embodiment, first, the FPC 10 is sandwiched between the backing material 100 using an adhesive. Then, the FPC 10 sandwiched between the backing material 100 is cut so that the intervals between the plurality of wiring patterns 30 are the desired intervals. Then, the solid electrode 200 is formed on the front surface of the backing material 100 (the FPC 10 and the backing material 100 are flush with each other) by a method such as sputtering. And the ultrasonic transducer | vibrator 300, the matching layer 400, and the acoustic lens 500 are laminated | stacked in order on the front surface (surface which is not joined to the backing material 100) of the solid electrode 200 using an adhesive agent. Then, the laminated ones are diced by a dicing device so that the ultrasonic transducer 300 has a desired width.

  By using the FPC 10 according to the first embodiment of the present invention through the above steps, a plurality of wiring patterns 30 are formed on the base film 20 in accordance with the width of the ultrasonic transducer 300 in the ultrasonic probe 1 to be manufactured. Even if the FPC 10 is not formed, the FPC 10 is cut at a position C where the arrangement position of the plurality of ultrasonic transducers 300 and the position of the plurality of wiring patterns 30 in the FPC 10 coincide with each other. Since the FPC 10 whose position coincides with the arrangement position of the plurality of ultrasonic transducers 300 can be obtained, the ultrasonic probe 1 can be manufactured efficiently while reducing costs.

<Second Embodiment>
FIG.2 (b) is a figure which shows the flexible printed circuit board in 2nd Embodiment concerning this invention. A and B in FIG. 2B are intervals between the plurality of wiring patterns 30. The position C is a position where the positions of the plurality of wiring patterns 30 coincide with the arrangement positions of the plurality of ultrasonic transducers 300. D is a portion where the intervals between the plurality of wiring patterns 30 do not change. The second embodiment is the same as the first embodiment except for the shape of the plurality of wiring patterns 30 in the FPC 10. Therefore, description is abbreviate | omitted about the location which overlaps.

  The FPC 10 according to the second embodiment of the present invention will be described below with reference to the drawings.

  As shown in FIG. 2B, in the plurality of wiring patterns 30 in the second embodiment according to the present invention, the intervals between the plurality of wiring patterns 30 are gradually reduced along the extending direction of the FPC 10. It is formed as follows. For example, as shown in FIG. 2 (b), the interval A becomes narrower in steps and becomes the interval B. Therefore, by cutting the FPC 10 at the position C where the arrangement position of the plurality of ultrasonic transducers 300 and the position of the plurality of wiring patterns 30 in the FPC 10 coincide, the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 are plural. The FPC 10 that matches the array position of the ultrasonic transducers 300 can be obtained.

  Below, the manufacturing method of the ultrasonic probe 1 in 2nd Embodiment concerning this invention is demonstrated. The manufacturing method of the ultrasound probe 1 in the second embodiment is the same as that in the first embodiment except for step ST20 for cutting the FPC 10. Therefore, description is abbreviate | omitted about the location which overlaps.

  The FPC 10 and the backing material 100 are cut (ST20).

  The FPC 10 and the backing material 100 are cut so that the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 coincide with the arrangement positions of the plurality of ultrasonic transducers 300. When the FPC 10 is sandwiched between the backing material 100 and then cut, the backing material 100 and the FPC 10 can be easily flushed with each other on the cut surface.

  When the FPC 10 and the backing material 100 are cut, the intervals between the plurality of wiring patterns 30 at the position C where the positions of the plurality of wiring patterns 30 coincide with the arrangement positions of the plurality of ultrasonic transducers 300 are measured in advance. . Then, while measuring the intervals between the plurality of wiring patterns 30 on the end face of the FPC 10, the FPC 10 is cut so that the intervals between the plurality of wiring patterns 30 become the intervals between the plurality of wiring patterns 30 at the position C.

  Further, by providing the intervals of the plurality of frequently used wiring patterns 30 in the portion D where the intervals of the plurality of wiring patterns 30 in FIG. 2B do not change, fine adjustment is performed to obtain a desired interval. Therefore, a desired interval can be easily obtained.

  As described above, by using the FPC 10 according to the second embodiment of the present invention, the base is adjusted in accordance with the width of the ultrasonic transducer 300 in the ultrasonic probe 1 to be manufactured, as in the first embodiment. Even if the plurality of wiring patterns 30 are not formed on the film 20, the FPC 10 is cut at the position C where the arrangement positions of the plurality of ultrasonic transducers 300 coincide with the positions of the plurality of wiring patterns 30 in the FPC 10. Since the FPC 10 can be obtained in which the positions of the plurality of wiring patterns 30 on the end face coincide with the arrangement positions of the plurality of ultrasonic transducers 300, the ultrasonic probe 1 can be manufactured efficiently while reducing costs. .

<Third Embodiment>
FIG. 4 is a diagram showing marks formed on the surface of the flexible printed circuit board along the extending direction of the flexible printed circuit board according to the present invention. The mark is, for example, a scale indicating the length of the FPC 10 in the extending direction, a number indicating the interval between the plurality of wiring patterns 30, and a resistance value for determining the length of the FPC 10 in the extending direction. Wiring patterns.

  Fig.4 (a) is a figure which shows the scale which shows the length of the flexible printed circuit board formed along the extension direction of the flexible printed circuit board in 3rd Embodiment concerning this invention. A position C in FIG. 4A is a position where the positions of the plurality of wiring patterns 30 coincide with the arrangement positions of the plurality of ultrasonic transducers 300.

  As shown in FIG. 4A, the FPC 10 in the third embodiment includes a base film 20, a wiring pattern 30, and a scale 50. In the third embodiment, the configuration other than the scale 50 formed on the FPC 10 is the same as that of the first embodiment. Therefore, description is abbreviate | omitted about the location which overlaps.

  The FPC 10 according to the third embodiment of the present invention will be described below with reference to the drawings.

  The scale 50 is formed at the surface end of the FPC 10. The scale 50 represents the length of the FPC 10 in the extending direction. Further, the length in the extending direction of the FPC 10 corresponds to the interval between the plurality of wiring patterns 30. Therefore, by cutting the FPC 10 based on the scale 50, it is possible to obtain the FPC 10 in which the intervals between the plurality of wiring patterns 30 become desired intervals.

  Hereinafter, a method for manufacturing the ultrasonic probe 1 according to the third embodiment of the present invention will be described. The manufacturing method of the ultrasound probe 1 in the third embodiment is the same as that in the first embodiment except for step ST20 in which the FPC 10 is cut. Therefore, description is abbreviate | omitted about the location which overlaps.

  The FPC 10 and the backing material 100 are cut (ST20).

  The FPC 10 and the backing material 100 are cut so that the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 coincide with the arrangement positions of the plurality of ultrasonic transducers 300. When the FPC 10 is sandwiched between the backing material 100 and then cut, the backing material 100 and the FPC 10 can be easily flushed with each other on the cut surface.

  When cutting the FPC 10 and the backing material 100, the FPC 10 may be cut while measuring the intervals between the plurality of wiring patterns 30 on the end face of the FPC 10, but even if it is difficult to measure due to the effect of the backing material 100, the FPC 10 The FPC 10 can be cut based on the scale formed on the surface end portion of the FPC 10 along the extending direction. Here, the length in the extending direction of the FPC 10 corresponds to the interval between the plurality of wiring patterns 30. Therefore, for example, a correspondence table between the intervals of the plurality of wiring patterns 30 and the scale 50 is created in advance. Then, the value of the scale 50 corresponding to the interval of the desired wiring pattern 30 is read from the correspondence table, and the FPC 10 is cut at the position of the value read from the correspondence table on the scale 50, whereby a plurality of values shown in FIG. The FPC 10 can be cut at a position C where the arrangement position of the ultrasonic transducers 300 coincides with the positions of the plurality of wiring patterns 30 in the FPC 10.

  As described above, by using the FPC 10 according to the third embodiment of the present invention, the base is set in accordance with the width of the ultrasonic transducer 300 in the ultrasonic probe 1 to be manufactured, as in the first embodiment. Even if the plurality of wiring patterns 30 are not formed on the film 20, the ultrasonic probe 1 can be manufactured efficiently while reducing costs.

<Fourth Embodiment>
FIG. 4B is a diagram showing a wiring pattern for grasping the length in the extending direction of the flexible printed circuit board from the measured resistance value in the fourth embodiment according to the present invention. C in FIG. 4B is a position where the positions of the plurality of wiring patterns 30 coincide with the arrangement positions of the plurality of ultrasonic transducers 300.

  As shown in FIG. 4B, the FPC 10 according to the fourth embodiment includes a base film 20, a wiring pattern 30, and a resistance value measuring wiring pattern 60. The configuration of the fourth embodiment is the same as that of the second embodiment except for the resistance value measurement wiring pattern 60. Therefore, description is abbreviate | omitted about the location which overlaps.

The resistance value measurement wiring pattern 60 is formed so as to extend on the surface of the FPC 10. The resistance value measurement wiring pattern 60 is the same as the wiring pattern 30 in the material used and the formation method.
Here, the resistance value R (Ω) is generally represented by the following mathematical formula (1). ρ is a low efficiency (Ω · m), l is a length (m), and S is a cross-sectional area (m ² ).

(Equation 1)
R = ρ × l / S (1)

From equation (1), the resistance value R is proportional to the length l.
Therefore, by measuring the resistance value of the resistance value measurement wiring pattern 60, the length in the extending direction of the FPC 10 can be grasped similarly to the scale 50.
Therefore, similarly to the third embodiment, by cutting the FPC 10 based on the resistance value of the resistance value measuring wiring pattern 60, the FPC 10 having a desired interval between the plurality of wiring patterns 30 is obtained. Can do. Even if the resistance value measurement wiring pattern 60 is not separately provided, the same effect as described above can be obtained by measuring the resistance value of the wiring pattern 30.

  Hereinafter, a method for manufacturing the ultrasonic probe 1 according to the fourth embodiment of the present invention will be described. The manufacturing method of the ultrasound probe 1 in the fourth embodiment is the same as that in the first embodiment except for step ST20 in which the FPC 10 is cut. Therefore, description is abbreviate | omitted about the location which overlaps.

  The FPC 10 and the backing material 100 are cut (ST20).

  The FPC 10 and the backing material 100 are cut so that the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 coincide with the arrangement positions of the plurality of ultrasonic transducers 300. When the FPC 10 is sandwiched between the backing material 100 and then cut, the backing material 100 and the FPC 10 can be easily flushed with each other on the cut surface. By being flush, the solid electrode 200 can be easily formed in step ST30.

  When cutting the FPC 10 and the backing material 100, the FPC 10 may be cut while measuring the intervals between the plurality of wiring patterns 30 on the end face of the FPC 10, but even if it is difficult to measure due to the effect of the backing material 100, the FPC 10 The resistance value of the resistance value measuring wiring pattern 60 formed in the FPC 10 along the extending direction can be measured, and the FPC 10 can be cut based on the resistance value.

  Since the resistance value is generally proportional to the length, the length of the FPC 10 can be grasped by measuring the resistance value of the resistance value measuring wiring pattern 60. Further, the length in the extending direction of the FPC 10 corresponds to the interval between the plurality of wiring patterns 30. Therefore, for example, a correspondence table between the intervals of the plurality of wiring patterns 30 and the resistance values of the resistance value measuring wiring pattern 60 is created in advance, and the resistance value measuring wiring pattern corresponding to the desired spacing between the wiring patterns 30 is created from the correspondence table. Read 60 resistance values. Then, the resistance measurement terminal is applied to both ends of the resistance value measurement wiring pattern 60, the resistance values at both ends of the resistance value measurement wiring pattern 60 are measured, and the FPC 10 is cut until the read resistance value is obtained. Thus, the FPC 10 in which the positions of the plurality of wiring patterns 30 on the end face of the FPC 10 coincide with the arrangement positions of the plurality of ultrasonic transducers 300 can be obtained.

  As described above, by using the FPC 10 according to the fourth embodiment of the present invention, the base is adjusted in accordance with the width of the ultrasonic transducer 300 in the ultrasonic probe 1 to be manufactured, as in the first embodiment. Even if the plurality of wiring patterns 30 are not formed on the film 20, the ultrasonic probe 1 can be manufactured efficiently while reducing costs.

  The ultrasonic probe 1 in the present embodiment corresponds to the ultrasonic probe of the present invention. Moreover, the flexible printed circuit board 10 of this embodiment is corresponded to the flexible printed circuit board of this invention. Moreover, the base film 20 of this embodiment is corresponded to the electrically insulating board | substrate of this invention. Further, the scale 50 of the present embodiment corresponds to the scale of the present invention. The resistance value measurement wiring pattern 60 of the present embodiment corresponds to the wiring pattern of the present invention. Further, the backing material 100 of the present embodiment corresponds to the backing material of the present invention. The ultrasonic transducer 300 of the present embodiment corresponds to the ultrasonic transducer of the present invention.

  In implementing the present invention, the present invention is not limited to the above-described embodiment, and various modifications can be employed.

In the embodiment of the present invention, the FPC 10 is used for manufacturing the ultrasonic probe 1, but is not limited to this, and the interval of the wiring pattern in the FPC requires various intervals depending on the type of component. It can also be used for manufacturing electronic devices.
In the method of manufacturing the ultrasonic probe 1 according to the embodiment of the present invention, the FPC 10 is sandwiched between the backing material 100, the FPC 10 and the backing material 100 are cut, and then the solid electrode 200 is formed on the backing material 100. Although the ultrasonic transducer 300 is laminated on 200, the present invention is not limited to this. For example, the FPC 10 is cut and the FPC 10 is directly bonded to the ultrasonic transducer 300, and the ultrasonic transducer 300 and the backing material 100 are bonded. The FPC 10 may be sandwiched between the two.
In the method of manufacturing the ultrasonic probe 1 in the embodiment of the present invention, the FPC 10 used in Step 2 is the FPC 10 in the third embodiment, but is not limited to this, and the FPC 10 in the first embodiment. The FPC 10 in the second embodiment, the FPC 10 in the third embodiment, and the like may be used.
Further, in the method of manufacturing the ultrasonic probe 1 in the embodiment of the present invention, the FPC 10 is cut after being sandwiched between the backing materials 100. However, the invention is not limited to this, and the FPC 10 is cut and then the backing material 100 is cut. It may be sandwiched.
Further, in FIG. 4A showing the FPC 10 in the third embodiment of the present invention, the interval between the plurality of wiring patterns 30 is continuously narrowed along the extending direction of the FPC 10, It is not limited and may narrow in steps.
Further, in FIG. 4B showing the FPC 10 according to the fourth embodiment of the present invention, the intervals between the plurality of wiring patterns 30 are gradually reduced along the extending direction of the FPC 10. It is not limited and may narrow continuously.
In the third and fourth embodiments of the present invention, the mark formed on the surface of the FPC 10 along the extending direction of the FPC 10 is a scale indicating the length of the FPC 10 in the extending direction. Although it is a wiring pattern for measuring the resistance value for grasping the length in the extending direction, it is not limited to this, and for example, it may be a number indicating the interval between the plurality of wiring patterns 30. .

1: Ultrasonic probe 10: Flexible printed circuit board 20: Base film (electrically insulating substrate)
30: Wiring pattern 50: Scale 60: Wiring pattern for measuring resistance value (wiring pattern)
100: backing material 200: solid electrode 300: ultrasonic transducer 400: matching layer 500: acoustic lens A: spacing of each wiring pattern B: spacing of each wiring pattern C: positions of a plurality of ultrasonic transducers and a plurality of wirings Position D corresponding to the position of the pattern: A portion where the interval between the wiring patterns does not change

Claims (16)

A flexible printed circuit board formed so that a plurality of wiring patterns extend on the surface of an electrically insulating substrate,
Each of the plurality of wiring patterns includes a portion formed such that the interval between the wiring patterns is reduced along the extending direction of the substrate,
The said board | substrate is a flexible printed circuit board which has a length means to represent the length of the said direction along the direction where the said board | substrate extends. The flexible printed circuit board according to claim 1, wherein the length means is a scale representing a length in a direction in which the substrate extends. The flexible printed circuit board according to claim 1, wherein the length means is a resistance value measurement wiring pattern in which a length in a direction in which the substrate extends is represented by a resistance value. The flexible printed circuit board according to claim 1, wherein the wiring pattern is formed so that an interval between the wiring patterns is continuously narrowed. The flexible printed circuit board according to claim 1, wherein the wiring pattern is formed so that an interval between the wiring patterns is gradually reduced. The flexible printed circuit board according to claim 1, wherein the substrate is formed so that a wiring pattern further extends. Having a backing material,
The flexible printed circuit board according to claim 1, wherein the flexible printed circuit board is formed by sandwiching the substrate with the backing material. The flexible printed circuit board according to claim 7, wherein the acoustic impedance of the backing material is 2 × 10 ⁵ g / (cm ² · sec) to 10 × 10 ⁵ g / (cm ² · sec). A plurality of ultrasonic transducers arranged;
A flexible printed circuit board on which a plurality of wiring patterns connected to the plurality of ultrasonic transducers are arranged on the surface of the electrically insulating substrate at intervals along the arrangement direction of the plurality of ultrasonic transducers; A method of manufacturing an ultrasonic probe having
A cutting step of cutting the flexible printed circuit board;
In the flexible printed circuit board used in the cutting step, the substrate extends in a direction different from the arrangement direction of the ultrasonic transducers, and intervals between the plurality of wiring patterns are along the extending direction of the substrate. Including a portion in which the plurality of wiring patterns extend so as to narrow, and has a length means for expressing the length in the direction along the direction in which the substrate extends,
In the cutting step, an ultrasonic probe manufacturing method for cutting the flexible printed circuit board so that the arrangement positions of the plurality of ultrasonic transducers correspond to the positions of the plurality of wiring patterns on the flexible printed circuit board . The method of manufacturing an ultrasonic probe according to claim 9, wherein the plurality of wiring patterns on the flexible printed circuit board are extended so that intervals are continuously reduced along a direction in which the board extends. The ultrasonic probe according to claim 9 or 10, wherein a plurality of the wiring patterns on the flexible printed circuit board extend in such a manner that intervals are gradually reduced along a direction in which the circuit board extends. Production method. The ultrasonic probe according to claim 9, wherein the flexible printed circuit board is cut based on a scale attached to the flexible printed circuit board along the flexible printed circuit board, which is the length means. Manufacturing method. The resistance value of the resistance value measurement wiring pattern formed to extend to the flexible substrate, which is the length means, is measured, and the flexible printed circuit board is cut based on the resistance value. The method for producing an ultrasonic probe according to any one of 11. Before the cutting step, the method includes a step of sandwiching the flexible printed circuit board with a backing material so as to include a plurality of wiring pattern positions corresponding to the arrangement positions of the plurality of ultrasonic transducers on the flexible printed circuit board. ,
The method of manufacturing an ultrasonic probe according to claim 9, wherein in the cutting step, the flexible printed circuit board and a backing material sandwiching the flexible printed circuit board are simultaneously cut. The method of manufacturing an ultrasonic probe according to claim 14, wherein the acoustic impedance of the backing material is 2 × 10 ⁵ g / (cm ² · sec) to 10 × 10 ⁵ g / (cm ² · sec). A plurality of ultrasonic transducers arranged;
A flexible printed circuit board on which a plurality of wiring patterns connected to the plurality of ultrasonic transducers are arranged on the surface of the electrically insulating substrate at intervals along the arrangement direction of the plurality of ultrasonic transducers; An ultrasonic probe comprising:
The flexible printed circuit board extends in a direction different from the direction in which the ultrasonic transducers are arranged, and a plurality of wiring patterns are arranged such that intervals between the plurality of wiring patterns narrow along the extending direction of the board. Including a portion in which the wiring pattern extends, and has a length means for expressing the length in the direction along the direction in which the substrate extends,
An ultrasonic probe manufactured by cutting the flexible printed circuit board so that the arrangement positions of the plurality of ultrasonic transducers correspond to the positions of the plurality of wiring patterns on the flexible printed circuit board.

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